Temperature field device comprising a first drum, a second drum, and a filler inside the second drum and a space between the second drum and the first drum
View Patent ↗The present disclosure provides an open temperature field device, including a bottom plate, a drum, a filler, and a cover plate. The bottom plate may be mounted on a bottom of the temperature field device and cover an open end of the drum. The cover plate may be mounted on a top of the temperature field device and cover the other open end of the drum. The filler may be filled inside the drum. In the temperature field device, the filler filled inside the drum can form a new thermal insulation layer, which effectively prevents the problem of sudden temperature changes caused by the cracking of the drum and improves the stability performance and a count of reusable times of the temperature field device. Meanwhile, by adjusting the filling height and the tightness of the filler, the temperature gradient of the temperature field device can be adjusted.
1. A temperature field device, comprising:
a bottom plate, a first cover plate, a first drum, a second drum, and a filler, wherein:
the bottom plate is mounted on a bottom of the temperature field device and covers an end of the first drum, wherein
a thickness of the bottom plate is within 10-40 mm; and
a level requirement of the bottom plate is less than 0.5 mm/m, wherein the level requirement of the bottom plate refers to a height difference between two ends of the bottom plate per unit length;
the first cover plate is mounted on a top of the temperature field device and covers the other end of the first drum, wherein the first cover plate includes:
a first through hole configured to allow a gas to enter into the temperature field device, wherein a diameter of the first through hole is within 15-30 mm;
a second through hole configured to allow the gas to exit from the temperature field device, wherein a diameter of the second through hole is within 15-30 mm and a distance between the first through hole and the second through hole is within 70-150 mm; and
a third through hole configured to allow a pulling rod to enter into or exit from the temperature field device, wherein the third through hole is located between the first through hole and the second through hole;
the second drum is mounted inside the first drum; and
the filler is filled inside the second drum and a space between the second drum and the first drum;
wherein a concentricity among the first drum, the second drum, and the bottom plate is less than 1 mm; and
a perpendicularity among the first drum, the second drum, and the bottom plate is less than 0.2°.
2. The temperature field device of claim 1 , wherein the filler inside the second drum is at least configured to support a crucible and cover a portion of the crucible.
3. The temperature field device of claim 2 , wherein an upper edge of the crucible is higher than a filling height of the filler located inside the second drum.
4. The temperature field device of claim 2 , wherein a filling height of the filler results in that a vertical distance between an upper edge of the crucible and an upper edge of an induction coil mounted outside the temperature field device is 0 mm˜∓50 mm, wherein “−” represents that the upper edge of the crucible is lower than the upper edge of the induction coil, and “+” represents that the upper edge of the crucible is higher than the upper edge of the induction coil.
5. The temperature field device of claim 1 , wherein
the filler includes a granule shaped material, a brick shaped material, and/or a felt shaped material; and
the filler is made of a heat resistant material.
6. The temperature field device of claim 1 , wherein the filler includes at least one of a zircon sand, a zirconia particle, an alumina particle, a zirconia felt, a zirconia brick, or an alumina brick.
7. The temperature field device of claim 1 , wherein a particle size of the filler is 5 mesh˜200 mesh, 50 mesh˜150 mesh, or 80 mesh˜120 mesh.
8. The temperature field device of claim 1 , wherein
the first drum includes a quartz tube or a corundum tube; or
the first drum is made of a heat resistant material.
9. The temperature field device of claim 1 , wherein
a thickness of the first drum is 1 mm˜15 mm, and
a height of the first drum is 600 mm˜1600 mm.
10. The temperature field device of claim 1 , further comprising a second cover plate, wherein
the second cover plate is mounted inside the first drum and covers an open end of the second drum near the first cover plate; and
the second cover plate includes two through holes corresponding to the first through hole and the second through hole on the first cover plate.
11. The temperature field device of claim 10 , wherein
the second cover plate includes an alumina plate or a zirconia plate; or
the second cover plate is made of a heat resistant material.
12. The temperature field device of claim 1 , wherein an observation unit is mounted above the first through hole or the second through hole, the observation unit including:
a chamber connected with the first through hole or the second through hole;
a fourth through hole connected with the chamber, the fourth through hole being configured to allow the gas to enter into or to exit from the temperature field device; and
an observation window.
13. The temperature field device of claim 12 , wherein the observation window is mounted on a top of the observation unit.
14. The temperature field device of claim 1 , wherein the bottom plate or the first cover plate includes at least one circulating coolant channel mounted inside the bottom plate or the first cover plate.
15. The temperature field device of claim 14 , wherein a shape of the at least one circulating coolant channel includes a spiral shape or a snake shape.
16. The temperature field device of claim 14 , wherein a cooling manner of the at least one circulating coolant channel includes a liquid cooling, a wind cooling, or a gas cooling.
17. The temperature field device of claim 1 , wherein a thickness of the first cover plate is within 10-40 mm.
18. The temperature field device of claim 10 , wherein a thickness of the second cover plate is within 20-35 mm.
19. The temperature field device of claim 1 , wherein a thickness of the second drum is within 8-30 mm.