Thermopile module
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
1. An electronic device, comprising:
an outer case having an opening;
a circuit substrate disposed inside the outer case;
a thermopile sensor chip disposed on the circuit substrate;
a filter structure disposed above the thermopile sensor chip; and
a waterproof structure surroundingly connected between the filter structure and the outer case.
2. The electronic device as claimed in claim 1 , wherein the thermopile sensor chip is electrically connected to the circuit substrate by wire-bonding or flip-chip bonding.
3. The electronic device as claimed in claim 1 , wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
4. The electronic device as claimed in claim 3 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.
5. The electronic device as claimed in claim 3 , wherein the filter structure has a filter covering portion and a filter supporting portion, the filter covering portion is suspended above the thermopile sensor chip and connected to the waterproof structure, and the filter supporting portion is extended downwardly from the filter covering portion to contact the circuit substrate for supporting the filter covering portion.
6. The electronic device as claimed in claim 3 , further comprising a support structure disposed between the circuit substrate and the waterproof structure for supporting the waterproof structure.
7. The electronic device as claimed in claim 6 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.
8. The electronic device as claimed in claim 1 , wherein the waterproof structure disposed on the circuit substrate for encapsulating the thermopile sensor chip and the filter structure.
9. The electronic device as claimed in claim 1 , wherein the waterproof structure includes a first waterproofing element, a second waterproofing element, and a support structure, the first waterproofing element is surroundingly connected onto the filter structure, the second waterproofing element is surroundingly connected onto the outer case, the support structure is disposed between the first waterproofing element and the second waterproofing element, and the support structure has a first support portion connected between the first waterproofing element and the second waterproofing element and a second support portion extended downwardly from the first support portion to contact the circuit substrate for supporting the second waterproofing element.
10. The electronic device as claimed in claim 3 , wherein the filter structure has a filter covering portion and a filter supporting portion, the filter covering portion is suspend above the thermopile sensor chip and connected to the waterproof structure, and the filter supporting portion is extended downwardly from the filter covering portion to contact the circuit substrate for supporting the filter covering portion.
11. The electronic device as claimed in claim 3 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.
12. An electronic device, comprising:
an outer case having an opening;
a circuit substrate disposed inside the outer case;
a thermopile sensor chip disposed on the circuit substrate; and
a waterproof structure disposed on the outer case.
13. The electronic device as claimed in claim 12 , wherein the thermopile sensor chip is electrically connected to the circuit substrate by wire-bonding or flip-chip bonding.
14. The electronic device as claimed in claim 13 , wherein the waterproof structure is a filter structure disposed above the thermopile sensor chip.
15. The electronic device as claimed in claim 12 , further comprising an isolation structure surroundingly connected onto the filter structure, and the isolation structure having an aperture for exposing the filter structure.
16. The electronic device as claimed in claim 13 , further comprising a filter structure disposed on the thermopile sensor chip.
17. The electronic device as claimed in claim 12 , wherein the waterproof structure is an infrared pass structure disposed above the filter structure.