Optical image stabilization (OIS) unit of a camera module

1. An Optical Image Stabilization (OIS) unit comprising;

a base;

a first substrate disposed on the base and comprising a terminal;

a holder module spaced apart from the base and comprising an outer blade, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;

a first coil disposed on the bobbin;

a magnet facing the first coil;

a second coil facing the magnet;

a wire coupled with the holder module;

a first connection unit fixing a first end portion of the wire;

a second connection unit fixing a second end portion of the wire; and

a buffer portion disposed on a part of the wire and comprising an adhesive material,

wherein the holder module comprises first, second, third and fourth corner portions,

wherein the first coil is electrically connected with the wire,

wherein the wire is disposed on the first, second, third and fourth corner portions of the holder module,

wherein the wire comprises six wires spaced apart from each other,

wherein two wires of the six wires are disposed on the first corner portion, and another two wires of the six wires are disposed on the third corner portion,

wherein at least a portion of the buffer portion is disposed between the first connection unit and the outer blade, and

wherein, in a direction perpendicular to the wire, a maximum width of the buffer portion is greater than a maximum width of the first connection unit.

2. The OIS unit of claim 1 , wherein the first substrate comprises a first portion disposed above the base and a second portion bent from the first portion.

3. The OIS unit of claim 1 , wherein two wires of the six wires are electrically connected with the first coil.

4. The OIS unit of claim 1 , wherein the two wires disposed on the first corner portion are electrically connected with the first coil.

5. The OIS unit of claim 1 , wherein the terminal comprises a plurality of terminals, and

wherein the six wires are electrically connected to different terminals of the plurality of terminals, respectively.

6. The OIS unit of claim 1 , wherein the first corner portion and the third corner portion are disposed opposite to each other based on an optical axis, and

wherein at least the portion of the buffer portion is disposed under the first connection unit.

7. The OIS unit of claim 1 , wherein the buffer portion is configured to absorb a shock or load applied to the wire,

wherein the spring member comprises an upper spring coupled to an upper portion of the bobbin and a lower spring coupled to a lower portion of the bobbin,

wherein the first connection unit is disposed nearer to the upper spring than the lower spring, and

wherein the second connection unit is disposed nearer to the lower spring than the upper spring.

8. The OIS unit of claim 2 , wherein the wire connects the holder module and the first portion of the first substrate.

9. The OIS unit of claim 2 , wherein the first substrate comprises a pad disposed on the first portion and a hole disposed in a center area of the pad, and

wherein the wire passes through the hole and is coupled to the pad by a solder.

10. The OIS unit of claim 9 , wherein a solder resistor is disposed on a periphery of the pad to form an outer surface of the first substrate.

11. The OIS unit of claim 2 , wherein the first connection unit is a first solder portion, and the second connection unit is a second solder portion, and

wherein a distance between the first solder portion and the second solder portion is greater than a distance between the first portion of the first substrate and the spring member.

12. The OIS unit of claim 2 , wherein the first portion of the first substrate comprises a first surface facing the holder module and a second surface disposed opposite to the first surface, and

wherein the wire is coupled to the second surface of the first portion of the first substrate.

13. The OIS unit of claim 11 , wherein a part of the buffer portion is disposed between the first solder portion and the second solder portion.

14. A camera module, comprising:

a printed circuit board (PCB);

an image sensor disposed on the PCB;

the OIS unit of claim 1 disposed on the PCB; and

a lens coupled to the bobbin of the OIS unit and being spaced apart from the image sensor.

15. A mobile phone, comprising the camera module of claim 14 .

16. An Optical Image Stabilization (OIS) unit comprising;

a base;

a substrate disposed on the base and comprising a plurality of terminals;

a holder module spaced apart from the base and comprising an outer blade, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;

a first coil disposed on the bobbin;

a magnet facing the first coil;

a second coil facing the magnet;

a wire coupled with the holder module;

a first connection unit fixing a first end portion of the wire, and a second connection unit fixing a second end portion of the wire; and

an adhesive material disposed on a part of the wire,

wherein the holder module comprises first, second, third and fourth corner portions,

wherein the first coil is electrically connected with the wire,

wherein the wire is disposed on the first, second, third and fourth corner portions of the holder module,

wherein the wire comprises a plurality of wires spaced apart from each other,

wherein two wires of the plurality of wires are disposed on the first corner portion, and another two wires of the plurality of wires are disposed on the third corner portion,

wherein the two wires disposed on the first corner portion are electrically respectively connected with different terminals of the plurality of terminals, and

wherein at least a portion of the adhesive material is disposed between the first connection unit and the outer blade.

17. The OIS unit of claim 16 , wherein the wire connects the holder module and the substrate,

wherein the substrate comprises a pad and a hole disposed in a center area of the pad,

wherein the wire passes through the hole and is coupled to the pad by a solder,

wherein the plurality of terminals of the substrate comprises at least six terminals for supplying a current to the first coil and the second coil,

wherein the first coil is electrically connected with the spring member,

wherein the two wires disposed on the first corner portion are disposed at a same distance with respect to an optical axis, and

wherein the first corner portion and the third corner portion are disposed opposite to each other based on the optical axis.

18. The OIS unit of claim 16 , wherein the spring member comprises an upper spring coupled to an upper portion of the bobbin and a lower spring coupled to a lower portion of the bobbin, and

wherein the adhesive material is disposed nearer to the upper spring than the lower spring.

19. The OIS unit of claim 16 , wherein the adhesive material is contacted with any one of the first connection unit and the second connection unit.

20. The OIS unit of claim 16 , wherein, in a direction perpendicular to the wire, a maximum width of the adhesive material is greater than a maximum width of the first connection unit.

21. The OIS unit of claim 18 , wherein the first connection unit is disposed nearer to the upper spring than the lower spring, and

wherein the second connection unit is disposed nearer to the lower spring than the upper spring.

22. The OIS unit of claim 16 , wherein at least the portion of the buffer portion is disposed under the first connection unit.