Silicon carbide ingot, method of preparing the same, and method for preparing silicon carbide wafer
A SiC ingot includes: a main body including a first cross-sectional plane of the main body and a second cross-sectional plane of the main body facing the first cross-sectional plane; and a protrusion disposed on the second cross-sectional plane and including a convex surface from the second cross-sectional plane of the main body, wherein a first end point disposed at one end of the second cross sectional plane, a second end point disposed at another end of the second cross sectional plane, and a peak point disposed on the convex surface are disposed on a third cross-sectional plane of the main body perpendicular to the first cross-sectional plane, and wherein a radius of curvature of an arc corresponding to a line of intersection between the third cross-sectional plane and the convex surface satisfies Equation 1 below: 3 D≤r ≤37 D [Equation 1] where r is the radius of curvature of the arc corresponding to the line of intersection between the third cross-sectional plane and the convex surface, and D is a length of a line of intersection between the first cross-sectional plane and the third cross-sectional plane.
1. A SiC ingot, comprising:
a main body comprising a first cross-sectional plane of the main body and a second cross-sectional plane of the main body facing the first cross-sectional plane; and
a protrusion disposed on the second cross-sectional plane and comprising a convex surface,
wherein the SiC ingot comprises a first reference line perpendicular to the first cross-sectional plane of the main body and passing through a center of the first cross-sectional plane of the main body, a second reference line parallel to the first reference line and in contact with an edge of the protrusion disposed farthest from the first reference in a vertical distance, a third reference line parallel to the first cross-sectional plane of the main body and passing through a contact point between the edge of the protrusion and the second reference line, and a fourth reference line passing through the contact point and a peak point of the convex surface, and
wherein an angle between the third reference line and the fourth reference line is 3.2 degree to 5 degree.
2. The SiC ingot of claim 1 , wherein the SiC ingot comprises a 4H-SiC crystal structure, and a locking angle of a wafer prepared from the SiC ingot with an off angle to a (0001) plane of the SiC ingot set as 0 to 10 degree is −1.5 degree to +1.5 degree relative to a reference angle.
3. The SiC ingot of claim 1 , wherein a number of pits on a surface of the SiC ingot is 10,000/cm 2 or less.
4. A method for preparing a SiC wafer comprising:
grinding edges of the SiC ingot of claim 1 ; and
preparing the SiC wafer by cutting the ground SiC ingot.