Semiconductor structure and method of fabricating the same
A semiconductor structure and a method for fabricating the same are disclosed. A semiconductor structure includes a first substrate, a package, a second substrate, and a lid. The package is attached to a first side of the first substrate. The second substrate is attached to a second side of the first substrate. The lid is connected to the first substrate and the second substrate. The lid includes a ring part over the first side of the first substrate. The ring part and the first substrate define a space and the package is accommodated in the space. The lid further includes a plurality of overhang parts which extend from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate.
1. A semiconductor structure, comprising:
a first substrate comprising a first side and a second side opposite to the first side;
a package attached to the first side of the first substrate;
a second substrate attached to the second side of the first substrate; and
a lid connected to the first substrate and the second substrate, wherein the lid comprises:
a ring part over the first side of the first substrate, wherein the ring part and the first substrate define a space and the package is accommodated in the space; and
a plurality of overhang parts extended from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate,
a plurality of electrical connectors connecting the second side of the first substrate to the second substrate, wherein the plurality of overhang parts are laterally aside a portion of the plurality of electrical connectors.
2. The semiconductor structure of claim 1 , wherein the plurality of overhang parts are substantially conformal to the corner sidewalls of the first substrate.
3. The semiconductor structure of claim 2 , wherein the plurality of overhang parts have L-like shapes.
4. The semiconductor structure of claim 1 , wherein one of the plurality of overhang parts has a bottom surface, and an area of the bottom surface is less than an area of a bottom surface of the ring part.
5. The semiconductor structure of claim 1 , further comprising:
a first adhesive connecting the ring part of the lid to the first substrate; and
a plurality of second adhesives connecting the plurality of overhang parts of the lid to the second substrate.
6. The semiconductor structure of claim 5 , wherein the plurality of electrical connectors are spaced apart from the plurality of second adhesives.
7. The semiconductor structure of claim 5 , wherein the first adhesive is further connecting inner sidewalls of the plurality of overhang parts to corner sidewalls of the first substrate.
8. The semiconductor structure of claim 1 , wherein the package comprises:
an interposer substrate;
a first die bonded to the interposer;
a second die adjacent the first die and bonded to the interposer, wherein the first die and the second die have different power consumption; and
an encapsulate encapsulating the first die and the second die.
9. A semiconductor structure, comprising:
a first substrate comprising a first side, and a second side opposite to the first side;
a package attached to the first side of the first substrate;
a second substrate attached to the second side of the first substrate; and
a lid connected to the first substrate and the second substrate, the lid comprising:
a cap part;
a ring part over the first side of the first substrate and extended from a bottom surface of the cap part toward the first substrate, wherein the ring part, the cap part and the first substrate define a space, and the package is accommodated in the space; and
a plurality of overhang parts extended from the corner sidewalls of the cap part toward the second substrate to cover corner sidewalls of the first substrate,
a plurality of electrical connectors connecting the second side of the first substrate to the second substrate, wherein the plurality of overhang parts are laterally aside a portion of the plurality of electrical connectors.
10. The semiconductor structure of claim 9 , wherein the cap part covers a top surface of the package, and a void is between the package, the ring part and the cap part.
11. The semiconductor structure of claim 9 , wherein the cap part has an opening exposing a top surface of the package.
12. The semiconductor structure of claim 9 , wherein the lid further comprises a plurality of protrusion parts extending from outer sidewalls of the plurality of overhang parts toward edges of the second substrate.
13. The semiconductor structure of claim 12 , further comprising:
a first adhesive connecting the ring part of the lid to the first substrate; and
a plurality of second adhesives connecting the plurality of overhang parts of the lid to the second substrate.
14. The semiconductor structure of claim 13 , wherein the plurality of protrusion parts are further connected to the second substrate by the plurality of second adhesives.
15. The semiconductor structure of claim 9 , wherein the plurality of overhang parts are substantially conformal to the corner sidewalls of the first substrate.
16. The semiconductor structure of claim 9 , wherein the package comprises:
an interposer substrate;
a first die bonded to the interposer;
a second die adjacent the first die and bonded to the interposer, wherein the first die and the second die have different power consumption; and
an encapsulate encapsulating the first die and the second die.
17. The semiconductor structure of claim 9 , wherein one of the plurality of overhang parts has a bottom surface, and an area of the bottom surface is less than an area of a bottom surface of the ring part.
18. A semiconductor structure, comprising:
a first substrate comprising a first side and a second side opposite to the first side;
a package attached to the first side of the first substrate;
a second substrate attached to the second side of the first substrate; and
a lid connected to the first substrate and the second substrate, wherein the lid comprises:
a ring part over the first side of the first substrate, wherein the ring part and the first substrate define a space and the package is accommodated in the space; and
a plurality of overhang parts extended from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate,
wherein the plurality of overhang parts are substantially conformal to the corner sidewalls of the first substrate.
19. The semiconductor structure of claim 18 , wherein the plurality of overhang parts have L-like shapes.
20. The semiconductor structure of claim 19 , wherein the lid further comprises a cap part, the ring part extends from a bottom surface of the cap part toward the first substrate, and the ring part, the cap part and the first substrate define the space.