2D and 3D inductors fabricating photoactive substrates
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
1. A method to fabricate an inductive device created in or on photo-definable glass comprising the steps of:
preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide;
masking a design layout comprising one or more structures to form one or more electrical conduction paths on the photosensitive glass substrate, wherein the one or more structures comprise one or more curved portions;
exposing at least one portion of the photosensitive glass substrate to an activating energy source;
exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature;
cooling the photosensitive glass substrate to transform at least part of the exposed photosensitive glass substrate to a ceramic phase to form a glass-ceramic material;
etching the glass-ceramic material with an etchant solution to form the one or more structures in the device;
coating the one or more structures with one or more metals;
coating all or part of the one or more metal-filled structures with a dielectric media;
removing all or part of the dielectric media to provide electrical contacts; and
wherein the metal is configured to be connected to a circuitry through a surface or buried contact; and
wherein the inductive device has a magnetic permeability greater than or equal to copper for frequencies greater than 100 MHz.
2. The method of claim 1 , wherein the inductive device stores current and functions as a current storage device.
3. The method of claim 1 , wherein the one or more metals are designed to operate as an inductor at selected frequencies.
4. The method of claim 1 , further comprising etching the glass-ceramic material from one side or both sides of the glass-ceramic material to partially or fully remove the glass-ceramic material.
5. The method of claim 1 , further comprising the step of converting at least a portion of the glass into ceramic and etching away the ceramic to at least partially expose the one or more metal-filled structures or to fully expose the one or more metal-filled structures.