IP Library › Granted Patent US 11,450,706
Granted Patent B2
US 11,450,706 · App. 16/847,704 · Granted Sep 20, 2022

Structural body, imaging device and method for manufacturing the structural body

Inventors: Kosaku Saeki (Toyama, JP); Seiji Nishiwaki (Hyogo, JP); Kenji Narumi (Osaka, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
H01L27/14669G01J3/108G01J3/2823H01L27/14627
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Quick Facts
Patent No.
US 11,450,706
App. No.
16/847,704
Granted
Sep 20, 2022
Kind
B2
Abstract

A structural body includes a first dielectric layer and a second dielectric layer which is in contact with the first dielectric layer and which has a refractive index different from that of the first dielectric layer. The second dielectric layer includes at least two dielectric films different in hydrogen concentration from each other. The interface between the first dielectric layer and the second dielectric layer has periodic first irregularities.

Claims (49)

1. A structural body comprising:

a first dielectric layer; and

a second dielectric layer which is in contact with the first dielectric layer and which has a refractive index different from a refractive index of the first dielectric layer, wherein

the second dielectric layer includes at least two dielectric films different in hydrogen concentration from each other, and

an interface between the first dielectric layer and the second dielectric layer has periodic first irregularities.

2. The structural body according to claim 1 , wherein the at least two dielectric films are different in thickness from each other.

3. The structural body according to claim 1 , wherein the refractive index of the second dielectric layer is higher than the refractive index of the first dielectric layer.

4. The structural body according to claim 1 , wherein the at least two dielectric films are identical in refractive index to each other.

5. The structural body according to claim 1 , wherein each of the at least two dielectric films is a silicon nitride film.

6. The structural body according to claim 5 , wherein

the at least two dielectric films include a first silicon nitride film and a second silicon nitride film that is thinner than the first silicon nitride film, and

the second silicon nitride film has a higher Si—H bond concentration or a higher hydrogen concentration as compared to the first silicon nitride film.

7. The structural body according to claim 5 , wherein the silicon nitride film has a refractive index of 1.90 to 2.20.

8. The structural body according to claim 1 , wherein the first dielectric layer is a silicon oxide film.

9. The structural body according to claim 8 , wherein the silicon oxide film has a refractive index of 1.44 to 1.47.

10. The structural body according to claim 1 further comprising:

a third dielectric layer; and

a fourth dielectric layer in contact with the third dielectric layer, wherein

the second dielectric layer is positioned on the fourth dielectric layer,

an interface between the third dielectric layer and the fourth dielectric layer has periodic second irregularities,

the second irregularities include a second concave portion with a flat bottom and a second convex portion adjacent to the second concave portion,

no slope is present between the flat bottom of the second concave portion and a top of the second convex portion,

an interface between the fourth dielectric layer and the second dielectric layer has periodic third irregularities,

the third irregularities include a third concave portion with a partly flat bottom and a third convex portion adjacent to the third concave portion, and

a slope is present between the partly flat bottom of the third concave portion and a top of the third convex portion.

11. The structural body according to claim 1 , wherein

the first irregularities include a first concave portion and a first convex portion adjacent to the first concave portion, and

a slope is present between a bottom of the first concave portion and a top of the first convex portion.

12. A structural body comprising:

a first unit structural body; and

a second unit structural body positioned on the first unit structural body, wherein

each of the first unit structural body and the second unit structural body includes a first dielectric layer and a second dielectric layer which is in contact with the first dielectric layer, second dielectric layer having a refractive index different from a refractive index of the first dielectric layer,

the second dielectric layer includes at least two dielectric films different in hydrogen concentration from each other,

an interface between the first dielectric layer and the second dielectric layer in the first unit structural body and an interface between the first dielectric layer and the second dielectric layer in the second unit structural body each have periodic first irregularities,

an interface between the first unit structural body and the second unit structural body has periodic fourth irregularities, and

the first irregularities and the fourth irregularities have the same periodicity.

13. The structural body according to claim 12 , wherein the number of the at least two dielectric films included in the second dielectric layer in the first unit structural body is different from the number of the at least two dielectric films included in the second dielectric layer in the second unit structural body.

14. An imaging device comprising:

the structural body according to claim 1 ; and

a solid-state imaging element,

wherein the structural body is integral with the solid-state imaging element.

15. The imaging device according to claim 14 , wherein the structural body includes a light-shielding film including light-shielding sections arranged in a checker pattern or a stripe pattern.

16. The imaging device according to claim 15 , wherein the solid-state imaging element includes light-receiving sections and microlenses facing the light-receiving sections.

17. The imaging device according to claim 16 , wherein the solid-state imaging element further includes a first planarizing layer positioned between the light-receiving sections and the microlenses.

18. The imaging device according to claim 14 , further comprising a second planarizing layer positioned between the solid-state imaging element and the structural body.

19. The imaging device according to claim 14 , wherein the solid-state imaging element includes

charge accumulators,

a wiring layer on the charge accumulators, and

a photoelectric conversion film on the wiring layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2020
From: SAEKI, KOSAKU; NISHIWAKI, SEIJI; NARUMI, KENJI
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 053728/0271 →
Priority Claims (1)
JP JP2017-210429 · Oct 31, 2017 · national
Continuity (2)
Continuation PCTJP2018037379 · Oct 5, 2018
Related Publication 20200243597A1 · Jul 30, 2020