Vapor chamber
View Patent ↗This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
1. A vapor chamber, configured to accommodate a cooling fluid, and the vapor chamber comprising:
a first cover, having a contact surface, wherein the contact surface is configured to be in thermal contact with a heat source, and;
a second cover, wherein the second cover and the first cover are attached to each other to form a chamber therebetween, and the chamber is configured to accommodate the cooling fluid;
a first capillary structure, wherein the first capillary structure is located in the chamber and stacked on the first cover;
a second capillary structure, wherein the second capillary structure is located in the chamber and stacked on the first capillary structure, the second capillary structure is different from the first capillary structure, an entire projection of the second capillary structure onto the first cover is completely overlapped with a projection of the first capillary structure onto the first cover, there is an empty space located between the second cover and an entire surface of the second capillary structure opposite to the first capillary structure, the empty space has an entire projection onto the second cover not overlapped with a projection of the contact surface onto the second cover, and the empty space is configured for the cooling fluid to flow through;
a plurality of supporting posts, wherein each of the plurality of supporting posts is in direct contact with the first cover and the second cover at two opposite sides thereof; and
first and second irregularly-shaped hollow parts, formed through the first cover and the second cover, wherein the contact surface is located between the first and second irregularly-shaped hollow parts, and the second capillary structure surrounds the first irregularly-shaped hollow part.
2. The vapor chamber according to claim 1 , wherein the chamber has an evaporation area and a condensation area, the evaporation area is wider than the condensation area, a side of the second capillary structure is located in the condensation area, and another side of the second capillary structure extends towards the evaporation area.
3. The vapor chamber according to claim 2 , wherein the contact surface corresponds to the evaporation area, and the projection of the second capillary structure onto the first cover is located out of and substantially located next to the contact surface of the first cover.
4. The vapor chamber according to claim 3 , wherein the second capillary structure has a first curved section, a second curved section, and two extension sections, the first curved section and the second curved section are located opposite to each other, the first curved section is located in the condensation area, at least part of the second curved section is located in the evaporation area, a projection of the second curved section onto the first cover is located out of the contact surface of the first cover, the two extension sections are located opposite to each other, and the two extension sections are respectively located between and connected to the first curved section and the second curved section.
5. The vapor chamber according to claim 2 , wherein the second capillary structure abuts an inner seal part of the first cover located next to the first irregularly-shaped hollow part.
6. The vapor chamber according to claim 2 , wherein the second capillary structure abuts an outer seal part of the first cover located away from the first irregularly-shaped hollow part.
7. The vapor chamber according to claim 1 , wherein the second capillary structure is in thermal contact with the second cover.
8. The vapor chamber according to claim 1 , wherein the second capillary structure is spaced apart from the second cover.
9. The vapor chamber according to claim 1 , wherein the first capillary structure and the second capillary structure are made of different materials.
10. The vapor chamber according to claim 1 , wherein the first capillary structure and the second capillary structure are different in form.
11. The vapor chamber according to claim 10 , wherein the first capillary structure is in a form having mesh structure, and the second capillary structure is in a form having sintered powder structure.
12. The vapor chamber according to claim 10 , wherein the first capillary structure is a metal mesh, and the second capillary structure is made from sintered powder.
13. The vapor chamber according to claim 1 , wherein the first capillary structure is a metal mesh, and the second capillary structure is a metal mesh.
14. The vapor chamber according to claim 1 , wherein the first capillary structure is distributed throughout the chamber, and the second capillary structure is distributed in part of the chamber.
15. The vapor chamber according to claim 1 , wherein an orthogonal projection of the second capillary structure onto the first cover is smaller than an orthogonal projection of the first capillary structure onto the first cover.
16. A vapor chamber, configured to accommodate a cooling fluid, and the vapor chamber comprising:
a first cover, having a contact surface, wherein the contact surface is configured to be in thermal contact with a heat source, and;
a second cover, wherein the second cover and the first cover are attached to each other to form a chamber therebetween, and the chamber is configured to accommodate the cooling fluid;
a first capillary structure, wherein the first capillary structure is located in the chamber and stacked on the first cover;
a second capillary structure, wherein the second capillary structure is located in the chamber and stacked on the first capillary structure, the second capillary structure has a capability of transmitting the cooling fluid greater than that of the first capillary structure, an entire projection of the second capillary structure onto the first cover is completely overlapped with a projection of the first capillary structure onto the first cover, there is an empty space located between the second cover and an entire surface of the second capillary structure opposite to the first capillary structure, the empty space has an entire projection onto the second cover not overlapped with a projection of the contact surface onto the second cover, and the empty space is configured for the cooling fluid to flow through;
a plurality of supporting posts, wherein each of the plurality of supporting posts is in direct contact with the first cover and the second cover at two opposite sides thereof; and
first and second irregularly-shaped hollow parts, formed through the first cover and the second cover, wherein the contact surface is located between the first and second irregularly-shaped hollow parts, and the second capillary structure surrounds the first irregularly-shaped hollow part.
17. The vapor chamber according to claim 16 , wherein the chamber has an evaporation area and a condensation area, the evaporation area is wider than the condensation area, a side of the second capillary structure is located in the condensation area, and another side of the second capillary structure extends towards the evaporation area.
18. The vapor chamber according to claim 17 , wherein the contact surface corresponds to the evaporation area, and an orthogonal projection of the second capillary structure onto the first cover is located out of and substantially located next to the contact surface of the first cover.
19. The vapor chamber according to claim 18 , wherein the second capillary structure has a first curved section, a second curved section, and two extension sections, the first curved section and the second curved section are located opposite to each other, the first curved section is locate in the condensation area, at least part of the second curved section is located in the evaporation area, an orthogonal projection of the second curved section onto the first cover is located out of the contact surface of the first cover, the two extension sections are located opposite to each other, and the two extension sections are respectively located between and connected to the first curved section and the second curved section.
20. The vapor chamber according to claim 16 , wherein the second capillary structure is in thermal contact with the second cover.
21. The vapor chamber according to claim 16 , wherein the second capillary structure is spaced apart from the second cover.
22. The vapor chamber according to claim 16 , wherein the second capillary structure abuts an inner seal part of the first cover located next to the first irregularly-shaped hollow part.
23. The vapor chamber according to claim 16 , wherein the second capillary structure abuts an outer seal part of the first cover located away from the first irregularly-shaped hollow part.
24. The vapor chamber according to claim 16 , wherein the first capillary structure and the second capillary structure are made of different materials.
25. The vapor chamber according to claim 16 , wherein the first capillary structure and the second capillary structure are different in form.
26. The vapor chamber according to claim 25 , wherein the first capillary structure is in a form having mesh structure, and the second capillary structure is in a form having sintered powder structure.
27. The vapor chamber according to claim 16 , wherein the first capillary structure is a metal mesh, and the second capillary structure is made from sintered powder.
28. The vapor chamber according to claim 16 , wherein the first capillary structure is a metal mesh, and the second capillary structure is a metal mesh.
29. The vapor chamber according to claim 16 , wherein the first capillary structure is distributed throughout the chamber, and the second capillary structure is distributed in part of the chamber.