Semiconductor device
A semiconductor device includes a semiconductor layer made of a wide bandgap semiconductor and including a gate trench; a gate insulating film formed on the gate trench; and a gate electrode embedded in the gate trench to be opposed to the semiconductor layer through the gate insulating film. The semiconductor layer includes a first conductivity type source region; a second conductivity type body region; a first conductivity type drift region; a second conductivity type first breakdown voltage holding region; a source trench passing through the first conductivity type source region and the second conductivity type body region from the front surface and reaching a drain region; and a second conductivity type second breakdown voltage region selectively formed on an edge portion of the source trench where the sidewall and the bottom wall thereof intersect with each other in a parallel region of the source trench.
1. A semiconductor device, comprising:
a semiconductor layer made of a wide bandgap semiconductor having a gate trench provided with a sidewall and a bottom wall;
a gate insulating film formed on the sidewall and the bottom wall of the gate trench;
a gate electrode embedded in the gate trench to be opposed to the semiconductor layer through the gate insulating film;
a source region of a first conductivity type formed to be exposed on a side of a front surface of the semiconductor layer for partially forming the sidewall of the gate trench;
a body region of a second conductivity type formed on a side closer to a rear surface of the semiconductor layer than the source region such that the body region is in contact with the source region for partially forming the sidewall of the gate trench;
a drift region of the first conductivity type formed on a side closer to the rear surface of the semiconductor layer than the body region such that the drift region is in contact with the body region for forming the bottom wall of the gate trench;
a body contact region of the second conductivity type formed at a center portion of the source region in a plan view such that the body contact region penetrates the body region and reaches the drift region; and
a breakdown voltage holding region of the second conductivity type, the breakdown voltage holding region including a first portion selectively formed under the gate trench in a partial region of the gate trench and a second portion formed under an edge portion of the gate trench where the sidewall and the bottom wall intersect with each other, wherein an impurity concentration in the first portion of the breakdown voltage holding region is higher than an impurity concentration in the second portion of the breakdown voltage holding region.
2. The semiconductor device according to claim 1 , wherein the gate insulating film includes a first portion covering a part of an upper surface of the source region.
3. The semiconductor device according to claim 2 , further comprising an interlayer insulating film covering the gate electrode and the first portion of the gate insulating film.
4. The semiconductor device according to claim 3 , wherein an end surface of the interlayer insulating film is flush with an end surface of the first portion of the gate insulating film.
5. The semiconductor device according to claim 1 , wherein the gate trench is formed in a latticed manner.
6. The semiconductor device according to claim 1 , further comprising a gate pad formed on a periphery of the semiconductor layer and electrically connected to the gate electrode.
7. The semiconductor device according to claim 1 , wherein the semiconductor layer includes an SiC layer.
8. The semiconductor device according to claim 1 , wherein the first portion of the breakdown voltage holding region has a width narrower than a width of the gate trench.
9. The semiconductor device according to claim 1 , wherein a thickness of the first portion of the breakdown voltage holding region is smaller than a thickness of the second portion of the breakdown voltage holding region.
10. The semiconductor device according to claim 1 , wherein
a portion of the gate insulating film on the bottom wall of the gate trench is thicker than a portion of the gate insulating film on the sidewall of the gate trench.
11. The semiconductor device according to claim 1 , wherein the semiconductor layer includes an SiC layer having the front surface which is a C plane.
12. The semiconductor device according to claim 1 , wherein an impurity concentration in the second portion of the breakdown voltage holding region is higher than an impurity concentration in the drift region.
13. The semiconductor device according to claim 1 , wherein the second portion of the breakdown voltage holding region is formed to reach a portion of the body region immediately above the edge portion of the gate trench.
14. The semiconductor device according to claim 1 , wherein
the gate trench is formed in a latticed manner, and
the second portion of the breakdown voltage holding region is selectively formed on an intersection portion of the latticed gate trench.