Crack identification in IC chip package using encapsulated liquid penetrant contrast agent
A packaging fill material for electrical packaging includes a base material, and a plurality of frangible capsules distributed in the base material. Each frangible capsule includes a liquid penetrant contrast agent therein having a different radiopacity than the base material. In response to a crack forming in the packaging fill material, at least one of the plurality of frangible capsules opens, releasing the liquid penetrant contrast agent into the crack. Cracks can be more readily identified in an IC package including the packaging fill material. The liquid penetrant contrast agent may have a radiopacity that is higher than the base material. Inspection can be carried out using electromagnetic analysis using visual inspection or digital analysis of the results to more easily identify cracks.
1. An integrated circuit (IC) chip package, comprising:
a substrate;
a first IC chip over the substrate;
a plurality of electrical connections beneath the first IC chip, wherein the plurality of electrical connections electrically couples the first IC chip to a first plurality of wires within the substrate; and
a packaging fill material between the substrate and the first IC chip, the packaging fill material surrounding the electrical connections, and the packaging fill material including a base material having a plurality of frangible capsules distributed therein, each frangible capsule having a liquid penetrant contrast agent therein having a radiopacity greater than 10,000 on the Hounsfield scale that includes at least one of: iodine, iron, barium, cerium, zirconium and their compounds, and silver nitrate.
2. The IC chip package of claim 1 , wherein in response to a crack forming in the packaging fill material, at least one of the plurality of frangible capsules is structured to open and release the liquid penetrant contrast agent into the crack.
3. The IC chip package of claim 1 , wherein the packaging fill material further includes a plurality of beads or particles of at least one of silica, alumina, and glass, distributed in the base material.
4. The IC chip package of claim 1 , wherein the base material includes a plastic surrounding the plurality of frangible capsules.
5. The IC chip package of claim 1 , wherein each frangible capsule includes a hollow glass or polymer sphere.
6. The IC chip package of claim 1 , wherein each frangible capsule has a diameter less than about 10 microns.
7. The IC chip package of claim 6 , wherein the diameter of each frangible capsule is about 5 microns.
8. The IC chip package of claim 1 , wherein the plurality of frangible capsules are about 5% to about 20% by weight of the packaging fill material.
9. The IC chip package of claim 8 , wherein the plurality of frangible capsules are about 10% by weight of the packaging fill material.
10. The IC chip package of claim 1 , wherein each frangible capsule has a diameter about 1% to about 20% of a distance between the first IC chip and the substrate.
11. The IC chip package of claim 1 , further comprising a second IC chip over the first IC chip, wherein a second plurality of electrical connections electrically couples the second IC chip and the first IC chip.
12. A packaging fill material for electrical packaging, the packaging fill material comprising:
a base material; and
a plurality of frangible capsules distributed in the base material, each frangible capsule including a liquid penetrant contrast agent therein having a radiopacity greater than 10,000 on the Hounsfield scale that includes at least one of: cerium, and its compounds, and silver nitrate.
13. The packaging fill material of claim 12 , further comprising a plurality of beads or particles of at least one of silica, alumina, and glass, distributed in the base material.
14. The packaging fill material of claim 12 , wherein the base material includes an epoxy.