Thermal control for processor-based devices
The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
1. A two-part, separable, heat sink system, comprising:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to a thermally emissive device coupled to a substrate, the first heat sink including a plurality of fins;
a second heat sink having a third surface and a fourth surface, the third surface opposite the fourth surface; and
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member to be disposed betweeen the plurality of fins and the second heat sink, the thermal interface member to be on an opposite of the first heat sink as the substrate.
2. The two-part, separable, heat sink system of claim 1 , wherein the plurality of fins is a first plurality of parallel fins to provide a first heat transfer area; and wherein the second heat sink inludes a second plurality of parallel fins to provide a second heat transnfer area.
3. The two-part, separable, heat sink system of claim 2 , wherein the first heat transfer area is less than the second heat transfer area.
4. The two-part heat sink system of claim 2 , wherein the first plurality of parallel fins are to be disposed parallel to the second plurality of parallel fins.
5. The two-part, separable, heat sink system of claim 2 , wherein the first plurality of parallel fins are to be disposed perpendicular to the second plurality of parallel fins.
6. The two-part, separable, heat sink system of claim 1 , further including at least one attachment feature to facilitate detachable coupling of the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes at least one spring and shoulder threaded fastener.
7. The two-part, separable, heat sink system of claim 1 , further including at least one attachment feature to facilitate detachable coupling of the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes at least one spring clip.
8. The two-part, separable, heat sink system of claim 1 , wherein the thermal interface member comprises a member having a member having a thermal conductivity greater than 200 Watts/meter-Kelvin (W/m-K).
9. The two-part, separable, heat sink system of claim 1 , further including a controller including:
an input/output interface; and
control circuitry to:
receive, from at least one sensor, data representative of a thermal output of at least one thermally emissive device;
receive, via the input/output interface, data representative of a future expected computational load on the at least one thermally emissive device; and
adjust, using a variable output fluid mover, a turbulent coolant flow rate through an enclosed chamber thermally coupled to the at least one thermally emissive device based at least in part on the received data representative of a thermal output of the at least one thermally emissive device and the received data representative of a future expected computational load on the at least one thermally emissive device.
10. A two-part, separable, heat sink system comprising:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to a thermally emissive device coupled to a substrate;
a second heat sink having a third surface and a fourth surface, the third surface opposite the fourth surface;
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member to be disposed between the first surface and the fourth surface, the thermal interface member to be on an opposite side of the first heat sink as the substrate; and
at least one attachment feature, the at least one attachment feature to detachably physically couple the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes:
a clamp member having a central member, a first end, and a second end opposite the first end;
a first coupling fixture to be disposed proximate the first end of the clamp member, the first coupling fixture to phisically couple to a first location on the first heat sink; and
a second coupling fixture to be disposed proximate the second end of the clamp member, the second coupling fixture to physically couple to a second location on the first heat sink;
wherein the central member is to extend transversely across at least a portion of the second heat sink.
11. The two-part, separable, heat sink system of claim 10 , wherein the first coupling fixture includes a first threaded fastener; and
wherein the second coupling fixture includes a second threaded fastener.
12. An electronic device, comprising:
a substrate;
processor circuitry coupled to the substrate;
a two-part, separable, heat sink system including:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to the processor circuitry with the first surface facing away from the processor circuitry, the first heat sink inluding a plurality of fins;
a second heat sink, the first heat sink to be disposed between the processor circuitry and the second heat sink; and
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member disposed between the plurality of fins and the second heat sink.
13. The electronic device of claim 12 , wherein the plurality of fins is a first plurality of parallel fins to provide a first heat transfer area; and
wherein the second heat sink include a sedond plurality of parallel fins to provide a second heat transfer area.
14. The electronic device of claim 13 , wherein the first heat transfer area is less than the second heat transfer area.
15. The electronic device of claim 13 , wherein the first heat sink physically couples to the second heat sink such that the first plurality of paralle fins are disposed parallel to the second plurality of parallel fins.
16. The electronic device of claim 13 , wherein the first heat sink physically couples to the second heat sink such that the first plurality of paralle fins are disposed perpendicular to the second plurality of parallel fins.
17. The electronic device of claim 12 , further including at least one attachment feature, the at least one attachment feature to detachably physically couple the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes at least one spring and shoulder threaded fastener.
18. The electronic device of claim 12 , further including at least one attachment feature, the at least one attachment feature to detachably physically couple the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes at least one spring clip.
19. The electronic device of claim 12 , wherein the thermal interface member includes a member having a thermal conductivity greater than 200 Watts/meter-Kelvin (W/m-K).
20. An electronic device comprising:
a substrate;
processor circuitry coupled to the substrate;
a two-part, separable, heat sink system including:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally couplable to the processor circuitry with the first surface facing away from the processor circuitry;
a second heat sink, the first heat sink to be displsed between the processor circuitry and the second heat sink;
a thermal interface member to thermally couple the first heat sink to the second heat sink, the thermal interface member disposed proximate the first heat sink and the second heat sink; and
at least one attachment feature, the at least one attachment feature to detachably physically couple the thermal interface member between the first heat sink and the second heat sink, wherein the at least one attachment feature includes:
a clamp member having a central member, a first end, and a second end disposed at an end of the central member opposite the first end;
a first coupling fixture disposed proximate the first end of the clamp member, the first coupling fixture to physically couple to a first location on the first heat sink; and
a second coupling fixture disposed proximate the second end of the clamp member, the second coupling fixture to physically couple to a second location on the first heat sink;
wherein the central member extends thransversely across at least a portion of the second heat sink.
21. The electronic device of claim 20 , wherein the first coupling fixture includes a threaded fastener; and
wherein the second coupling fixture includes a threaded fastener.
22. A semiconductor package cooling method, comprising:
thermally coupling a two-part, separable, heat sink system, to a thermally emissive device coupled to a substrate, wherein the two-part, separable, heat sink system includes:
a first heat sink having a first surface and a second surface, the first surface opposite the second surface, the second surface of the first heat sink thermally coupleable to a thermally emissive device coupled to a substrate, the first heat sink including a plurality of fins;
a second heat sink having a third surface and a fourth surface, the third surface opposite the fourth surface; and
a thermal interface member to thermally couple the first heat sink to the second heat sink, ther thermal interface member to be disposed between the plurality of fins and the second heat sink, the thermal interface member to be on an opposite side of the first heat sink as the substrate.