IP Library › Granted Patent US 11,805,668
Granted Patent B2
US 11,805,668 · App. 16/879,830 · Granted Oct 31, 2023

Display substrate including closed annular structures surrounding display region to reduce cracking

Inventor: Haoming Lv (Beijing, CN)
Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
H10K50/844H10K50/115H10K59/131H10K71/00H10K59/1201
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Quick Facts
Patent No.
US 11,805,668
App. No.
16/879,830
Granted
Oct 31, 2023
Kind
B2
Abstract

A display substrate is provided. The display substrate has a display region and a non-display region disposed around the display region and the display substrate includes a base substrate and a barrier structure disposed on a side of the base substrate. The barrier structure is disposed in the non-display region, and the barrier structure includes a metal structure and a protective layer which are arranged on the substrate in sequence and the protective layer covers the metal structure.

Claims (29)

1. A display substrate having a display region and a non-display region disposed around the display region, wherein the display substrate comprises:

a base substrate and a barrier structure disposed on a side of the base substrate, wherein the barrier structure is disposed in the non-display region, and the barrier structure comprises a metal structure and a protective layer which are arranged on the base substrate in sequence and the protective layer covers the metal structure,

wherein the non-display region comprises a first annular region and a second annular region that respectively surround the display region, the first annular region is sleeved to a side of the second annular region distal from the display region, the metal structure is disposed in the first annular region, the second annular region comprises a first insulation layer, a second insulation layer, a gate wiring, a third insulation layer, a source and drain wiring, a fourth insulation layer, a flexible material layer and a package layer that are disposed in sequence on the base substrate, the metal structure and the gate wiring are disposed on the same layer and a gap exists between the metal structure and the gate wiring, and the gate wiring is not covered by the protective layer.

2. The display substrate according to claim 1 , wherein the metal structure comprises a plurality of closed annular structures,

wherein the plurality of closed annular structures arranged at intervals; and/or the plurality of closed annular structures are arranged at equal intervals.

3. The display substrate according to claim 1 , wherein the preparation material of the metal structure is the same as that of the gate wiring.

4. The display substrate according to claim 1 , wherein a preparation material of the metal structure comprises at least one of molybdenum, titanium, aluminum and silver.

5. The display substrate according to claim 1 , wherein the display substrate is an organic light emitting diode (OLED) display substrate or a quantum dot light emitting diode (QLED) display substrate.

6. The display substrate according to claim 2 , wherein a width of each of the plurality of closed annular structures ranges from 5 μm to 15 μm, and a height of each of the plurality of closed annular structures in a direction vertical to the base substrate ranges from 10 μm to 20 μm.

7. The display substrate according to claim 2 , wherein the metal structure and the conductive structure are disposed on the same layer, and a preparation material of the metal structure is as same as that of the conductive structure;

wherein a preparation material of the metal structure comprises at least one of molybdenum, titanium, aluminum and silver; and

wherein a preparation material of the protective layer comprises polyimide.

8. A method for manufacturing a display substrate, the display substrate having a display region and a non-display region disposed around the display region, the method comprising:

providing a base substrate;

forming a metal structure in the non-display region on the base substrate with a metal material; and

forming a protective layer in the non-display region on the base substrate having a formed metal structure for causing the protective layer to cover the metal structure,

wherein the non-display region comprises a first annular region and a second annular region that respectively surround the display region, the first annular region is sleeved to a side of the second annular region distal from the display region, the metal structure is disposed in the first annular region, the second annular region comprises a first insulation layer, a second insulation layer, a gate wiring, a third insulation layer, a source and drain wiring, a fourth insulation layer, a flexible material layer and a package layer that are disposed in sequence on the base substrate, the metal structure and the gate wiring are disposed on the same layer and a gap exists between the metal structure and the gate wiring, and the gate wiring is not covered by the protective layer.

9. The method according to claim 8 , wherein forming the metal structure in the non-display region on the base substrate with the metal material comprises:

forming a plurality of closed annular structures in the non-display region on the base substrate with the metal material and by a patterning process, wherein each of the plurality of closed annular structures surrounds the display region.

10. The method according to claim 8 , wherein forming the metal structure in the non-display region on the base substrate with the metal material comprises:

forming the metal structure in the first annular region on the base substrate and forming a conductive structure in the second annular region on the base substrate with the metal material and by a one-patterning process, wherein a gap exists between the metal structure and the conductive structure.

11. The method according to claim 10 , wherein forming the metal structure in the first annular region on the base substrate and forming the conductive structure in the second annular region on the base substrate with the metal material and by the one-patterning process comprises:

forming the metal structure in the first annular region on the base substrate and forming the gate wiring in the second annular region on the base substrate with the metal material and by the one-patterning process.

12. The method according to claim 8 , wherein forming the metal structure in the non-display region on the base substrate with the metal material comprises:

forming the metal structure in the non-display region on the base substrate with at least one of molybdenum, titanium, aluminum and silver and by a patterning process.

13. A display panel, comprising a display substrate, the display substrate has a display region and a non-display region disposed around the display region, and the display substrate comprises a base substrate and a barrier structure disposed on a side of the base substrate; and

wherein the barrier structure is disposed in the non-display region, the barrier structure comprises a metal structure and a protective layer which are arranged on the substrate in sequence and the protective layer covers the metal structure,

wherein the non-display region comprises a first annular region and a second annular region that respectively surround the display region, the first annular region is sleeved to a side of the second annular region distal from the display region, the metal structure is disposed in the first annular region, the second annular region comprises a first insulation layer, a second insulation layer, a gate wiring, a third insulation layer, a source and drain wiring, a fourth insulation layer, a flexible material layer and a package layer that are disposed in sequence on the base substrate, the metal structure and the gate wiring are disposed on the same layer and a gap exists between the metal structure and the gate wiring, and the gate wiring is not covered by the protective layer.

14. A display apparatus, comprising the display panel as defined in claim 13 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: LV, HAOMING
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 052720/0644 →
Priority Claims (1)
CN 201810291817.7 · Apr 3, 2018 · national
Continuity (2)
Continuation In Part PCTCN2019079620 · Mar 26, 2019
Related Publication 20200287163A1 · Sep 10, 2020
Cited By (1)
US 12,232,355