IP Library › Granted Patent US 11,307,480
Granted Patent B2
US 11,307,480 · App. 16/851,440 · Granted Apr 19, 2022

Optical semiconductor device

Inventor: Takasi Simoyama (Zama, JP)
Assignees: FUJITSU LIMITED; PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
G02F1/2257G02B6/14G02B2006/12152
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Quick Facts
Patent No.
US 11,307,480
App. No.
16/851,440
Granted
Apr 19, 2022
Kind
B2
Abstract

An optical semiconductor device including an optical waveguide; a light absorbing region coupled to the optical waveguide; a first conductive region and a second conductive region disposed at both sides of the light absorbing region so as to sandwich the light absorbing region; and a conductor coupled to the first conductive region and the second conductive region to let the first conductive region and the second conductive region short-circuit. With this configuration, the optical semiconductor device provides effects that absorption saturation is less likely to occur even if the light intensity increases, so that reflection return light can be reliably suppressed without using an external power source.

Claims (42)

1. An optical semiconductor device comprising:

an optical waveguide formed of a first semiconductor layer having a bandgap larger than a photon energy of light propagating through the optical waveguide;

a light absorbing region coupled to the optical waveguide, formed of a second semiconductor layer disposed over only the first semiconductor layer, and having a bandgap smaller than the photon energy of the light to be used;

a first conductive region and a second conductive region disposed at both sides of the light absorbing region so as to sandwich the light absorbing region; and

a conductor coupled to the first conductive region and the second conductive region to let the first conductive region and the second conductive region short-circuit,

wherein the light is propagated from the first semiconductor layer to the second semiconductor layer by evanescent coupling.

2. The optical semiconductor device according to claim 1 , wherein:

at least a first part of the conductor coupled to the first conductive region and a second part of the conductor coupled to the second conductive region have a same potential; and

an electric field is applied to the light absorbing region.

3. The optical semiconductor device according to claim 1 , wherein:

the light absorbing region, the first conductive region, the second conductive region, and the conductor collectively serve as an optical terminator.

4. The optical semiconductor device according to claim 1 , wherein the conductor is made of metal.

5. The optical semiconductor device according to claim 1 , wherein:

the first conductive region is a p-type semiconductor region in which a p-type impurity is doped;

the light absorbing region is a non-conductive intrinsic semiconductor region;

the second conductive region is an n-type semiconductor region in which an n-type impurity is doped; and

the optical semiconductor device has an PIN diode structure.

6. The optical semiconductor device according to claim 1 , wherein:

the light absorbing region is an intrinsic semiconductor region of the second semiconductor layer;

the first conductive region is formed of a p-type semiconductor region of the first semiconductor layer in which region a p-type impurity is doped; and

the second conductive region is formed of an n-type semiconductor region of the first semiconductor layer in which region an n-type impurity is doped.

7. The optical semiconductor device according to claim 6 , wherein:

the first conductive region and the second conductive region are disposed at both horizontal sides of the light absorbing region so as to sandwich the light absorbing region.

8. The optical semiconductor device according to claim 6 , wherein:

the first conductive region and the second conductive region are disposed at both vertical sides of the light absorbing region so as to sandwich the light absorbing region.

9. The optical semiconductor device according to claim 6 , wherein: the p-type semiconductor region includes, at a region coupled to the conductor, a high impurity content region having a higher impurity content than that of a remaining region.

10. The optical semiconductor device according to claim 6 , wherein: the n-type semiconductor region includes, at a region coupled to the conductor, a high impurity content region having a higher impurity content than that of a remaining region.

11. The optical semiconductor device according to claim 1 , wherein:

the light absorbing region is an intrinsic semiconductor region of the second semiconductor layer;

the first conductive region is a p-type semiconductor region of the second semiconductor layer in which region a p-type impurity is doped; and

the second conductive region is an n-type semiconductor region of the second semiconductor layer in which region an n-type impurity is doped.

12. The optical semiconductor device according to claim 1 , wherein:

the light absorbing region is an intrinsic semiconductor region of the second semiconductor layer;

the first conductive region is a p-type semiconductor region of the first semiconductor layer in which region a p-type impurity is doped; and

the second conductive region is an n-type semiconductor region of the second semiconductor layer in which region an n-type impurity is doped.

13. The optical semiconductor device according to claim 1 , wherein:

the first semiconductor layer is made of Si; and

the second semiconductor layer is made of Si(x)Ge(1−x) (where, 0≤x<1).

14. The optical semiconductor device according to claim 1 , wherein:

the first semiconductor layer is made of Si; and

the second semiconductor layer is made of Ge(1−x)Sn(x) (where, 0≤x<1).

15. The optical semiconductor device according to claim 1 , wherein: the optical waveguide has a tapered structure in which a width of the tapered waveguide varies at a light incident region to the light absorbing region.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: FUJITSU LIMITED; PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
To: FUJITSU OPTICAL COMPONENTS LIMITED
Reel/Frame 060805/0030 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2020
From: SIMOYAMA, TAKASI
To: FUJITSU LIMITED; PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
Reel/Frame 052437/0252 →
Priority Claims (1)
JP JP2019-093396 · May 17, 2019 · national
Continuity (1)
Related Publication 20200363695A1 · Nov 19, 2020