Via structure and methods for forming the same
Vias and methods of making the same. The vias including a middle portion located in a via opening in an interconnect-level dielectric layer, a top portion including a top head that extends above the via opening and extends laterally beyond upper edges of the via opening and a bottom portion including a bottom head that extends below the via opening and extends laterally beyond lower edges of the via opening. The via may be formed from a refractory material.
1. A via comprising:
a middle portion located in a via opening in a second interconnect-level dielectric layer;
a top portion comprising a top head that extends above the via opening and extends laterally beyond upper edges of the via opening;
a bottom portion comprising a bottom head that extends below the via opening and extends laterally beyond lower edges of the via opening in a first interconnect-level dielectric layer;
a first conformal liner located under the bottom head of the bottom portion of the via; and
a second conformal liner located over the top head of the top portion of the via;
wherein the via comprises a refractory material.
2. The via of claim 1 , wherein the via comprises a refractory material selected from Ni, Co, Ru, Re, Ir, W, Mo, Rh, Fe, Pd, Pt, Os, Nb or alloys thereof.
3. The via of claim 1 , further comprising a barrier layer located between the middle portion of the via and sidewalls of the via opening in the second interconnect-level dielectric layer.
4. The via of claim 3 , wherein the barrier layer comprises a material selected from TaN, TiN, AlO x , a self-assembled monolayer (SAM) or combinations thereof.
5. The via of claim 3 , wherein a bottom surface of the bottom portion of the via is substantially convex.
6. The via of claim 1 , wherein the first conformal liner is formed before the bottom head of the bottom portion of the via is formed.
7. The via of claim 1 , wherein at least one of the first conformal liner and the second conformal liner comprises a material selected from Ta, Co, Ru or alloys thereof.
8. An interconnect structure, comprising:
a first interconnect-level dielectric;
a first line structure formed in the first interconnect-level dielectric;
a second interconnect-level dielectric layer;
a second line structure formed above the second interconnect-level dielectric layer;
a via formed in the second interconnect-level dielectric layer and electrically connecting the first line structure to the second line structure, wherein the via comprises a refractory material and extends partially into the first line structure and into the second line structure;
a first conformal liner located between the first line structure and the via; and
a second conformal liner located between the second line structure and the via.
9. The interconnect structure of claim 8 , wherein the via further comprises:
a dumbbell shape having a first portion and a second portion,
wherein the first portion and the second portion each cover junctions between the via and the first line structure and between the via and the second line structure, respectively.
10. The interconnect structure of claim 9 , wherein:
the first portion comprises a bottom head that extends below a via opening toward the first line structure and extends laterally beyond lower edges of the via opening in the first interconnect-level dielectric; and
the second portion comprises a top head that extends above the via opening toward the first line structure and extends laterally beyond upper edges of the via opening.
11. The interconnect structure of claim 8 , wherein the refractory material comprises a material selected from Ni, Co, Ru, Re, Ir, W, Mo, Rh, Fe, Pd, Pt, Os, Nb or alloys thereof.
12. The interconnect structure of claim 10 , further comprising a barrier layer located between a middle portion of the via and sidewalls of the via opening in the second interconnect-level dielectric layer.
13. The interconnect structure of claim 12 , wherein the barrier layer comprises a material selected from TaN, TiN, AlO x , a self-assembled monolayer (SAM) or combinations thereof.
14. The interconnect structure of claim 10 , wherein the first conformal liner is located under the bottom head of the first portion of the via.
15. The interconnect structure of claim 14 , wherein the first conformal liner is selected from Ta, Co, Ru or alloys thereof.
16. An interconnect structure, comprising:
a first line structure comprising a first conductive material formed in a trench in a first interconnect-level dielectric;
a second interconnect-level dielectric layer;
a via comprising a refractory material having a first portion formed within the second interconnect-level dielectric layer, a second portion that extends partially into the first line structure below the second interconnect-level dielectric layer, and a third portion that extends above the second interconnect-level dielectric layer;
a first conformal liner located between the first conductive material and the refractory material, and
a second conformal liner located over the third portion of the via.
17. The interconnect structure of claim 16 , wherein the refractory material comprises a material selected from Ni, Co, Ru, Re, Ir, W, Mo, Rh, Fe, Pd, Pt, Os, Nb or alloys thereof.
18. The interconnect structure of claim 16 , wherein the first conformal liner is selected from Ta, Co, Ru or alloys thereof.
19. The interconnect structure of claim 16 , further comprising a barrier layer located between the first portion of the via and sidewalls of a via opening in the second interconnect-level dielectric layer.
20. The interconnect structure of claim 19 , wherein the barrier layer comprises a material selected from TaN, TiN, AIO x , a self-assembled monolayer (SAM) or combinations thereof.