Systems and methods for semiconductor chip surface topography metrology

1. A method for measuring a surface topography of a semiconductor chip, comprising:

measuring, by using an interferometer, a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip;

transforming, by at least one processor, the plurality of interference signals into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip;

classifying, by the at least one processor, the plurality of spectrum signals into a plurality of categories using a model, wherein each of the categories corresponds to a region having a same material on the surface of the semiconductor chip;

determining, by the at least one processor, a surface height offset associated with at least one of the categories by calculating a height difference between a first height and a second height measured in a region associated with the at least one of the categories, wherein the first height is measured based on the interference signals, and the second height is measured based on calibration signals that provide a higher accuracy than the interference signals in determining a topographic height of the at least one of the categories; and

characterizing, by the at least one processor, the surface topography of the semiconductor chip based, at least in part, on the surface height offset and the interference signals.

2. The method of claim 1 , wherein each of the interference signals comprises an interference fringe of low coherent interferometry, and each of the spectrum signals comprises a reflectance spectrum.

3. The method of claim 1 , wherein at least part of the surface of the semiconductor chip comprises a transparent layer.

4. The method of claim 1 , wherein each of the interference signals is associated with an original surface height at the respective position.

5. The method of claim 4 , wherein characterizing the surface topography of the semiconductor chip comprises calculating a calibrated surface height at one of the positions on the surface of the semiconductor chip based, at least in part, on the corresponding original surface height and the surface height offset.

6. The method of claim 1 , wherein the model comprises a classification model.

7. The method of claim 1 , wherein classifying the plurality of spectrum signals comprises:

clustering the plurality of spectrum signals into a plurality of clusters; and

adjusting the plurality of clusters to become the plurality of categories based, at least in part, on a design of the semiconductor chip, such that each of the categories corresponds to the respective region having the same material.

8. The method of claim 1 , wherein determining the surface height offset further comprises:

designating a surface baseline to a baseline region corresponding to one of the categories;

determining the first height associated with the at least one of the categories based on a height difference measured for the baseline region and the region associated with the at least one of the categories based on the interference signals; and

determining the second height associated with the at least one of the categories based on a height difference measured for the baseline region and the region associated with the at least one of the categories based on the calibration signals.

9. The method of claim 8 , wherein each of the calibration signals is associated with a topographic height determined by a scanning probe microscopy (SPM) or an electron microscope.

10. The method of claim 1 , further comprising:

generating an original height map based, at least in part, on the received interference signals;

generating a spectrum map based, at least in part, on the transformed spectrum signals;

transforming the spectrum map into a classification map based, at least in part, on the classified spectrum signals and the categories; and

generating a calibrated height map from the original height map based, at least in part, on the surface height offset and the classification map.

11. The method of claim 1 , wherein the plurality of interference signals are transformed into the plurality of spectrum signals using Fourier transform.

12. A system for measuring a surface topography of a semiconductor chip, comprising:

an interferometer configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip;

a scanning probe microscopy (SPM) or an electron microscope configured to provide a plurality of calibration signals; and

at least one processor configured to:

transform the plurality of interference signals into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip;

classify the spectrum signals into a plurality of categories using a model, wherein each of the categories corresponds to a region having a same material on the surface of the semiconductor chip;

determine a surface height offset associated with at least one of the categories by calculating a height difference between a first height and a second height measured in a region associated with the at least one of the categories, wherein the first height is measured based on the interference signals, and the second height is measured based on calibration signals that provide a higher accuracy than the interference signals in determining a topographic height of the at least one of the categories; and

characterize the surface topography of the semiconductor chip based, at least in part, on the surface height offset and the interference signals.

13. The system of claim 12 , wherein

the interferometer includes a low coherent interferometer, and each of the interference signals comprises an interference fringe of low coherent interferometry; and

each of the spectrum signals comprises a reflectance spectrum.

14. The system of claim 12 , wherein each of the interference signals is associated with an original surface height at the respective position.

15. The system of claim 14 , wherein to characterize the surface topography of the semiconductor chip, the at least one processor is further configured to calculate a calibrated surface height at one of the positions on the surface of the semiconductor chip based, at least in part, on the corresponding original surface height and the surface height offset.

16. The system of claim 12 , wherein the model comprises a classification model.

17. The system of claim 12 , wherein to classify the plurality of spectrum signals, the at least one processor is further configured to:

cluster the plurality of spectrum signals into a plurality of clusters; and

adjust the plurality of clusters to become the plurality of categories based, at least in part, on a design of the semiconductor chip, such that each of the categories corresponds to the respective region having the same material.

18. The system of claim 12 , wherein to determine the surface height offset, the at least one processor is further configured to:

designate a surface baseline to a baseline region corresponding to one of the categories;

determine the first height associated with the at least one of the categories based on a height difference measured for the baseline region and the region associated with the at least one of the categories based on the interference signals; and

determine the second height associated with the at least one of the categories based on a height difference measured for the baseline region and the region associated with the at least one of the categories based on the calibration signals.

19. The system of claim 12 , wherein the plurality of interference signals are transformed into the plurality of spectrum signals using Fourier transform.

20. A non-transitory computer-readable storage device having instructions stored thereon that, when executed by at least one computing device, causes the at least one computing device to perform operations comprising:

receiving a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip, wherein the interference signals are measured using an interferometer;

transforming the plurality of interference signals into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip;

classifying the spectrum signals into a plurality of categories using a model, wherein each of the categories corresponds to a region having a same material on the surface of the semiconductor chip;

determining a surface height offset associated with at least one of the categories by calculating a height difference between a first height and a second height measured in a region associated with the at least one of the categories, wherein the first height is measured based on the interference signals, and the second height is measured based on calibration signals that provide a higher accuracy than the interference signals in determining a topographic height of the at least one of the categories; and

characterizing a surface topography of the semiconductor chip based, at least in part, on the surface height offset and the interference signals.