Ground plane booster antenna technology for wearable devices
A wireless wearable device comprises a radiating system that contains at least a non-resonant element disposed in different arrangements within a radiating structure in the radiating system, featuring compact dimensions and an adequate performance when operating on a carrier living body.
1. A wearable device comprising:
a radiating system operable in at least one operating frequency band contained within at least one frequency region, the at least one operating frequency band extending from a first frequency to a highest frequency of operation of the radiating system, the radiating system comprising:
a radiating structure comprising:
at least one booster element including a top conducting surface contained in a dielectric material support, the at least one booster element having a maximum booster length; and
a ground plane layer having a maximum ground plane layer length greater than the maximum booster length, wherein the at least one booster element and the ground plane layer are disposed in an arrangement having a maximum radiating structure length less than 0.8 times a free space wavelength corresponding to the highest frequency of operation of the radiating system; and
a matching network to enable operation of the radiating system in the at least one operating frequency band.
2. The wearable device of claim 1 , wherein the first ground plane layer comprises a ground plane clearance that contains the at least one booster element.
3. The wearable device of claim 2 , wherein the at least one booster element is placed at a distance from an edge of the ground plane layer.
4. The wearable device of claim 2 , wherein the radiating structure further comprises a shielding ground plane layer.
5. The wearable device of claim 4 , wherein the shielding ground plane layer is connected to the ground plane layer by a conductive element.
6. The wearable device of claim 1 , wherein the ground plane layer not include a ground plane clearance containing the at least one booster element.
7. The wearable device of claim 1 , wherein the at least one booster element is placed above the ground plane layer.
8. The wearable device of claim 7 , wherein the maximum radiating structure length is less than 0.16 times a free-space wavelength corresponding to the highest frequency of operation.
9. The wearable device of claim 7 , wherein the maximum radiating structure length is less than 0.125 times a free-space wavelength corresponding to the highest frequency of operation.
10. The wearable device of claim 1 , wherein the maximum radiating structure length is less than 0.4 times a free-space wavelength corresponding to the highest frequency of operation.
11. The wearable device of claim 1 , wherein the maximum radiating structure length is less than 0.3 times a free-space wavelength corresponding to the highest frequency of operation.
12. The wearable device of claim 1 , wherein the top conducting surface of the at least one booster element is connected to at least one via.
13. The wearable device of claim 12 , wherein one of the at least one via is a feeding element.
14. The wearable device of claim 12 , wherein the at least one booster element further includes at least one bottom conducting surface and the at least one via connects the top conducting surface to the at least one bottom conducting surface.
15. The wearable device of claim 14 , wherein the at least one bottom conducting surface is contained in the dielectric material support that contains the top conducting surface.
16. The wearable device of claim 1 , wherein the first ground plane layer is extended by at least one conducting strip element.
17. The wearable device of claim 16 , wherein the radiating system is configured to operate in at least one low-frequency band within a 880 MHz to 960 MHz frequency range.
18. The wearable device of claim 17 , wherein the top conducting surface of the at least one booster element is connected to at least one via.
19. The wearable device of claim 18 , wherein the at least one booster element further includes at least one bottom conducting surface and the at least one via connects the top conducting surface to the at least one bottom conducting surface.