Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same

1. A light emitting device comprising:

a backplane;

an array of light emitting diodes attached to a frontside of the backplane;

a positive tone, imageable dielectric material layer located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, wherein sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile such that a lateral extent of the light emitting diodes decreases with increasing vertical distance from a top surface of the light emitting diodes towards the frontside of the backplane; and

at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes.

2. The light emitting device of claim 1 , wherein the at least one common conductive layer comprises:

a conductive adhesion layer contacting upper portions of sidewalls of the light emitting diodes and a top surface of the positive tone, imageable dielectric material layer; and

a transparent conductive layer contacting a frontside surface of the conductive adhesion layer.

3. The light emitting device of claim 1 , wherein:

the positive tone, imageable dielectric material layer comprises a positive photoresist layer; and

the positive photoresist layer comprises tapered encirclement portions that laterally encircle and contact a respective one of the light emitting diodes and include a respective set of inner sidewalls and a respective set of outer sidewalls, wherein a lateral spacing between each of the inner sidewalls and a most proximal one of the outer sidewalls decreases to zero with an increase in a vertical distance from the backplane.

4. The light emitting device of claim 3 , wherein:

the inner sidewalls of the tapered encirclement portions have a taper angle in a range from 1 degree to 15 degrees with respective to a direction perpendicular to a frontside surface of the backplane; and

the outer sidewalls of the tapered encirclement portions include concave sidewalls having a variable taper angle that increases with a lateral distance from a geometrical center of a most proximal one of the light emitting diodes.

5. The light emitting device of claim 3 , wherein:

each of the light emitting diodes comprise a respective active region configured to emit light upon application of a bias voltage thereacross;

a matrix portion of the positive photoresist layer adjoining the tapered encirclement portions and continuously extending around each of the light emitting diodes; and

the top surface of the positive photoresist layer is located between a first horizontal plane including top surfaces of the light emitting diodes and a second horizontal plane including the active regions of the light emitting diodes.

6. The light emitting device of claim 2 , wherein a subset of the light emitting diodes comprise a respective n-doped compound semiconductor substrate layer having a horizontal cross-sectional area that strictly increases with a distance from the frontside of the backplane.

7. The light emitting device of claim 6 , wherein the conductive adhesion layer contacts sidewalls of the n-doped compound semiconductor substrate layer.

8. The light emitting device of claim 2 , wherein the conductive adhesion layer contacts top surfaces of the light emitting diodes.

9. The light emitting device of claim 8 , wherein the conductive adhesion layer comprises a transparent metallic material having a thickness in a range from 0.2 nm to 2 nm.

10. The light emitting device of claim 9 , wherein the conductive adhesion layer comprises a material selected from Ti, TiW, or a layer stack of a Ti layer and an Al layer.

11. The light emitting device of claim 2 , wherein:

the conductive adhesion layer comprises an array of openings, wherein each light emitting diode among the array of light emitting diodes extends through a respective opening within the array of openings; and

the conductive adhesion layer does not contact any top surface of the light emitting diodes.

12. The light emitting device of claim 11 , wherein the conductive adhesion layer comprises a spin-on conductive material and has a planar top surface that is located below a horizontal plane including top surfaces of the light emitting diodes.

13. The light emitting device of claim 12 , wherein the conductive adhesion layer comprises silver particles, silver nanowires, carbon nanotubes, or graphene sheets that are embedded within an organic matrix.

14. The light emitting device of claim 1 , wherein each region of the light emitting device that overlies a top surface of a light emitting diode excludes light absorbing material.

15. A light emitting device comprising:

a backplane;

an array of light emitting diodes attached to a frontside of the backplane;

a positive tone, imageable dielectric material layer located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, wherein sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile; and

at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes, wherein:

the positive tone, imageable dielectric material layer comprises a positive photoresist layer; and

the positive photoresist layer comprises tapered encirclement portions that laterally encircle and contact a respective one of the light emitting diodes and include a respective set of inner sidewalls and a respective set of outer sidewalls, wherein a lateral spacing between each of the inner sidewalls and a most proximal one of the outer sidewalls decreases to zero with an increase in a vertical distance from the backplane.

16. A light emitting device comprising:

a backplane;

an array of light emitting diodes attached to a frontside of the backplane;

a positive tone, imageable dielectric material layer located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, wherein sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile; and

at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes,

wherein:

the at least one common conductive layer comprises a conductive adhesion layer contacting upper portions of sidewalls of the light emitting diodes and a top surface of the positive tone, imageable dielectric material layer, and a transparent conductive layer contacting a frontside surface of the conductive adhesion layer; and

a subset of the light emitting diodes comprise a respective n-doped compound semiconductor substrate layer having a horizontal cross-sectional area that strictly increases with a distance from the frontside of the backplane.

17. A light emitting device comprising:

a backplane;

an array of light emitting diodes attached to a frontside of the backplane;

a positive tone, imageable dielectric material layer located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, wherein sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile; and

at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes,

wherein:

the at least one common conductive layer comprises a conductive adhesion layer contacting upper portions of sidewalls of the light emitting diodes and a top surface of the positive tone, imageable dielectric material layer, and a transparent conductive layer contacting a frontside surface of the conductive adhesion layer;

the conductive adhesion layer comprises an array of openings, wherein each light emitting diode among the array of light emitting diodes extends through a respective opening within the array of openings; and

the conductive adhesion layer does not contact any top surface of the light emitting diode.