THERMAL CONTROL FOR ELECTRONIC DEVICES

1 . A method for temperature control, the method comprising:

sensing a first temperature of an electronic device;

determining that the first temperature exceeds a first threshold; and

increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device,

wherein the increasing of the power comprises increasing the power in response to determining that the first temperature exceeds the first threshold.

2 . The method of claim 1 , wherein:

the power supplied to the thermoelectric cooler is an average power supplied to the thermoelectric cooler; and

the increasing of the power comprises modifying a duty cycle of a pulse-width-modulated drive current applied to the thermoelectric cooler.

3 . The method of claim 1 , further comprising sensing a second temperature of the electronic device.

4 . The method of claim 3 , further comprising:

determining that the second temperature is equal to or less than the first threshold;

determining that the second temperature is within a tolerance temperature range; and

decreasing the power supplied to the thermoelectric cooler.

5 . The method of claim 3 , further comprising:

determining that the second temperature is equal to or less than the first threshold;

determining that the second temperature is outside a tolerance temperature range; and

decreasing the power supplied to the thermoelectric cooler to a power level at most approximately equal to a first power level.

6 . The method of claim 5 , further comprising sensing a third temperature of the electronic device.

7 . The method of claim 6 , further comprising:

determining that the third temperature is within the tolerance temperature range; and

sensing a fourth temperature of the electronic device.

8 . The method of claim 3 , further comprising:

determining that the second temperature exceeds the first threshold;

determining that:

the power supplied to the thermoelectric cooler is at a drive limit, or a third temperature is less than a second threshold; and

limiting an activity rate of the electronic device,

wherein the second threshold is based on a first humidity.

9 . The method of claim 8 , further comprising:

sensing the first humidity; and

determining a dew point based on the first humidity,

wherein the second threshold is based on the dew point.

10 . The method of claim 8 , wherein the third temperature is the second temperature.

11 . The method of claim 8 , further comprising sensing the third temperature, wherein:

the sensing of the second temperature comprises sensing the second temperature with a first temperature sensor; and

the sensing of the third temperature comprises sensing the third temperature with a second temperature sensor different from the first temperature sensor.

12 . The method of claim 1 , wherein the electronic device is a central processing unit.

13 . The method of claim 1 , wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a controller of a solid state drive.

14 . The method of claim 1 , wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a memory component of a solid state drive.

15 . A system, comprising:

a processing circuit;

a memory; and

a first thermoelectric cooler,

the memory storing instructions that, when executed by the processing circuit, cause the processing circuit to:

cause a temperature sensor to sense a first temperature of a first solid state drive;

determine that the first temperature exceeds a first threshold; and

cause a first drive circuit to increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.

16 . The system of claim 15 , wherein the system comprises a first rack comprising:

the first solid state drive; and

a second solid state drive, different from the first solid state drive,

wherein the instructions further cause the processing circuit to cause a second drive circuit to increase a power supplied to a second thermoelectric cooler thermally connected to the second solid state drive.

17 . The system of claim 16 , wherein the system further comprises a second rack comprising:

a third solid state drive,

wherein the instructions further cause the processing circuit to cause a third drive circuit to maintain a power supplied to a third thermoelectric cooler thermally connected to the third solid state drive.

18 . The system of claim 15 , wherein the instructions further cause the processing circuit to cause the temperature sensor to sense a second temperature of the first solid state drive.

19 . The system of claim 18 , wherein the instructions further cause the processing circuit to:

determine that the second temperature is equal to or less than the first threshold;

determine that the second temperature is within a tolerance temperature range; and

the first drive circuit to decrease the power supplied to the first thermoelectric cooler.

20 . A system, comprising:

means for processing;

a memory; and

a first thermoelectric cooler,

memory storing instructions that, when executed by the means for processing, cause the means for processing to:

sense a first temperature of a first solid state drive;

determine that the first temperature exceeds a first threshold; and

increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.