Apparatus and method for treating substrate

1. An apparatus for treating a substrate, the apparatus comprising:

a light treatment chamber having an interior space;

a support unit configured to support the substrate in the interior space; and

an irradiation unit disposed above the support unit and configured to irradiate light downward to the substrate in the interior space to remove organic matter remaining on the substrate,

wherein the irradiation unit includes:

a first light source configured to irradiate first light to the substrate;

a second light source configured to irradiate second light to the substrate, the second light having a different wavelength range from the first light,

the first light is disposed at a different height from the second light source,

the first light source having a wavelength of 300 nm to 1000 nm, and

the second light source having a wavelength of at least one of 185 nm, 254 nm, and 400 nm or more.

2. The apparatus of claim 1 , wherein

the irradiation unit further includes a third light source configured to irradiate the substrate, the third light source having a different wavelength range of 800 nm or more.

3. The apparatus of claim 2 , wherein the first light source is a flash lamp,

wherein the second light source is one of an infrared lamp and an ultraviolet lamp, and

wherein the third light source is the other of the infrared lamp and the ultraviolet lamp.

4. The apparatus of claim 1 , wherein the support unit includes:

a support plate configured to support the substrate; and

a lifting actuator configured to raise or lower the support plate.

5. The apparatus of claim 1 , wherein the support unit includes:

a support plate configured to support the substrate; and

a rotary actuator configured to rotate the support plate.

6. The apparatus of claim 1 , wherein the irradiation unit further includes a reflector configured to reflect the light irradiated by the irradiation unit toward a surface of the substrate supported on the support unit.

7. The apparatus of claim 1 , wherein the irradiation unit further includes a first cooling line through which a cooling fluid circulates to lower a temperature of a light source included in the irradiation unit.

8. The apparatus of claim 7 , wherein the light treatment chamber includes a second cooling line connected with the first cooling line, wherein the cooling fluid circulates through the second cooling line.

9. The apparatus of claim 1 , wherein the apparatus further comprises:

a supercritical chamber configured to treat the substrate with a supercritical fluid applied to the substrate;

a transfer unit configured to transfer the substrate between the supercritical chamber and the light treatment chamber; and

a controller, and

wherein the controller is configured to control the supercritical chamber, the transfer unit, and the light treatment chamber such that the substrate is treated in the supercritical chamber and the substrate treated in the supercritical chamber is transferred to the light treatment chamber.

10. The apparatus of claim 1 , wherein the apparatus further comprises:

a liquid treatment chamber configured to treat the substrate with an organic solvent applied onto the substrate;

a transfer unit configured to transfer the substrate between the liquid treatment chamber and the light treatment chamber; and

a controller, and

wherein the controller is configured to control the liquid treatment chamber, the transfer unit, and the light treatment chamber such that the substrate is treated in the liquid treatment chamber and the substrate treated in the liquid treatment chamber is transferred to the light treatment chamber.

11. The apparatus of claim 1 , wherein the apparatus further comprises:

an index module having a load port configured to have a carrier having the substrate received therein be mounted; and

a process module connected with the index module and configured to treat the substrate with an organic solvent, and

wherein the light treatment chamber is provided at the index module.

12. The apparatus of claim 11 , wherein the index module includes a front panel on which the load port is installed, a rear panel disposed to be opposite to the front panel, and side panels configured to connect the front panel and the rear panel when viewed from above, and

wherein the light treatment chamber is installed on one of the side panels.

13. The apparatus of claim 1 , wherein the first and second light sources configured to irradiate light have a bar shape, and

wherein the first and second light sources are alternately disposed over the support unit.

14. The apparatus of claim 1 , wherein the first and second light sources configured to irradiate light have a block shape, and

wherein the first and second light sources are arranged in a lateral direction and/or a longitudinal direction.

15. The apparatus of claim 14 , wherein the irradiation unit further includes a plate disposed over the support unit,

wherein the light sources having the block shape are provided on the plate so as to be detachable, and

wherein when viewed from above, the light sources are alternately mounted on the plate such that adjacent light sources differ from one another.

16. The apparatus of claim 15 , wherein the apparatus further comprises:

a buffer chamber configured to hold the substrate which is transferred into the buffer chamber after removal of organic matter in the light treatment chamber.

17. The apparatus of claim 16 , wherein the buffer chamber is provided under the light treatment chamber, and

the buffer chamber includes:

a plurality of slots for temporarily storing the substrate; and

a cooling line configured to lower a temperatures of the substrate.

18. An apparatus for treating a substrate, the apparatus comprising:

a light treatment chamber having an interior space;

a support unit configured to support the substrate in the interior space; and

an irradiation unit disposed above the support unit and configured to irradiate light downward to the substrate in the interior space to remove organic matter remaining on the substrate,

wherein the irradiation unit includes:

a first light source configured to irradiate first light to the substrate;

a second light source configured to irradiate second light to the substrate, the second light having a different wavelength range from the first light; and

a reflector configured to reflect the light irradiated by the irradiation unit toward a surface of the substrate supported on the support unit, wherein

the first light source is disposed at a different height from the second light source,

the reflector has a cylindrical shape, and

the reflector surrounds the first light source and the second light source.

19. The apparatus of claim 18 , wherein the first light source is one of a flash lamp, an infrared lamp, and an ultraviolet lamp, and

wherein the second light source is another one of the flash lamp, the infrared lamp, and the ultraviolet lamp.

20. The apparatus of claim 19 , wherein the first light source is the flash lamp, and

wherein the second light source is one of the infrared lamp and the ultraviolet lamp.