FSL having a free standing YIG film
Methods and apparatus for providing a frequency selective limiters (FSL) having a free-standing Yttrium Iron Garnet (YIG) film with first and second opposing surfaces. A metal plane is disposed on one surface of the YIG film to provide the YIG film with a metalized surface. At least one transducer is disposed on the other surface of the YIG film with a respective ends coupled to the metalized surface of the YIG film.
1. A frequency selective limiter (FSL) device, comprising:
a Yttrium Iron Garnet (YIG) film having first and second opposing surfaces;
a metal layer disposed on a first one of the first and second opposing surfaces of the YIG film to provide the YIG film with a metalized surface; and
a first transducer disposed on a second one of the first and second surfaces of the YIG film wherein the first transducer has a first end directly coupled to the metalized surface of the YIG film;
a second transducer disposed on the second one of the first and second surfaces of the YIG film, the second transducer having a first end directly coupled to the metalized surface of the YIG film; and
wherein the first and second transducers are configured to launch magnetostatic surface waves on the first and second surfaces of the YIG film.
2. The FSL device according to claim 1 , wherein the metal layer comprises an RF ground plane.
3. The FSL device according to claim 1 , wherein the YIG film has a thickness in a range of about 50 to about 500 microns.
4. The FSL device according to claim 1 , wherein the FSL comprises a Type A MSSW FSL device.
5. The FSL device according to claim 1 , wherein the FSL comprises a Type B MSSW FSL device.
6. The FSL device according to claim 1 , wherein the first and second transducers comprise microstrip transducers.
7. The FSL device according to claim 1 , wherein the first and second transducers comprise stripline transducers.
8. The FSL device according to claim 1 , wherein the first and second transducers comprises coplanar waveguide (CPW) transducers.
9. The FSL device according to claim 1 , wherein the first and second transducers comprise wirebonds.
10. The FSL device according to claim 1 , wherein the metal layer covers an entirety of the first one of the surfaces of the YIG film.
11. The FSL device according to claim 1 , wherein the MSSW FSL device is provided as a IC package.
12. The FSL device according to claim 11 , wherein the IC package comprises a QFN type package.
13. The FSL device according to claim 11 , wherein the IC package comprise conductive vias to electrically couple the first and second transducers to input/output feed circuits.