Weight optimized stiffener and sealing structure for direct liquid cooled modules
A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.
1. A device, comprising:
a weight optimized stiffener having a top surface, a bottom surface, an outer periphery and an inner periphery forming an aperture through the top and bottom surfaces,
wherein the aperture is adapted to receive a portion of a substrate coupled to the bottom surface of the stiffener by an adhesive; and
a top plate coupled to the top surface of the stiffener;
wherein the stiffener has a plurality of holes corresponding to a plurality of holes in the top plate, each of the plurality of holes in the stiffener forming a pair with a respective one of the plurality of holes in the top plate, each pair of the plurality of holes adapted to receive a portion of a fastener therethrough for coupling the top plate to the stiffener.
2. The device of claim 1 , wherein the stiffener is formed of silicon carbide particles in an aluminum matrix.
3. The device of claim 1 , further comprising:
the substrate coupled to the bottom surface of the stiffener by the adhesive, the portion of the substrate protruding into the aperture of the stiffener.
4. The device of claim 3 , wherein the bottom surface of the stiffener has at least one recess for receiving at least one protrusion on the substrate.
5. The device of claim 3 , wherein the bottom surface of the stiffener has a plurality of protrusions extending therefrom that lie adjacent to outer side surfaces of the substrate when the substrate is coupled to the bottom surface of the stiffener.
6. The device of claim 3 , further comprising an O-ring for providing a seal between the stiffener and the top plate.
7. The device of claim 3 , further comprising:
a manifold configured to lie within an enclosure formed by the substrate, stiffener and top plate, the manifold configured to direct cooled liquid to the substrate.
8. The device of claim 7 , wherein a portion of the manifold lies within the aperture of the stiffener and is in direct contact with the substrate when the manifold is within the enclosure formed by the substrate, stiffener and top plate.
9. The device of claim 1 , wherein the outer periphery is irregularly shaped.
10. A device, comprising:
a weight optimized stiffener having a top surface, a bottom surface, an outer periphery and an inner periphery forming an aperture through the top and bottom surfaces,
wherein the aperture is adapted to receive a portion of a substrate coupled to the bottom surface of the stiffener by an adhesive;
a top plate coupled to the top surface of the stiffener; and
an O-ring for providing a seal between the stiffener and the top plate;
wherein the top plate has a groove in an inner surface thereof that is configured to retain the O-ring when the top plate is coupled to the stiffener.
11. An assembly, comprising:
a weight optimized stiffener having a top surface, a bottom surface, an outer periphery and an inner periphery forming an aperture through the top and bottom surfaces;
a substrate coupled to the bottom surface of the stiffener by an adhesive, a portion of the substrate protruding into the aperture of the stiffener;
a top plate coupled to the top surface of the stiffener; and
a manifold configured to lie within an enclosure formed by the substrate, stiffener and top plate, the manifold configured to direct cooled liquid to the substrate.
12. The assembly of claim 11 , wherein the stiffener is formed of silicon carbide particles in an aluminum matrix.
13. The assembly of claim 12 , further comprising an O-ring for providing a seal between the stiffener and the top plate.
14. The assembly of claim 13 , wherein the top plate has a groove in an inner surface thereof that is configured to retain the O-ring when the top plate is coupled to the stiffener.
15. The assembly of claim 11 , wherein the bottom surface of the stiffener has at least one recess for receiving at least one protrusion on the substrate.
16. The assembly of claim 11 , wherein the bottom surface of the stiffener has a plurality of protrusions extending therefrom that lie adjacent to outer side surfaces of the substrate when the substrate is coupled to the bottom surface of the stiffener.
17. The assembly of claim 11 , wherein the stiffener has a plurality of holes corresponding to a plurality of holes in the top plate, each of the plurality of holes in the stiffener forming a pair with a respective one of the plurality of holes in the top plate, each pair of the plurality of holes adapted to receive a portion of a fastener therethrough for coupling the top plate to the stiffener.
18. The assembly of claim 11 , wherein a portion of the manifold lies within the aperture of the stiffener and a bottom surface of the manifold is in direct contact with the substrate when the manifold is within the enclosure formed by the substrate, stiffener and top plate.