Etching of metal oxides using fluorine and metal halides
Embodiments of this disclosure provide methods for etching oxide materials. Some embodiments of this disclosure provide methods which selectively etch oxide materials over other materials. In some embodiments, the methods of this disclosure are performed by atomic layer etching (ALE). In some embodiments, the methods of this disclosure are performed within a processing chamber comprising a nickel chamber material.
1. An etch process comprising:
exposing a substrate surface having an oxide layer thereon to a fluorinating agent to form a fluoride layer; and
exposing the fluoride layer to a halide etchant to remove the fluoride layer, the halide etchant comprising a compound having the general formula MX y , where M comprises one or more of titanium (Ti), tin (Sn), molybdenum (Mo), tungsten (W) or niobium (Nb), and X comprises one or more of Cl, Br or I.
2. The etch process of claim 1 , wherein the oxide layer comprises one or more of hafnium, tungsten, molybdenum, or titanium.
3. The etch process of claim 2 , wherein the oxide layer consists essentially of hafnium oxide.
4. The etch process of claim 1 , wherein the fluorinating agent comprises one or more of HF, NF 3 , organofluorides having the general formula C x H y F z , where x is 1-16, y is 0-33 and z is 1-34, organooxyfluorides having the general formula C x H y O w F z , where x is 1-16, y is 0-33, w is 1-8 and z is 1-34, metal fluorides, combinations thereof or plasmas thereof.
5. The etch process of claim 1 , wherein the halide etchant comprise a compound having the general formula EX 3 , where E comprises one or more of aluminum (Al) or boron (B), and X comprises one or more of Cl, Br or I.
6. The etch process of claim 1 , wherein the y is 1-6.
7. The etch process of claim 1 , further comprising repeating exposures to the fluorinating agent and halide etchant to remove a predetermined thickness of the oxide layer.
8. The etch process of claim 1 , wherein the fluorinating agent is coflowed with hydrogen (H 2 ) and the fluoride layer has a thickness in a range of about 10 Å to about 15 Å.
9. The etch process of claim 8 , wherein the fluoride layer is formed in a process chamber comprising a nickel chamber material.
10. The etch process of claim 1 , further comprising exposing the substrate surface to a cleaning plasma comprising one or more of H*, OH*, O* or H 2 O* before exposing the substrate surface to the fluorinating agent.
11. The etch process of claim 10 , wherein the cleaning plasma removes a carbon film and/or moisture from the substrate surface.
12. The etch process of claim 11 , wherein the carbon film and/or moisture is a result of an etch process.
13. The etch process of claim 1 , wherein the substrate surface has at least one other material and the oxide layer is selectively etched over the at least one other material.
14. The etch process of claim 13 , wherein the at least one other material comprises one or more of TiN, TaN, SiN, SiO 2 , Al 2 O 3 , or carbon-based materials.
15. The etch process of claim 13 , wherein selectivity of the etch process is greater than or equal to about 10:1.
16. An etch process comprising:
exposing a substrate surface having an oxyhydride layer thereon to a fluorinating agent to form a fluoride layer; and
exposing the fluoride layer to a halide etchant to remove the fluoride layer, the halide etchant comprising a compound having the general formula MX y , where M comprises one or more of titanium (Ti), tin (Sn), molybdenum (Mo), tungsten (W) or niobium (Nb), and X comprises one or more of Cl, Br or I.
17. The etch process of claim 16 , further comprising exposing a substrate surface having an oxide layer thereon to a plasma formed from one or more of H 2 O, H 2 O 2 or an alcohol to form the oxyhydride layer.
18. The etch process of claim 17 , wherein the oxide layer consists essentially of hafnium oxide.
19. An etch process comprising:
exposing a substrate surface having an oxide layer and a second material to a fluorinating agent in a process chamber comprising a nickel chamber material to selectively convert a portion of the oxide layer to a fluoride layer, the second material comprising one or more of TiN, SiN, TaN, SiO, AlO, LaO, carbon, silicon or combinations thereof; and
exposing the fluoride layer to a halide etchant to remove the fluoride layer, the halide etchant comprising a compound having the general formula MX y , where M comprises one or more of titanium (Ti), tin (Sn), molybdenum (Mo), tungsten (W) or niobium (Nb), and X comprises one or more of Cl, Br or I.
20. The etch process of claim 19 , wherein the second material consists essentially of silicon and the etch process has a selectivity of greater than or equal to about 20:1.