IP Library › Granted Patent US 11,527,687
Granted Patent B2
US 11,527,687 · App. 16/869,719 · Granted Dec 13, 2022

Display module and method for molding display module

Inventors: Taehyeun Ha (Suwon-si, KR); Jaehoo Park (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L33/54B29C45/14065B29C45/1671H01L25/0753B29K2995/0026B29L2031/3475H01L2933/005
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Quick Facts
Patent No.
US 11,527,687
App. No.
16/869,719
Granted
Dec 13, 2022
Kind
B2
Abstract

A method for molding a display module includes forming a cavity using a die plate of a first die and a plurality of side surface dies; filling the cavity with a coating material; fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs; soaking the display module in the coating material filled in the cavity; curing the coating material; and separating the cured coating material of the display module from the die plate.

Claims (37)

1. A method for molding a display module, the method comprising:

forming a cavity using a die plate of a first die and a plurality of side surface dies;

filling the cavity with a coating material;

fixing the display module to a second die using a coupling body disposed on a second surface of the display module, opposite of a first surface of the display module disposed with a plurality of LEDs;

soaking the display module in the coating material filled in the cavity;

curing the coating material; and

separating the cured coating material of the display module from the die plate.

2. The method of claim 1 , further comprising:

cooling the coating material after curing the coating material.

3. The method of claim 1 , wherein the forming the cavity comprises moving the plurality of side surface dies to contact the die plate.

4. The method of claim 1 , wherein the filling the cavity with the coating material comprises injecting the coating material such that a height of the coating material is greater than a height of the plurality of LEDs disposed on the first surface.

5. The method of claim 1 , wherein the separating the cured coating material from the die plate comprises separating the plurality of side surface dies from the die plate.

6. The method of claim 3 , wherein

each of the plurality of side surface dies includes:

a contact body configured to contact with the die plate;

an actuator including an axis coupled with the contact body, the actuator configured to move the contact body; and

a guide body provided on the first die and configured to guide the contact body by slidably-coupling with the contact body,

wherein the contact body is configured to slidably move along the guide body.

7. The method of claim 1 , wherein the soaking the display module in the coating material comprises soaking the display module in a direction of the first surface such that a side surface of the plurality of LEDs is covered with the coating material.

8. The method of claim 1 , wherein the coating material includes a heat-curable resin having a light-transmissivity.

9. The method of claim 1 , wherein

the die plate includes a plurality of grooves formed in a shape corresponding to the plurality of LEDs at a position corresponding to the plurality of LEDs, and

the soaking the display module in the coating material comprises inserting the plurality of LEDs into the plurality of grooves, respectively.

10. The method of claim 9 , wherein the coating material includes:

a first coating material filled in the plurality of grooves and having a first light transmittance; and

a second coating material stacked on the first coating material, and having a second light transmittance lower than the first light transmittance.

11. A method for forming a display module, the method comprising:

soaking a first surface of a substrate in a coating material, the first surface disposed with a plurality of LEDs, and the substrate further including a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body; and

curing the coating material while the first surface of the substrate is soaked in the coating material, the cured coating material forming a molding part that covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.

12. The method of claim 11 , wherein the molding part includes:

a first portion formed to surround the plurality of LEDs; and

a second portion positioned on an upper part of the first surface that is not disposed with the plurality of LEDs,

wherein the first portion and the second portion are formed integrally.

13. The method of claim 12 , wherein a thickness of the first portion is smaller than a thickness of the second portion.

14. The method of claim 12 , wherein a first light transmittance of the first portion is higher than a second light transmittance of the second portion.

15. The method of claim 11 , wherein

the coating material comprises a heat-curable resin having a light-transmissivity, and the curing the coating material comprises heat curing the coating material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2020
From: HA, TAEHYEUN; PARK, JAEHOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 052608/0504 →
Priority Claims (1)
KR 10-2019-0053619 · May 8, 2019 · national
Continuity (1)
Related Publication 20200357963A1 · Nov 12, 2020
Cited By (1)
US 12,635,097