Closed loop hybrid cooling
A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
1. A hybrid cooling server assembly comprising:
a printed circuit board (PCB) comprising a processor socket disposed thereon, the processor socket being provided with ambient air from an airflow inlet formed on a surface of the PCB;
a hybrid cooling plate operably coupled to the processor socket;
a radiator comprising a working fluid received therein, the working fluid being in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members; and
one or more cooling fans proximal to the radiator,
wherein the working fluid is operable to receive heat from the hybrid cooling plate and reject heat at the radiator, and wherein the one or more cooling fans are operable to produce an airflow across the hybrid cooling plate thereby enabling the hybrid cooling plate to transfer thermal energy to the airflow.
2. The hybrid cooling server assembly of claim 1 , wherein the processor socket is proximal to the airflow inlet formed on the surface of the PCB.
3. The hybrid cooling server assembly of claim 1 , further comprising one or more processors configured to dynamically engage airflow cooling via the hybrid cooling plate and the one or more cooling fans, liquid cooling via the hybrid cooling plate and the radiator, or both airflow cooling and liquid cooling.
4. The hybrid cooling server assembly of claim 1 , wherein the PCB comprises a plurality of processor sockets disposed thereon, each of the plurality of processor sockets comprising a cooling plate operably coupled therewith.
5. The hybrid cooling server assembly of claim 1 , wherein the PCB is a multi-tier PCB comprising a first tier with a first plurality of processor sockets disposed thereon and a second tier comprising a second plurality of processor sockets disposed thereon, the first tier and the second tier vertically arranged.
6. The hybrid cooling server assembly of claim 1 , wherein the hybrid cooling plate has a plurality of fins formed on an upper surface operably disposed at least partly within the airflow produced by the one or more cooling fans.
7. The hybrid cooling server assembly of claim 1 , wherein the hybrid cooling plate has a manifold therein, the manifold comprising an inlet and an outlet, the inlet directing cold coolant received from the radiator across the hybrid cooling plate and to the outlet back to the radiator.
8. The hybrid cooling server assembly of claim 1 , further comprising at least one negative pressure pump, the least one negative pressure pump comprising an inlet pressure and an outlet pressure, the outlet pressure greater than the inlet pressure and the outlet pressure less than atmospheric pressure.
9. The hybrid cooling server assembly of claim 1 , further comprising a closed-loop liquid cooling system, the closed-loop liquid cooling system comprising the hybrid cooling plate, the radiator, and the one or more tubular members.
10. A server assembly comprising:
a housing;
a printed circuit board (PCB) received within the housing, the PCB comprising a processor socket disposed thereon and an airflow inlet formed on a surface of the PCB, the processor socket being provided with ambient air from an airflow inlet formed on one or more surfaces of the PCB;
a hybrid cooling plate operably coupled with the processor socket;
one or more peripheral components communicatively coupled with the PCB;
a power supply;
a radiator comprising a working fluid received therein, the working fluid being in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members;
one or more cooling fans proximal to the radiator, wherein the working fluid is operable to receive thermal energy from the hybrid cooling plate and reject heat at the radiator; and
a plurality of fins formed on a top surface of the hybrid cooling plate, wherein the one or more cooling fans are operable to produce an airflow across the plurality of fins, thereby enabling the hybrid cooling plate to transfer thermal energy to the airflow.
11. The server assembly of claim 10 , wherein the processor socket is proximal to the airflow inlet formed on the surface of the PCB.
12. The server assembly of claim 10 , wherein the airflow inlet, the processor socket, the radiator, the one or more cooling fans, and an airflow outlet are lineally arranged.
13. The server assembly of claim 10 , wherein the PCB has a plurality of processor sockets disposed thereon, each of the plurality of processor sockets comprising a cooling plate operably coupled therewith.
14. The server assembly of claim 10 , wherein the PCB is a multi-tier PCB comprising a first tier with a first plurality of processor sockets disposed thereon and a second tier comprising a second plurality of processor sockets disposed thereon, the first tier and the second tier vertically arranged.
15. The server assembly of claim 10 , wherein the plurality of fins are operably disposed at least partially within the airflow produced by the one or more cooling fans.
16. The server assembly of claim 10 , wherein the hybrid cooling plate has a manifold therein, the manifold comprising an inlet and an outlet, the inlet directing cold coolant from received from the radiator across the hybrid cooling plate and to the outlet back to the radiator.
17. The server assembly of claim 10 , further comprising at least one negative pressure pump, the least one negative pressure pump comprising an inlet pressure and an outlet pressure, the outlet pressure greater than the inlet pressure and the outlet pressure less than atmospheric pressure.
18. The server assembly of claim 10 , further comprising:
one or more hard disk drives arranged adjacent to the radiator.
19. The server assembly of claim 10 , further comprising a closed-loop liquid cooling system, the closed-loop liquid cooling system comprising the hybrid cooling plate, the radiator, and the one or more tubular members.
20. The server assembly of claim 10 , further comprising one or more processors configured to dynamically engage airflow cooling via the hybrid cooling plate and the one or more cooling fans, liquid cooling via the hybrid cooling plate and the radiator, or both airflow cooling and liquid cooling.