Multi-layered ceramic electronic component

1. A multilayer ceramic electronic component, comprising:

a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and having a first surface and a second surface opposing each other in a thickness direction of the ceramic body, a third surface and a fourth surface connected to the first surface and the second surface, and opposing each other in a length direction of the ceramic body, and a fifth surface and a sixth surface connected to the first surface to the fourth surface, and opposing each other in a width direction of the ceramic body; and

an external electrode disposed outside the ceramic body, and electrically connected to one or more of the plurality of internal electrodes,

wherein the external electrode includes an electrode layer electrically connected to the one or more of the plurality of internal electrodes, a first plating layer disposed on the electrode layer, and a second plating layer disposed on the first plating layer, and

a thickness T 1 of the electrode layer corresponding to a central region of the ceramic body in the thickness direction is 5 μm or more and 30 μm or less, a thickness T 2 of the electrode layer corresponding to a region in which an outermost internal electrode, of the internal electrodes, is located is 5 μm or more and 15 μm or less, and a thickness T 3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 μm or more and 10 μm or less, in a cross-section of the ceramic body in the thickness and length directions.

2. The multilayer ceramic electronic component of claim 1 , wherein a size of the multilayer ceramic electronic component is a 1005 size (Length×Width:1.0 mm×0.5 mm) or less, and the thickness T 1 is 15 μm or more and 30 μm or less.

3. The multilayer ceramic electronic component of claim 1 , wherein a size of the multilayer ceramic electronic component is a 1005 size (Length×Width:1.0 mm×0.5 mm) or less.

4. The multilayer ceramic electronic component of claim 1 , wherein a size of the multilayer ceramic electronic component is a 1005 size (Length×Width:1.0 mm×0.5 mm) or less, and the thickness T 3 is 1 μm or more and less than 9 μm.

5. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the dielectric layer is 0.4 μm or less, and a thickness of one of the plurality of the internal electrodes is 0.4 μm or less.

6. The multilayer ceramic electronic component of claim 1 , wherein the ceramic body includes an active portion forming capacity and including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and cover portions disposed on an upper portion and a lower portion of the active portion, respectively, and

a thickness of each of the cover portions is 20 μm or less.

7. The multilayer ceramic electronic component of claim 1 , wherein a thickness T 1 b of the first plating layer corresponding to the central region of the ceramic body in the thickness direction is 3 μm to 5 μm.

8. The multilayer ceramic electronic component of claim 1 , wherein the electrode layer is a sintered electrode including a conductive metal and glass.

9. The multilayer ceramic electronic component of claim 1 , wherein the thickness T 2 is less than the thickness T 1 and is greater than the thickness T 3 .

10. The multilayer ceramic electronic component of claim 1 , wherein an average thickness of the dielectric layer is 0.4 μm or less.

11. The multilayer ceramic electronic component of claim 1 , wherein an average thickness of one of the plurality of the internal electrodes is 0.4 μm or less.

12. The multilayer ceramic electronic component of claim 1 , wherein an average thickness of the dielectric layer is 0.4 μm or less, and an average thickness of one of the plurality of the internal electrodes is 0.4 μm or less.