Electronic panel and electronic apparatus including the same
An electronic panel includes: a base substrate divided into a hole region including a hole transmissive region overlapping an electronic module when viewed in a plan view and a light shielding region adjacent to the hole transmissive region, an active region adjacent to the hole region, and a peripheral region adjacent to the active region; a plurality of light emitting devices spaced apart from the hole region in the active region; a light shielding pattern spaced apart from the hole transmissive region in the light shielding region; and an encapsulation substrate on the base substrate and covering the light emitting devices, wherein the light shielding pattern comprises frit.
1. An electronic panel comprising:
a base substrate divided into a hole region including a hole transmissive region overlapping an electronic module when viewed in a plan view and a light shielding region adjacent to the hole transmissive region, an active region adjacent to the hole region, and a peripheral region adjacent to the active region;
a plurality of light emitting devices spaced apart from the hole region in the active region;
a light shielding pattern spaced apart from the hole transmissive region in the light shielding region; and
an encapsulation substrate on the base substrate and covering the light emitting devices,
wherein the light shielding pattern comprises frit.
2. The electronic panel of claim 1 , wherein the frit comprises a vanadium oxide.
3. The electronic panel of claim 1 , wherein the light shielding pattern is on a rear surface of the encapsulation substrate.
4. The electronic panel of claim 3 , wherein the encapsulation substrate comprises glass.
5. The electronic panel of claim 1 , wherein the electronic panel comprises a plurality of insulating layers between the base substrate and the encapsulation substrate and spaced apart from the encapsulation substrate,
wherein the insulating layers are spaced apart from the hole transmissive region when viewed in a plane.
6. The electronic panel of claim 5 , wherein the light shielding pattern is in contact with any one of the encapsulation substrate and the insulating layers.
7. The electronic panel of claim 5 , further comprising a hole conductive pattern in the hole region and spaced apart from the hole transmissive region on any one of the insulating layers,
wherein the light shielding pattern is in contact with the hole conductive pattern and the encapsulation substrate.
8. The electronic panel of claim 1 , further comprising:
a window on the encapsulation substrate; and
an anti-reflection layer between the encapsulation substrate and the window,
wherein an opening penetrating the anti-reflection layer and overlapping the hole transmissive region is defined.
9. The electronic panel of claim 8 , wherein an inner surface of the opening overlaps the light shielding pattern when viewed in the plan view.
10. The electronic panel of claim 1 , further comprising a sensing unit on the encapsulation substrate and includes a plurality of sensing electrodes,
wherein the sensing electrodes are spaced apart from the hole transmissive region when viewed in the plan view.
11. An electronic apparatus comprising:
an electronic module; and
an electronic panel overlapping the electronic module when viewed in a plan view,
wherein the electronic panel comprises:
a base substrate divided into a hole region including a hole transmissive region overlapping the electronic module when viewed in the plan view and a light shielding region adjacent to the hole transmissive region, an active region adjacent to the hole region, and a peripheral region adjacent to the active region;
a plurality of light emitting devices spaced apart from the hole region in the active region;
a light shielding pattern spaced apart from the hole transmissive region in the light shielding region;
an encapsulation substrate on the base substrate and including a rear surface facing the light emitting devices and a front surface opposite to the rear surface; and
a sealing member bonding the encapsulation substrate and the base substrate,
wherein the light shielding pattern is on the rear surface of the encapsulation substrate.
12. The electronic apparatus of claim 11 , wherein the light shielding pattern comprises frit.
13. The electronic apparatus of claim 12 , wherein the light shielding pattern comprises a same material as the sealing member.
14. The electronic apparatus of claim 11 , further comprising:
a window on the front surface of the encapsulation substrate; and
an anti-reflection layer between the window and the encapsulation substrate,
wherein the window overlaps the hole region when viewed in the plan view, and
an opening penetrating the anti-reflection layer and overlapping the hole region.
15. The electronic apparatus of claim 14 , wherein an inner surface of the opening is aligned with an end of the light shielding pattern.
16. The electronic apparatus of claim 14 , wherein an inner surface of the opening overlaps the light shielding pattern when viewed in the plan view.
17. The electronic apparatus of claim 14 , wherein a light transmittance of a region of the window overlapping the hole region is equal to a light transmittance of a region of the window overlapping the active region.
18. The electronic apparatus of claim 11 , wherein the hole transmissive region is surrounded by the light shielding pattern when viewed in the plan view.
19. The electronic apparatus of claim 18 , wherein
the hole transmissive region comprises a plurality of hole transmissive regions spaced apart from each other, and
the light shielding pattern surrounds each of the plurality of hole transmissive regions.
20. The electronic apparatus of claim 18 , wherein
each of the hole transmissive region and the light shielding pattern is provided in plurality, the plurality of hole transmissive regions are spaced apart from each other, and the plurality of light shielding patterns are spaced apart from each other, and
the plurality of light shielding patterns respectively surround the plurality of hole transmissive regions.
21. The electronic apparatus of claim 11 , wherein the electronic module comprises at least one of a camera, a speaker, a light sensor, or a heat sensor.
22. The electronic apparatus of claim 11 , wherein the electronic panel comprises signal wires in the light shielding region and connected to light emitting devices adjacent to the hole region among the light emitting devices,
wherein the signal wires are covered by the light shielding pattern when viewed in the plan view.
23. The electronic apparatus of claim 22 , wherein the light shielding pattern is spaced apart from the signal wires when viewed in the plan view.
24. The electronic apparatus of claim 22 , further comprising a hole conductive pattern in the light shielding region and spaced apart from the signal wires to be electrically insulated from the signal wires,
wherein the light shielding pattern is in contact with the hole conductive pattern.
25. The electronic apparatus of claim 11 , wherein the electronic apparatus comprises a plurality of insulating layers between the base substrate and the encapsulation substrate and spaced apart from the encapsulation substrate,
wherein the light shielding pattern is in contact with any one of the insulating layers.