Semiconductor device
A semiconductor device includes a semiconductor element, a die pad, an encapsulating member, and a plurality of leads. The die pad has a front surface on which the semiconductor element is mounted. The encapsulating member covers and seals the semiconductor element. The plurality of leads each have a first end connected to the semiconductor element in an inside of the encapsulating member and a second end led out from a side surface of the encapsulating member. A lower surface of a package including the semiconductor element, the die pad, and the encapsulating member is located on a back surface side of the die pad and has a convexly curved shape.
1. A semiconductor device comprising:
a semiconductor element;
a die pad having a front surface on which the semiconductor element is mounted;
an encapsulating member covering and sealing the semiconductor element;
a plurality of leads each having a first end connected to the semiconductor element in an inside of the encapsulating member and a second end led out from a side surface of the encapsulating member; and
a package including the semiconductor element, the die pad, and the encapsulating member, wherein:
a lower surface of the package includes a back surface of the die pad and at least the back surface of the die pad has a convexly curved shape,
the convexly curved shape is a shape warped convexly along a predetermined direction on the lower surface of the package, the predetermined direction being perpendicular to the side surface from which the plurality of leads are led out,
an extending direction of the plurality of leads corresponds to the predetermined direction, and
the back surface of the die pad is continuously convexly curved along a length of the die pad.
2. The semiconductor device according to claim 1 , wherein
a center of gravity of a structure including the package and the plurality of leads is shifted from a center of the package in plan view.
3. The semiconductor device according to claim 1 further comprising a control integrated circuit (IC) provided in the inside of the encapsulating member and configured to control drive of the semiconductor element.
4. The semiconductor device according to claim 1 further comprising a snubber capacitor provided in the inside of the encapsulating member and connected to the semiconductor element in parallel.
5. The semiconductor device according to claim 1 , wherein
the semiconductor element contains a wide band gap semiconductor as a material.
6. The semiconductor device according to claim 1 , wherein
the encapsulating member includes a protrusion on the lower surface of the package.
7. A semiconductor device comprising:
a semiconductor element;
a die pad having a front surface on which the semiconductor element is mounted;
an encapsulating member covering and sealing the semiconductor element;
a plurality of leads each having a first end connected to the semiconductor element in an inside of the encapsulating member and a second end led out from a side surface of the encapsulating member; and
a package including the semiconductor element, the die pad, and the encapsulating member, wherein:
a lower surface of the package includes a back surface of the die pad, and at least the encapsulating member and the back surface of the die pad have a convexly curved shape,
the convexly curved shape is a shape warped convexly along a predetermined direction on the lower surface of the package, the predetermined direction being perpendicular to the side surface from which the plurality of leads are led out,
an extending direction of the plurality of leads corresponds to the predetermined direction, and
the back surface of the die pad is continuously convexly curved along a length of the die pad.
8. A semiconductor device comprising:
a semiconductor element;
a die pad having a front surface on which the semiconductor element is mounted;
an encapsulating member covering and sealing the semiconductor element;
a plurality of leads each having a first end connected to the semiconductor element in an inside of the encapsulating member and a second end led out from a side surface of the encapsulating member; and
a package including the semiconductor element, the die pad, and the encapsulating member, wherein:
a lower surface of the package includes a back surface of the die pad and at least the back surface of the die pad has a convexly curved shape,
the convexly curved shape is a shape warped convexly along the lower surface of the package in a predetermined direction, the predetermined direction being perpendicular to the side surface from which the plurality of leads are led out,
an extending direction of the plurality of leads corresponds to the predetermined direction, and
the back surface of the die pad is continuously convexly curved along a length of the die pad.
9. A semiconductor device comprising:
a semiconductor element;
a die pad having a front surface on which the semiconductor element is mounted;
an encapsulating member covering and sealing the semiconductor element;
a plurality of leads each having a first end connected to the semiconductor element in an inside of the encapsulating member and a second end led out from a side surface of the encapsulating member; and
a package including the semiconductor element, the die pad, and the encapsulating member, wherein:
a lower surface of the package includes a back surface of the die pad, and at least the encapsulating member and the back surface of the die pad have a convexly curved shape,
the convexly curved shape is a shape warped convexly along the lower surface of the package in a predetermined direction, the predetermined direction being perpendicular to the side surface from which the plurality of leads are led out,
an extending direction of the plurality of leads corresponds to the predetermined direction, and
the back surface of the die pad is continuously convexly curved along a length of the die pad.
10. The semiconductor device according to claim 1 , wherein the plurality of leads extends from only one side surface of the package.
11. The semiconductor device according to claim 7 , wherein the plurality of leads extends from only one side surface of the package.
12. The semiconductor device according to claim 8 , wherein the plurality of leads extends from only one side surface of the package.
13. The semiconductor device according to claim 9 , wherein the plurality of leads extends from only one side surface of the package.