Organic substance-attached porous inorganic oxide particle
An organic substance-attached porous inorganic oxide particle including porous inorganic oxide particle and an organic substance attached to the surface of the porous inorganic oxide particle. The organic substance-attached porous inorganic oxide particle satisfies a formula below ( Cf−Ce )/2>1 where Cf represents the amount of carbon (atom %) measured by subjecting the surface of the particle to X-ray photoelectron spectroscopy (XPS) after the particle is washed, and Ce represents the amount of carbon (atom %) measured by subjecting the surface of the particle to X-ray photoelectron spectroscopy (XPS) after two-minute surface etching of the particle.
1. An organic substance-attached porous inorganic oxide particle comprising:
a porous inorganic oxide particle; and
an organic substance attached to a surface of the porous inorganic oxide particle,
wherein the organic substance-attached porous inorganic oxide particle satisfies a formula below
( Cf−Ce )/2>1
where Cf represents the amount of carbon (atom %) measured by subjecting the surface of the particle to X-ray photoelectron spectroscopy (XPS) after the organic substance-attached porous inorganic oxide particle is washed, and Ce represents the amount of carbon (atom %) measured by subjecting the surface of the washed organic substance-attached porous inorganic oxide particle to X-ray photoelectron spectroscopy (XPS) after two-minute surface etching of the particle,
wherein the organic substance-attached porous inorganic oxide particle is washed by mixing the organic substance-attached porous inorganic oxide particle with tetrahydrofuran (THF) to form a mixture, subjecting the mixture to a dispersion treatment, and centrifuging the mixture, followed by removing a supernatant to obtain the washed organic substance-attached porous inorganic oxide particle, and
the washed organic substance-attached porous inorganic oxide particle is surface etched for two minutes by an argon monomer etching method using argon as an etching gas.
2. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein the organic substance-attached porous inorganic oxide particle satisfies a formula below:
( Cf−Ce )/2≥1.5.
3. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein the porous inorganic oxide particles have a number average particle diameter within a range of 7 nm to 150 nm.
4. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein the porous inorganic oxide particles have a number average particle diameter within a range of 7 nm to 60 nm.
5. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein the porous inorganic oxide particle is a gas-phase method silica particle.
6. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein the organic substance is oil.
7. The organic substance-attached porous inorganic oxide particle according to claim 6 , wherein the oil is unreactive silicone oil.
8. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein an amount of the organic substance attached relative to the porous inorganic oxide particle after washing is 4 mass % or higher and 8 mass % or lower.
9. The organic substance-attached porous inorganic oxide particle according to claim 1 , wherein an amount of the organic substance attached relative to the porous inorganic oxide particle after washing is 3 mass % or higher and 6 mass % or lower.