Continuous interconnects between heterogeneous materials
A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
1. A discrete structure comprising:
a first material;
a second material joined to the first material at a junction between the first and second materials; and
a fluid phase conductor extending across the junction to form a continuous interconnect between the first and second materials and electrically coupling a first electronic component to a second electronic component;
wherein the first and second materials are heterogeneous by having at least one different mechanical, constraint, or processing parameter relative to one another.
2. The structure of claim 1 further comprising a transition at the junction between the first and second materials.
3. The structure of claim 2 , wherein the transition comprises a lap joint.
4. The structure of claim 1 , wherein the fluid phase conductor comprises a conductive gel.
5. The structure of claim 1 , wherein the first is substantially more rigid than the second material.
6. The structure of claim 1 , wherein the first material is substantiallymore elastic than the second material.
7. The structure of claim 1 , further comprising a first encapsulant arranged on the first material to substantially enclose a portion of the fluid phase conductor.
8. The structure of claim 1 , further comprising a second encapsulant arranged on the second material to substantially enclose a portion of the fluid phase conductor.
9. The structure of claim 1 , wherein the first material comprises a via through which at least a portion of the fluid phase conductor passes.
10. The structure of claim 9 , wherein:
the structure comprises a lap joint at the junction between the first material and the second material; and
the via passes through the lap joint.
11. The structure of claim 5 , further comprising an electronic component attached to the first material and electrically coupled to the fluid phase conductor.
12. The structure of claim 1 , wherein:
the junction between the first and second materials comprises a first junction;
the structure further comprises a third material joined to the second material at a second junction between the second and third materials;
the fluid phase conductor extends across the second junction to form a continuous interconnect between the first, second, and third materials; and
the second and third materials are heterogeneous by having at least one different mechanical, constraint, or processing parameter relative to one another.
13. The structure of claim 12 , the structure further comprising:
wherein the first electronic component attached to the first material and electrically connected to the fluid phase conductor; and
wherein the second electronic component attached to the third material and electrically connected to the fluid phase conductor.
14. A discrete sensor structure comprising:
a first substrate comprising a first material;
a conductive contact layer comprising a second material disposed on the first substrate;
a second substrate comprising a third material disposed on the first substrate; and
a fluid phase conductor arranged in a pattern on the second substrate and forming a continuous electrical interconnect with the conductive contact layer;
wherein at least two of the first, second, and third materials are heterogeneous by having at least one different mechanical, constraint, or processing parameter relative to one another.
15. The sensor structure of claim 14 , further comprising an electronic component disposed on the second substrate and electrically connected to the continuous electrical interconnect.
16. The sensor structure of claim 14 , wherein the first substrate comprises a via through which the continuous electrical interconnect connects to the conductive contact layer.