Light-emitting device

1. A light-emitting device, comprising:

a substrate with a topmost surface;

a first semiconductor stack arranged on the substrate, and comprising a light-emitting layer and a first top surface separated from the topmost surface by a first distance;

a first bonding layer arranged between the substrate and the first semiconductor stack;

a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different from the first distance;

a second bonding layer arranged between the substrate and the second semiconductor stack;

a third semiconductor stack arranged on the substrate, and comprising a third top surface separated from the topmost surface by a third distance;

a third bonding layer arranged between the substrate and the third semiconductor stack; and

a metal line formed on the third top surface of the third semiconductor stack in a configuration of being physically connected to the substrate, and has an uppermost surface which meanders between an upper elevation and a lower elevation,

wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights;

wherein the upper elevation is higher than the light-emitting layer, and the lower elevation is lower than the light-emitting layer.

2. The light-emitting device of claim 1 , wherein the different color lights comprise red light, green light, blue light, or orange light.

3. The light-emitting device of claim 1 , further comprising a dielectric layer formed on the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack.

4. The light-emitting device of claim 1 , wherein the first top surface and the second top surface have different areas.

5. The light-emitting device of claim 1 , wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are electrically connected in serial with one another.

6. The light-emitting device of claim 1 , wherein the first semiconductor stack further comprises a first bottom surface separated from the topmost surface by a fourth distance, the second semiconductor stack further comprises a second bottom surface separated from the topmost surface by a fifth distance, the third semiconductor stack further comprises a third bottom surface separated from the topmost surface by a sixth distance, and the fourth distance is substantially equal to the fifth distance.

7. The light-emitting device of claim 1 , wherein the third distance is substantially equal to the first distance.

8. The light-emitting device of claim 1 , wherein the first semiconductor stack has a longer edge and a shorter edge; the substrate has a longitudinal edge and a transverse edge; the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are located on the substrate along the longitudinal edge; and the longer edge is parallel with the transverse edge.

9. The light-emitting device of claim 1 , further comprising a fourth semiconductor stack arranged on the substrate, and configured to emit a color light different from the different color lights.

10. A light-emitting device, comprising:

a substrate with a topmost surface;

a first semiconductor stack arranged on the substrate, and comprising a light-emitting layer and a first top surface separated from the topmost surface by a first distance;

a first bonding layer arranged between the substrate and the first semiconductor stack;

a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is substantially equal to the first distance;

a second bonding layer arranged between the substrate and the second semiconductor stack;

a third semiconductor stack arranged on the substrate, and comprising a third top surface separated from the topmost surface by a third distance;

a third bonding layer arranged between the substrate and the third semiconductor stack, and

a metal line formed on the third top surface of the third semiconductor stack in a configuration of being physically connected to the substrate, and has an uppermost surface which meanders between an upper elevation and a lower elevation, and wherein the upper elevation is higher than the light-emitting layer, and the lower elevation is lower than the light-emitting layer,

wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights,

wherein the third bonding layer and the second bonding layer have different thicknesses and

wherein each of the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack has a longer edge and a shorter edge, respectively; the substrate has a longitudinal edge and a transverse edge, the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are located on the substrate along the longitudinal edge; and the longer edges are parallel with the transverse edge.

11. The light-emitting device of claim 10 , wherein the different color lights comprise red light, green light, blue light, or orange light.

12. The light-emitting device of claim 10 , further comprising a dielectric layer formed on the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack.

13. The light-emitting device of claim 10 , wherein the first top surface and the second top surface have different areas.

14. The light-emitting device of claim 10 , wherein the first semiconductor stack, the second semiconductor stack and the third semiconductor stack are electrically connected in serial with one another.

15. The light-emitting device of claim 10 , further comprising a fourth semiconductor stack arranged on the substrate, and configured to emit a color light different from the different color lights.