Method of manufacturing a semiconductor device having a doped work-function layer
A semiconductor device and method of manufacture are provided. In some embodiments a treatment process is utilized to treat a work function layer. The treatment prevents excessive oxidation of the work function layer during subsequent processing steps, such as application of a subsequent photoresist material, thereby allowing the work function layer to be thinner than otherwise.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a fin from a semiconductor substrate;
forming a gate dielectric over the fin;
forming a work function layer over the gate dielectric;
modifying a surface of the work function layer, wherein the modifying the surface is performed at least in part with a chemical soak that implants an active element; and
performing a post-treatment process after the modifying the surface of the work function layer, the post-treatment process reducing a number of dangling bonds within the work function layer.
2. The method of claim 1 , wherein the active element is aluminum.
3. The method of claim 1 , wherein the chemical soak comprises introducing tungsten fluoride to the work function layer.
4. The method of claim 1 , wherein the forming the work function layer is performed at least in part with an atomic layer deposition process to a thickness of between about 5 Å and about 30 Å.
5. The method of claim 1 , further comprising reacting the active element with oxygen.
6. The method of claim 1 , wherein the active element is chromium.
7. A method of manufacturing a semiconductor device, the method comprising:
depositing a gate dielectric over a channel region of a semiconductor material, the channel region being adjacent to multiple sides of the semiconductor material;
depositing a work function layer over the gate dielectric using an atomic layer deposition process;
soaking the work function layer in a precursor material, wherein the precursor material is titanium chloride, and wherein the soaking the work function layer forms a dopant layer within the work function layer; and
depositing a fill material over the work function layer.
8. The method of claim 7 , wherein the depositing the work function layer deposits the work function layer to a thickness of between about 10 Å and about 30 Å.
9. The method of claim 7 , wherein the soaking the work function layer is performed in-situ with the depositing the work function layer.
10. The method of claim 7 , wherein the depositing the work function layer deposits titanium nitride.
11. The method of claim 7 , further comprising performing a post-treatment process after the soaking the work function layer in the precursor material, the post-treatment process reducing a number of dangling bonds within the work function layer.
12. The method of claim 11 , wherein the post-treatment process adds nitrogen to the work function layer.
13. The method of claim 12 , wherein the post-treatment process flows ammonia over the work function layer.
14. The method of claim 13 , wherein the dopant layer comprises titanium.
15. A method of manufacturing a semiconductor device, the method comprising:
forming a dielectric material adjacent to a semiconductor fin;
forming a work function layer over the dielectric material, the work function layer comprising a dopant layer, wherein the dopant layer comprises titanium, boron, or chromium; and
forming a fill material over the work function layer.
16. The method of claim 15 , wherein the dopant layer comprises titanium.
17. The method of claim 15 , wherein the dopant layer comprises boron.
18. The method of claim 15 , wherein the dopant layer comprises chromium.
19. The method of claim 15 , wherein the work function layer has a thickness no greater than 30 Å.
20. The method of claim 15 , wherein the dopant layer has a thickness of between about 1 Å and about 10 Å.