Photon detector array assembly

1. An apparatus, comprising:

a photon detector array with a first signal output pad coupled to a photon detector array pixel;

a die carrier comprising a readout integrated circuit (ROIC) die, the die carrier comprising a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of a first surface of the ROIC die, wherein the ROIC die includes a sidewall surface in contact with a dielectric material of the die carrier and a second surface exposed, the second surface opposite the first surface; and

the first signal output pad coupled to the first signal input pad.

2. The apparatus of claim 1 , wherein the apparatus is one selected from a group consisting essentially of: an x-ray photon detector; a gamma ray photon detector; a visible photon detector and an infrared photon detector.

3. The apparatus of claim 1 , further comprising:

an interposer disposed between the photon detector array and the conductor layer, the interposer electrically coupling the die carrier to the photon detector array;

a second signal input pad on the interposer coupled to the first signal output pad; and

a second signal output pad on the interposer coupled to the first signal input pad on the conductor layer of the die carrier.

4. The apparatus of claim 3 , wherein a first pitch of second signal input pads on the interposer is approximately the same as a second pitch of signal output pads on the photon detector array, and wherein a surface area of a surface of the interposer is approximately the same as a surface area of a surface of the photon detector array.

5. The apparatus of claim 3 , wherein a first pitch of second signal output bond pads on the interposer is approximately the same as a second pitch of first signal input pads on the conductor layer.

6. The apparatus of claim 3 , wherein the conductor layer has between 1 and 5 interconnect layers, and wherein the interposer has between 1 and 5 interconnect layers.

7. The apparatus of claim 1 , further comprising:

a through lead of the die carrier; and

spaces between the ROIC die and the through lead filled with the dielectric material;

wherein another conductor in the conductor layer couples the through lead to the ROIC die.

8. The apparatus of claim 1 , wherein the dielectric material is filled epoxy or filled polyimide.

9. The apparatus of claim 7 , further comprising:

a passive device disposed in the die carrier, wherein the conductor layer couples the passive device to the ROIC die.

10. The apparatus of claim 7 , further comprising:

the die carrier including an integrated circuit die; and

the conductor layer coupling the integrated circuit die and the through lead to the ROIC die.

11. The apparatus of claim 1 , wherein a first pitch of signal input pads on the conductor layer is less than a second pitch of signal output pads on the photon detector array, and wherein a first surface area of a surface of the die carrier with the conductor layer is less than a second surface area of a surface of the photon detector array.

12. The apparatus of claim 1 , wherein the conductor layer has between 1 and 10 interconnect layers, and wherein the photon detector array is mounted on the conductor layer.

13. The apparatus of claim 1 , wherein the photon detector array comprises photosensors that are one of cadmium zinc telluride or cadmium telluride.

14. The apparatus of claim 1 , further comprising:

one or more through leads of the die carrier, the one or more through leads providing power and control signals to the apparatus or providing signal outputs from the apparatus.

15. An apparatus, comprising:

a photon detector array with a first signal output pad on a photon detector array pixel;

a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer with a first signal input pad on the conductor layer coupled to a signal amplifier in the ROIC die through a first surface of the ROIC die, wherein the ROIC die includes a sidewall surface in contact with a dielectric material of the die carrier and a second surface exposed, the second surface opposite the first surface;

an interposer with a second signal output pad on a first planar surface of the interposer coupled to the first signal input pad on the conductor layer; and

a second signal input pad on a second planar surface of the interposer opposing the first planar surface and coupled to the first signal output pad.

16. The apparatus of claim 15 , wherein the conductor layer has 1 to 5 interconnect layers, and wherein the interposer has 1 to 5 interconnect layers.

17. The apparatus of claim 15 , wherein the die carrier further comprises through leads and the conductor layer couples the through leads to the ROIC die.

18. The apparatus of claim 15 , wherein the die carrier further comprises at least one passive electrical device and the conductor layer couples the at least one passive electrical device to the ROIC die.

19. The apparatus of claim 15 , wherein the ROIC die in the die carrier is a first integrated circuit die, and wherein the die carrier further comprises a second integrated circuit die and the conductor layer couples the second integrated circuit die to the ROIC die.

20. The apparatus of claim 15 , wherein the die carrier further comprises through leads, a passive electrical device, and a second integrated circuit die, and wherein the conductor layer couples the through leads, the passive electrical device, and the second integrated circuit die to the ROIC die.

21. The apparatus of claim 15 wherein the photon detector array is one selected from a group consisting essentially of an x-ray detector, a gamma ray detector, a visible photon detector and an infrared photon detector.

22. The apparatus of claim 15 , further comprising:

one or more through leads of the die carrier, the one or more through leads providing power and control signals to the apparatus or providing signal outputs from the apparatus.