IP Library Granted Patent US 11,195,714
Granted Patent B2
US 11,195,714 · App. 16/922,010 · Granted Dec 7, 2021

Pattern-forming method

Inventors: Hitoshi Osaki (Tokyo, JP); Jeffrey Kmiec (Sunnyvale, CA)
Assignee: JSR CORPORATION
H01L21/0228H01L21/30604
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Quick Facts
Patent No.
US 11,195,714
App. No.
16/922,010
Granted
Dec 7, 2021
Kind
B2
Abstract

A pattern-forming method includes forming a patterned coating film on a part of a surface layer of a base. The surface layer includes regions each of which includes a material that differs from each other. A part of the regions is the part of the surface layer on which the patterned coating film is formed. The patterned coating film includes a first polymer including at an end of a main chain or a side chain thereof a group including a first functional group that is capable of bonding to an atom present in the part of the region. An atom layer is directly or indirectly formed on the surface layer of the base by a vapor deposition, after the forming of the patterned coating film.

Claims (23)

1. A pattern-forming method comprising:

forming a patterned coating film on a part of a surface layer of a base, the surface layer comprising a plurality of regions, each region comprising a material that differs from each other, wherein the part of the surface layer, on which the patterned coating film is formed, is a part of the plurality of regions, the patterned coating film comprises a first polymer, and the first polymer comprises: a main chain which comprises a structural unit derived from at least one selected from the group consisting of a vinyl aromatic compound, a (meth)acrylic acid, and a (meth)acrylic acid ester; and at an end of a main chain or a side chain thereof, a group comprising a first functional group that is capable of bonding to an atom present in the part of the plurality of regions; and

forming an atom layer directly or indirectly on the surface layer of the base by a vapor deposition, after the forming of the patterned coating film.

2. The pattern-forming method according to claim 1 , wherein the plurality of regions comprise: a first region comprising a metal simple substance; and a second region comprising silicon oxide.

3. The pattern-forming method according to claim 1 , wherein the first functional group in the first polymer is capable of bonding to a metal atom.

4. The pattern-forming method according to claim 1 , further comprising after the forming of the atom layer,

removing, by etching, the patterned coating film from the base together with the atom layer formed on the patterned coating film.

5. The pattern-forming method according to claim 1 , wherein the forming of the patterned coating film comprises:

applying a composition comprising the first polymer and a solvent on an entirety of a surface of the surface layer of the base to form a coating film; and

rinsing the base to remove a portion of the coating film formed on regions other than the part of the plurality of regions to form the patterned coating film.

6. The pattern-forming method according to claim 5 , further comprising heating the base, after the forming of the coating film and before the rinsing of the base, or after the rinsing of the base.

7. The pattern-forming method according to claim 5 , wherein the composition is applied on the surface by a spin coating.

8. The pattern-forming method according to claim 5 , wherein a main chain of the first polymer comprises a structural unit derived from a vinyl aromatic compound.

9. The pattern-forming method according to claim 8 , wherein the vinyl aromatic compound is a substituted or unsubstituted styrene.

10. The pattern-forming method according to claim 8 , wherein the vinyl aromatic compound is an unsubstituted styrene.

11. The pattern-forming method according to claim 1 , wherein the functional group is at least one selected from the group consisting of a cyano group, a sulfanyl group, an ethylenic carbon-carbon double bond-containing group, an oxazoline ring-containing group, a phosphoric acid group, an epoxy group, and a disulfide group.

12. The pattern-forming method according to claim 1 , wherein the functional group is at least one selected from the group consisting of a cyano group and a sulfanyl group.

13. The pattern-forming method according to claim 1 , wherein the vapor deposition is an atomic layer deposition.

14. The pattern-forming method according to claim 1 , wherein a main chain of the first polymer comprises a structural unit derived from a vinyl aromatic compound.

15. The pattern-forming method according to claim 14 , wherein the vinyl aromatic compound is a substituted or unsubstituted styrene.

16. The pattern-forming method according to claim 14 , wherein the vinyl aromatic compound is an unsubstituted styrene.

17. The pattern-forming method according to claim 1 , wherein the first polymer comprises, at the end of the main chain thereof, the group comprising a first functional group that is capable of bonding to an atom present in the part of the plurality of regions.

18. The pattern-forming method according to claim 1 , wherein the first polymer comprises, at the end of the side chain thereof, the group comprising a first functional group that is capable of bonding to an atom present in the part of the plurality of regions.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2020
From: OSAKI, HITOSHI; KMIEC, JEFFREY
To: JSR CORPORATION
Reel/Frame 053133/0738 →
Continuity (3)
Continuation PCTJP2019000375 · Jan 9, 2019
Provisional Application 62615547 · Jan 10, 2018
Related Publication 20200402789A1 · Dec 24, 2020