Method for preparing SiC ingot, method for preparing SiC wafer and the SiC wafer prepared therefrom
A method for preparing a SiC ingot includes: preparing a reactor by disposing a raw material in a crucible body and disposing a SiC seed in a crucible cover, and then wrapping the crucible body with a heat insulating material having a density of 0.14 to 0.28 g/cc; and growing the SiC ingot from the SiC seed by placing the reactor in a reaction chamber and adjusting an inside of the reactor to a crystal growth atmosphere such that the raw material is vapor-transported and deposited to the SiC seed.
1. A SiC wafer comprising:
a plurality of measuring points distributed on a surface of the wafer at regular intervals of 10 mm or less; and
a target area on the surface of the wafer inside of a circle having a radius of 70% of a radius of the wafer;
wherein the plurality of measuring points are within the target area,
wherein a rocking curve of the plurality of measuring points has a peak and a full width at half maximum,
wherein an average value of an omega angle is an average of omega angles of the peaks of the plurality of measuring points,
wherein the full width at half maximum is a value based on the average value of the omega angle, and
wherein more than 95% of the plurality of measuring points have the full width at half maximum of −1.5 to 1.5 degree.
2. The SiC wafer of claim 1 , wherein more than 96% of the plurality of measuring points have the full width at half maximum of −1.0 to 1.0 degree.
3. The SiC wafer of claim 1 , wherein more than 97% of the plurality of measuring points have the full width at half maximum of −0.5 to 0.5 degree.
4. The SiC wafer of claim 1 , wherein more than 98% of the plurality of measuring points have the full width at half maximum of −0.05 to 0.05 degree.
5. The SiC wafer of claim 1 , wherein the target area comprises one or more measuring point per 1 cm 2 .
6. The SiC wafer of claim 1 , wherein the target area is on the surface of the wafer inside of a circle having a radius of 80% of the radius of the wafer.
7. The SiC wafer of claim 1 , comprising:
wherein an omega angle of one of the plurality of measuring points is an omega angle measured at the peak of the one of the plurality of measuring points, and
wherein a first measuring point is a point having a maximum omega angle, a second measuring point is a point having a minimum omega angle, and a difference between the omega angle of the first measuring point and the omega angle of the second measuring point is 0.5 degree or less.