IP Library › Granted Patent US 11,268,859
Granted Patent B2
US 11,268,859 · App. 16/850,187 · Granted Mar 8, 2022

Wearable infrared temperature sensing device

Inventors: Chih-Ming Sun (Hsin-Chu, TW); Ming-Han Tsai (Hsin-Chu, TW); Cheng-Nan Tsai (Hsin-Chu, TW)
Assignee: PIXART IMAGING INC.
G01J5/0265B81B7/0064B81B7/0067G01J5/041G01J5/045G01J5/06H04N5/2257H04N5/33B81B2201/0278
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Quick Facts
Patent No.
US 11,268,859
App. No.
16/850,187
Granted
Mar 8, 2022
Kind
B2
Abstract

A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

Claims (17)

1. A wearable device, comprising:

a case having a first opening; and

a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:

an assembly structure;

a sensor chip which is disposed on the assembly structure; and

a metal shielding structure which is disposed on the assembly structure and surrounds the sensor chip, wherein the metal shielding structure has a second opening.

2. The wearable device as claimed in claim 1 , wherein the far infrared temperature sensing device further comprises:

a circuit substrate disposed in the case; and

a waterproof structure disposed in the first opening of the case;

wherein the waterproof structure is used to enclose the case.

3. The wearable device as claimed in claim 1 , wherein the sensor chip is electrically connected to the assembly structure by at least one wire.

4. The wearable device as claimed in claim 2 , wherein the waterproof structure is an infrared passing structure.

5. The wearable device as claimed in claim 1 , wherein the assembly structure is disposed on the circuit substrate.

6. The wearable device as claimed in claim 1 , wherein the sensor chip is configured to detect a far infrared which has a wavelength ranging from 15 to 1000 μm.

7. The wearable device as claimed in claim 1 , wherein the metal shielding structure is configured to block the noise generated from other sensors and external electronic products, and prevent other far infrared from passing into the case.

8. The wearable device as claimed in claim 1 , wherein the case is a watch case of a smartwatch, the assembly structure is a SMD substrate or a CLCC substrate, and the sensor chip is a far infrared sensor chip.

9. The wearable device as claimed in claim 2 , wherein the circuit substrate is a PCB and the waterproof structure is a waterproof glue or a waterproof layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2020
From: SUN, CHIH-MING; TSAI, MING-HAN; TSAI, CHENG-NAN
To: PIXART IMAGING INC.
Reel/Frame 052414/0861 →
Priority Claims (2)
TW 104108897 · Mar 20, 2015 · national
TW 105108127 · Mar 16, 2016 · national
Continuity (4)
Continuation 16194212 · Nov 16, 2018
Continuation 15172983 · Jun 3, 2016
Continuation In Part 14726472 · May 30, 2015
Related Publication 20200240846A1 · Jul 30, 2020