Antenna systems and devices and methods of manufacture thereof
View Patent ↗Embodiments of the present disclosure provide methods, apparatuses, devices and systems related to the implementation of a multi-layer printed circuit board (PCB) radio-frequency antenna featuring, a printed radiating element coupled to an absorbing element embedded in the PCB. The embedded element is configured within the PCB layers to prevent out-of-phase reflections to the bore-sight direction.
1. A medical device radio-frequency (RF) antenna structure comprising:
a printed circuit board (PCB) comprising a plurality of layers;
at least one RF antenna comprising a radiating element and a metallic reflector backing the radiating element;
an embedded absorbing material disposed within one or more layers internal to the PCB and arranged between the radiating element and the metallic reflector,
and
an electronic circuit disposed on the PCB,
wherein:
the electronic circuit is in electrical communication with the at least one RF antenna through one or more of a via and a transmission line in a layer of the PCB;
the at least one RF antenna disposed within at least one external layer of the PCB; and
the absorbing material is configured to absorb back-lobe radiation from the radiating element.
2. The structure of claim 1 , wherein the embedded absorbing material comprises an embedded magnetic material within the PCB.
3. The structure of claim 1 , further comprising a conductive structure configured to substantially surround the embedded absorbing material.
4. The structure of claim 3 , wherein the conductive structure comprises a row of conductive vias connected to a conductive layer.
5. The structure of claim 1 , wherein the electrical circuit comprises RF front-end circuitry.
6. The structure of claim 1 , wherein the electrical circuit comprises an RF transceiver.
7. The structure of claim 1 , wherein the distance between the radiating element and the metallic reflector is configured to be less than a fourth of the distance of the wavelength of a received RF signal.
8. The structure of claim 1 , further comprising one or more openings configured to release gas pressure during a lamination process in producing the PCB.
9. The structure of claim 8 , wherein the one or more openings comprise vias, channels and/or slots.
10. The structure of claim 9 , wherein the vias comprises at least one of through-hole vias, and blind vias.
11. The structure of claim 8 , wherein the one or more openings are filled with a material after gas release.
12. A medical device radio-frequency (RF) antenna structure comprising:
a printed circuit board (PCB) comprising a plurality of layers;
a transmitting RF antenna comprising a radiating element and a metallic reflector backing the radiating element;
a receiving RF antenna;
an embedded absorbing material disposed within at least one internal layer of the PCB and arranged between the radiating element and the metallic reflector,
and
an electronic circuit disposed on the PCB,
wherein:
the transmitting RF antenna and the receiving RF antenna are disposed within at least one external layer of the PCB,
the absorbing material is configured to absorb back-lobe radiation from the radiating element, and
the electronic circuit is in electrical communication with the receiving RF antenna and transmitting RF antennas through one or more of a via and a transmission line in a layer of the PCB.
13. The structure of claim 12 , wherein the embedded absorbing material comprises an embedded magnetic material within the PCB.
14. The structure of claim 12 , wherein at least one of the transmitting antenna and the receiving antenna comprise a wideband directional antenna.
15. The structure of claim 12 , wherein the embedded absorbing material comprises a heat resistant absorbing material.
16. The structure of claim 12 , further comprising a conductive structure configured to substantially surround the embedded absorbing material.
17. The structure of claim 16 , wherein the conductive structure comprises a row of conductive vias connected to a conductive layer.
18. The structure of claim 12 , wherein at least one of the layers comprises at least one of ceramic, high temperature polymer impregnated with an RF absorbing material, and ferrite.
19. The structure of claim 12 , wherein the electrical circuit comprises impedance matching circuitry.
20. The structure of claim 12 , wherein the electrical circuit comprises RF front-end circuitry.
21. The structure of claim 12 , wherein the electrical circuit comprises an RF transceiver.