Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals
Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals are described. Such devices and method include use of symmetrical compensation capacitances, symmetrical series capacitors, or symmetrical sizing of the elements of the stack.
1. An integrated circuit block comprising:
a first node;
a second node; and
a series arrangement of three or more field-effect transistors (FET);
wherein:
i) the three or more FETs are configured to:
a) be connected in series with a series arrangement of one or more capacitive elements to couple a combination of the one or more capacitive elements and the three or more FETs between the first node and the second node;
b) withstand a voltage greater than a voltage withstood by one FET of the three or more FETs;
c) receive a control signal to enable or disable the FETs thereby adjusting the capacitance between the two nodes, and
ii) compensation capacitive elements are coupled across at least one of the three or more FETs.
2. The integrated circuit block of claim 1 , wherein the compensation capacitive elements are coupled across at least one of the three or more FETs, the at least one of the three or more FETs being closer to either the first node or the second node than the other of the first node or the second node.
3. The integrated circuit block of claim 1 , wherein the compensation capacitive elements comprise metal-based capacitors.
4. The integrated circuit block of claim 3 , wherein the metal-based capacitors comprise Metal-Metal (MM) capacitors.
5. The integrated circuit block of claim 1 , wherein the compensation capacitive elements provide capacitance values that are symmetrical with reference to a node within the integrated circuit block.
6. A digitally tuned capacitor (DTC) comprising a plurality of the integrated circuit blocks of claim 5 , wherein the plurality of the integrated circuit blocks are configured in parallel.
7. An integrated circuit block comprising:
a first node;
a second node; and
a series arrangement of two or more field-effect transistors (FET),
wherein:
i) the two or more FETs are configured to:
a) be connected in series with a series arrangement of one or more capacitive elements to couple a combination of the one or more capacitive elements and the two or more FETs between the first node and the second node;
b) withstand a voltage greater than a voltage withstood by one FET of the two or more FETs;
ii) each of the two or more FETs has a control node configured to receive a control signal via a resistive element to enable or disable the two or more FETs, and thereby adjusting the capacitance between the first node and the second node and
iii) compensation capacitive elements are coupled across at least one of the two or more FETs.
8. The integrated circuit block of claim 7 , wherein the compensation capacitive elements are coupled across at least one of the two or more FETs, the at least one of the two or more FETs being closer to either the first node or the second node than the other of the first node or the second node.
9. The integrated circuit block of claim 7 , wherein the compensation capacitive elements comprise metal-based capacitors.
10. The integrated circuit block of claim 9 wherein the metal-based capacitors comprise Metal-Metal (MM) capacitors.
11. The integrated circuit block of claim 7 , wherein the compensation capacitive elements provide capacitance values that are symmetrical with reference to a node within the integrated circuit block.
12. A digitally tuned capacitor (DTC) comprising a plurality of the integrated circuit blocks of claim 11 , wherein the plurality of the integrated circuit blocks are configured in parallel.
13. An integrated circuit block comprising:
a first node;
a second node;
a series arrangement of one or more capacitive elements;
a series arrangement of a plurality of field-effect transistors (FET), and
a compensation capacitive element; and
wherein:
the one or more capacitive elements are in series with the plurality of FETs;
a combination of the one or more capacitive elements and the plurality of FETs is coupled between the first node and the second node;
the plurality of FETs are configured to withstand a voltage greater than a voltage withstood by one FET;
the plurality of FETs are configured to receive a control signal to enable or disable the FETs, thereby adjusting the capacitance between the two nodes, and
the compensation capacitive element is connected across one or more FETs of the plurality of FETs.
14. The integrated circuit block of claim 13 , wherein the compensation capacitor and the plurality of FETs are integrated on a same chip.
15. The integrated circuit block of claim 13 , wherein the compensation capacitive element comprises a metal-based capacitor.
16. The integrated circuit block of claim 15 , wherein the metal-based capacitor comprises a Metal-Metal (MM) capacitor.
17. The integrated circuit block of claim 15 , wherein the metal-based capacitor comprises a Metal-Insulator-Metal (MIM) capacitor.
18. The integrated circuit block of claim 17 , wherein the compensation capacitor is physically located on a side of or above the plurality of FETs on the chip.