Semiconductor memory device
A semiconductor memory device includes a substrate including a peripheral circuit, a stepped dummy stack overlapping the substrate and including a plurality of steps extending in a first direction, a plurality of contact groups passing through the stepped dummy stack, and upper lines respectively connected to the contact groups. The contact groups include a first contact group having two or more first contact plugs arranged in the first direction. The upper lines include a first upper line commonly connected to the first contact plugs.
1. A semiconductor memory device comprising:
a substrate including a peripheral circuit;
a stepped dummy stack overlapping the substrate and including a plurality of steps;
a plurality of contact groups passing through the stepped dummy stack; and
upper lines respectively connected to the contact groups,
wherein the contact groups include a first contact group having two or more first contact plugs, and
the upper lines include a first upper line commonly connected to the two or more first contact plugs, the two or more first contact plugs arranged in an extending direction of a corner defined at a boundary between adjacent steps among the steps.
2. The semiconductor memory device of claim 1 , wherein the first contact plugs pass through the corner.
3. The semiconductor memory device of claim 1 , further comprising:
a gate stack disposed on the substrate and including interlayer insulating films and conductive patterns that surround a channel structure and are alternately stacked; and
a gate contact plug connecting any one of the conductive patterns to the first upper line.
4. The semiconductor memory device of claim 1 , wherein the contact groups include a second contact group having two or more second contact plugs arranged in the extending direction of the corner, and
the upper lines further include a second upper line commonly connected to the second contact plugs.
5. The semiconductor memory device of claim 4 , wherein the second contact plugs are spaced apart from sidewalls of the steps.
6. The semiconductor memory device of claim 4 , further comprising:
A gate stack disposed on the substrate and including interlayer insulating films and conductive patterns that surround a channel structure and are alternately stacked; and
a gate contact plug connecting any one of the conductive patterns to the second upper line.
7. The semiconductor memory device of claim 4 ,
wherein the plurality of steps comprises, sequentially, a first step, a second step, and a third step,
wherein the first contact plugs of the first contact group overlap a boundary between the first and second steps adjacent to each other, and
wherein the second contact plugs of the second contact group overlap the third step.
8. The semiconductor memory device of claim 4 , further comprising:
a first gate stack disposed on the substrate and including first interlayer insulating films and first conductive patterns that surround a first channel structure and are alternately stacked;
a first gate contact plug connecting any one of the first conductive patterns to the first upper line;
a second gate stack disposed on the substrate and including second interlayer insulating films and second conductive patterns that surround a second channel structure and are alternately stacked;
a second gate contact plug connecting any one of the second conductive patterns to the second upper line; and
a slit separating the first gate stack and the second gate stack,
wherein the stepped dummy stack comprises oxide films and nitride films alternately stacked on the substrate and the oxide films and the nitride films of the stepped dummy stack are separated from the first and second gate stacks by the slit.
9. The semiconductor memory device of claim 8 ,
wherein the stepped dummy stack is located between the first and second gate stacks.
10. The semiconductor memory device of claim 1 , wherein the stepped dummy stack includes oxide films and nitride films alternately stacked on the substrate.
11. A semiconductor memory device comprising:
a substrate including a peripheral circuit;
a stepped dummy stack overlapping the substrate and including a plurality of steps extending in a first direction;
a first contact plug and a second contact plug that pass through the stepped dummy stack and are adjacent to each other in a diagonal direction with respect to the first direction, in a plane parallel to the steps;
a first upper line connected to the first contact plug; and
a second upper line connected to the second contact plug and spaced apart from the first upper line,
wherein the first contact plug and the second contact plug are connected to the peripheral circuit.
12. The semiconductor memory device of claim 11 , wherein the first contact plug and the second contact plug pass through steps of the plurality of steps, and the steps are different from each other.
13. The semiconductor memory device of claim 11 , further comprising:
a first gate stack disposed on the substrate and including interlayer insulating films and conductive patterns that surround a channel structure and are alternately stacked; and
a first gate contact plug connecting any one of the conductive patterns to the first upper line.
14. The semiconductor memory device of claim 13 , further comprising:
a second gate stack disposed on the substrate and including interlayer insulating films and conductive patterns that surround a channel structure and are alternately stacked; and
a second gate contact plug connecting any one of the conductive patterns to the second upper line.
15. The semiconductor memory device of claim 11 , wherein the stepped dummy stack includes oxide films and nitride films alternately stacked on the substrate.
16. A semiconductor memory device comprising:
a substrate including a peripheral circuit;
a first gate stack overlapping the substrate;
a second gate stack overlapping the substrate and substantially parallel to the first gate stack;
a stepped dummy stack disposed between the first gate stack and the second gate stack and including a plurality of steps extending in a first direction;
a plurality of contact groups overlapping steps of the plurality of steps that are different from each other, and extending to pass through the stepped dummy stack;
a first gate contact plug connected to the first gate stack;
a second gate contact plug connected to the second gate stack;
a first upper line connecting a first contact group among the contact groups and the first gate contact plug to each other; and
a second upper line connecting a second contact group among the contact groups and the second gate contact plug to each other.
17. The semiconductor memory device of claim 16 , wherein the first contact group includes two or more first contact plugs arranged in the first direction and commonly connected to the first upper line.
18. The semiconductor memory device of claim 16 , wherein the second contact group includes two or more second contact plugs arranged in the first direction and commonly connected to the second upper line.
19. The semiconductor memory device of claim 16 , wherein the first contact group and the second contact group are adjacent to each other in a diagonal direction with respect to the first direction, in a plane parallel to the steps.
20. The semiconductor memory device of claim 16 , wherein each of the first gate stack and the second gate stack is disposed on the substrate, surrounds a channel structure, and includes interlayer insulating films and conductive patterns alternately stacked.
21. The semiconductor memory device of claim 16 , wherein the stepped dummy stack includes oxide films and nitride films alternately stacked on the substrate.