Systems and methods for signal communication with scalable, modular network nodes
A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.
1. A radio frequency (RF) device comprising:
an interface board having a front side and a back side;
an RF aperture including an array of faceted electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board; and
RF circuitry disposed at the back side of the interface board and electrically connected with aperture pixels comprising differential RF receive and/or transmit elements defined by neighboring facets of neighboring pairs of faceted electrically conductive tapered projections;
wherein the RF circuitry includes perpendicular printed circuit boards (PCBs) with ground planes oriented perpendicularly to the interface board and RF components mounted on the perpendicular PCBs, and
wherein the interface board is a dielectric board or PCB without a ground plane.
2. The RF device of claim 1 wherein edges of the perpendicular PCBs are secured to the interface board and the RF device further comprises:
a second support board oriented parallel with the interface board, wherein the perpendicular PCBs are disposed between the interface board and the second support board and edges of the perpendicular PCBs distal from the interface board are secured to the second support board.
3. The RF device of claim 1 wherein the perpendicular PCBs include a first set of perpendicular PCBs that are mutually parallel.
4. The RF device of claim 3 wherein the perpendicular PCBs further include second set of perpendicular PCBs that are mutually parallel, wherein the perpendicular PCBs of the second set of perpendicular PCBs are perpendicular to the perpendicular PCBs of the first set of perpendicular PCBs.
5. The RF device of claim 4 wherein the perpendicular PCBs of the first and second sets of perpendicular PCBs include cutouts via which the first and second sets of perpendicular PCBs mate together to form a two-dimensional grid of perpendicular PCBs all of which are perpendicular to the interface board.
6. The RF device of claim 1 further comprising:
a five-sided housing or enclosure;
wherein the interface board is one side of the five-sided housing or enclosure, and edges of the perpendicular PCBs are secured inside the five-sided housing.
7. The RF device of claim 6 further comprising:
a rear support or cover disposed on a backside of the five-sided housing or enclosure; and
a radome disposed over the array of faceted electrically conductive tapered projections.
8. The RF device of claim 1 wherein the RF circuitry includes one or more signal chains each comprising:
a receive signal chain;
a transmit signal chain;
a switch, duplexer, or circulator coupled to the receive signal chain and to the transmit signal chain; and
one or more baluns coupling the switch, duplexer, or circulator to one or more aperture pixels.
9. The RF device of claim 8 wherein:
the receive signal chain includes a low noise amplifier; and
the transmit signal chain includes a power amplifier.
10. The RF device of claim 8 wherein the one or more signal chains include:
row signal chains driving rows of aperture pixels; and
column signal chains driving columns of aperture pixels.
11. The RF device of claim 1 wherein the RF circuitry includes one or more differential signal chains each comprising:
a differential receive signal chain;
a differential transmit signal chain; and
a switch, duplexer, or circulator coupled to the receive signal chain and to the transmit signal chain;
wherein the switch, duplexer, or circulator is coupled to one or more aperture pixels without an intervening balun.
12. The RF device of claim 11 wherein:
the differential receive signal chain includes a low noise amplifier; and
the differential transmit signal chain includes a power amplifier.
13. The RF device of claim 11 wherein the one or more differential signal chains include:
row differential signal chains driving rows of aperture pixels; and
column differential signal chains driving columns of aperture pixels.
14. A radio frequency (RF) device comprising:
an interface board having a front side and a back side, the interface board being a dielectric board or a printed circuit board (PCB) without a ground plane;
an RF aperture including an array of electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board; and
RF circuitry disposed at the back side of the interface board and electrically connected with aperture pixels comprising differential RF receive and/or transmit elements defined by neighboring pairs of the electrically conductive tapered projections, wherein the RF circuitry comprises:
perpendicular PCBs with ground planes oriented perpendicularly to the interface board, and
RF components mounted on the perpendicular PCBs.
15. The RF device of claim 14 wherein the perpendicular PCBs include a first set of perpendicular PCBs that are mutually parallel.
16. The RF device of claim 15 wherein the perpendicular PCBs further include second set of perpendicular PCBs that are mutually parallel, wherein the perpendicular PCBs of the second set of perpendicular PCBs are perpendicular to the perpendicular PCBs of the first set of perpendicular PCBs.
17. The RF device of claim 16 wherein the perpendicular PCBs of the first and second sets of perpendicular PCBs include cutouts via which the first and second sets of perpendicular PCBs mate together to form a two-dimensional grid of perpendicular PCBs all of which are perpendicular to the interface board.
18. The RF device of claim 14 further comprising:
a five-sided housing or enclosure;
wherein the interface board is one side of the five-sided housing or enclosure, and edges of the perpendicular PCBs are secured inside the five-sided housing.
19. The RF device of claim 18 further comprising:
a rear support or cover disposed on a backside of the five-sided enclosure or housing; and
a radome disposed over the array of electrically conductive tapered projections.
20. A radio frequency (RF) device comprising:
an interface board having a front side and a back side, the interface board being a dielectric board or a printed circuit board (PCB) without a ground plane;
an RF aperture including an array of electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board;
RF circuitry disposed at the back side of the interface board and electrically connected with aperture pixels comprising differential RF receive and/or transmit elements defined by neighboring pairs of the electrically conductive tapered projections, wherein the RF circuitry comprises:
perpendicular PCBs with ground planes oriented perpendicularly to the interface board wherein edges of the perpendicular PCBs are secured to the interface board; and
RF components mounted on the perpendicular PCBs; and
a second support board oriented parallel with the interface board, wherein the perpendicular PCBs are disposed between the interface board and the second support board and edges of the perpendicular PCBs distal from the interface board are secured to the second support board.