IP Library › Granted Patent US 12,180,584
Granted Patent B2
US 12,180,584 · App. 16/885,887 · Granted Dec 31, 2024

Method of fabricating hexagonal boron nitride

Inventors: Changseok Lee (Seoul, KR); Hyeonsuk Shin (Ulsan, KR); Hyeonjin Shin (Suwon-si, KR); Seokmo Hong (Ulsan, KR); Kyungyeol Ma (Ulsan, KR)
Assignees: Samsung Electronics Co., Ltd.; UNIST (Ulsan National Institute of Science and Technology)
C23C16/342C01B21/0641C23C16/0227C23C16/50C30B25/105C30B25/165C30B29/403H01L21/0254H01L21/02598H01L21/02609H01L21/0262H01L29/0847H01L29/41725
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Quick Facts
Patent No.
US 12,180,584
App. No.
16/885,887
Granted
Dec 31, 2024
Kind
B2
Abstract

Disclosed herein is a method of fabricating hexagonal boron nitride in which hexagonal boron nitride is epitaxially grown. A method of fabricating hexagonal boron nitride includes placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and having a lattice mismatch of 15% or less with hexagonal boron nitride (h-BN) in a chamber; and growing hexagonal boron nitride on the catalytic metal at a temperature of 800° C. or lower while supplying a nitrogen source and a boron source into the chamber.

Claims (45)

1. A method of fabricating hexagonal boron nitride, the method comprising:

placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and having a lattice mismatch of greater than or equal to 0% and less than or equal to 15% with hexagonal boron nitride (h-BN);

removing pollutants from a surface of the catalytic metal; and

growing hexagonal boron nitride on the catalytic metal at a temperature of 600° C. to 800° C. while supplying a nitrogen source and a boron source into the chamber,

wherein

the hexagonal boron nitride is grown directly on the catalytic metal, and

the catalytic metal includes crystals osmium (Os),

wherein the removing the pollutants from the surface of the catalytic metal includes supplying hydrogen (H 2 ) gas into the chamber and increasing a temperature in the chamber to 1,000° C.,

wherein the removing the pollutants from the surface of the catalytic metal is performed for 20 minutes while supplying the hydrogen gas at a flow rate of 100 sccm, and

wherein the growing the hexagonal boron nitride provides a grown hexagonal boron nitride with a Raman spectrum having a peak at about 1370 cm −1 and a peak at about 1450 cm −1 , and an intensity of the peak at about 1370 cm −1 is greater than an intensity of the peak at about 1450 cm −1 .

2. The method of claim 1 , wherein the catalytic metal further includes crystals of at least one of a Co—Cr alloy, a Co—N alloy, a Co—Ir alloy, and rhenium (Re).

3. The method of claim 1 , wherein

the nitrogen source and the boron source include at least one of borazine, 1,3,5-trimethylborazine, 2,4,6-trimethylborazine, aminoborane, 2,4,6-trichloroborazine, B-tri(methylamino) borazine, and ammonia borane.

4. The method of claim 1 , wherein the nitrogen source includes at least one of ammonia (NH 3 ) gas and nitrogen (N 2 ) gas.

5. The method of claim 1 , wherein the boron source includes at least one of BH 3 , BF 3 , BCl 3 , B 2 H 6 , (CH 3 CH 2 ) 3 B, and (CH 3 ) 3 B.

6. The method of claim 1 , wherein the nitrogen source and the boron source are provided by vaporizing solid boron nitride powder.

7. The method of claim 1 , wherein the growing the hexagonal boron nitride is performed by inductively coupled plasma chemical vapor deposition.

8. The method of claim 1 , wherein the growing the hexagonal boron nitride includes:

supplying hydrogen (H 2 ) gas into the chamber at a flow rate of 0 sccm to 100 sccm,

supplying argon (Ar) gas into the chamber at a flow rate of 0 sccm to 100 sccm,

supplying borazine gas into the chamber at a flow rate of 0.01 sccm to 1 sccm, and

maintaining pressure in the chamber at 0.01 Torr to 1 Torr.

9. The method of claim 1 , wherein a lattice mismatch between the catalytic metal and the hexagonal boron nitride is greater than or equal to 0% and less than or equal to 10.4%.

10. The method of claim 1 , wherein growing the grown hexagonal boron nitride and a root mean square surface roughness of the grown hexagonal boron nitride is 2 nm or less and greater than or equal to 0 nm.

11. The method of claim 10 , wherein the root mean square surface roughness of the grown hexagonal boron nitride is 1.7 nm or less and greater than or equal to 0 nm.

12. The method of claim 1 , wherein

the growing hexagonal boron nitride is performed after the removing the pollutants from the surface of the catalytic metal is performed.

13. A method of fabricating hexagonal boron nitride, the method comprising:

placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and including crystals of osmium (Os); and

directly growing hexagonal boron nitride on the catalytic metal at a temperature in a range of about 600° C. to about 800° C. while supplying a nitrogen source and a boron source into the chamber,

wherein the directly growing the hexagonal boron nitride provides a grown hexagonal boron nitride with a Raman spectrum having a peak at about 1370 cm −1 and a peak at about 1450 cm −1 , and an intensity of the peak at about 1370 cm −1 is greater than an intensity of the peak at about 1450 cm −1 .

14. The method of claim 13 , wherein the directly growing hexagonal boron nitride includes:

supplying hydrogen (H 2 ) gas into the chamber at a flow rate of 0 sccm to 100 sccm,

supplying argon (Ar) gas into the chamber at a flow rate of 0 sccm to 100 sccm,

supplying borazine gas into the chamber at a flow rate of 0.01 sccm to 1 sccm, and

maintaining pressure in the chamber at 0.01 Torr to 1 Torr.

15. The method of claim 13 , wherein the directly growing hexagonal boron nitride is performed by inductively coupled plasma chemical vapor deposition.

16. The method of claim 13 , further comprising:

removing pollutants from a surface of the catalytic metal before the growing the hexagonal boron nitride.

17. The method of claim 13 , wherein

the nitrogen source and the boron source include at least one of borazine, 1,3,5-trimethylborazine, 2,4,6-trimethylborazine, aminoborane, 2,4,6-trichloroborazine, B-tri(methylamino) borazine, and ammonia borane.

18. The method of claim 16 , wherein

the removing the pollutants from the surface of the catalytic metal includes supplying hydrogen (H 2 ) gas into the chamber and increasing a temperature in the chamber to 1,000° C.,

the removing the pollutants from the surface of the catalytic metal is performed while supplying the hydrogen gas at a flow rate of 100 sccm, and

the directly growing hexagonal boron nitride is performed after the removing the pollutants from the surface of the catalytic metal is performed.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2020
From: LEE, CHANGSEOK; SHIN, HYEONJIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 052791/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2020
From: SHIN, HYEONSUK; HONG, SEOKMO; MA, KYUNGYEOL
To: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Reel/Frame 052791/0299 →
Priority Claims (1)
KR 10-2019-0108930 · Sep 3, 2019 · national
Continuity (1)
Related Publication 20210066069A1 · Mar 4, 2021