IP Library Granted Patent US 11,477,917
Granted Patent B2
US 11,477,917 · App. 16/925,626 · Granted Oct 18, 2022

Data center modular systems

Inventors: Pascal Kam (Union City, CA); Grace Wu (Santa Clara, CA); Saurin Purohit (Douglasville, GA); Kenneth Dale Shaul (Sunnyvale, CA); Siddharth Sheli (Fremont, CA); Thomas R. Kowalski (Santa Cruz, CA); Bruce Baxter (Hollister, CA); Jim O'Connor (Half Moon Bay, CA); Brandon Gries (Monona, WI); Gerard V. Gioia (West Chester, PA); Steven K. Bowman (Hillsborough, NC)
Assignee: Google LLC
H05K7/20745G06F1/20H05K7/1485H01R43/26
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Quick Facts
Patent No.
US 11,477,917
App. No.
16/925,626
Granted
Oct 18, 2022
Kind
B2
Abstract

A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to engage at least a portion of a rail assembly attached to a structure of a data center building; and a lower module attachable to the upper module and configured to suspend above a floor of a human-occupiable workspace of the data center that supports a plurality of racks including a plurality of heat-generating electronic devices, the lower module including a power support assembly configured to provide electrical power to the plurality of heat-generating electronic devices.

Claims (36)

1. A method of conditioning a data center comprising:

installing a first module of a data center cooling system on a rail assembly attached to a data center building, the first module comprising a frame and an air conditioning module;

attaching a second module of the data center cooling system to the first module, the second module comprising a panel attached to the frame of the first module and sides that vertically extend from the panel to suspend over a floor of the data center building and define a cold air plenum between rows of a plurality of data center racks; and

moving the first and second modules of the data center cooling system adjacent to the rows of the plurality of data center racks that support a plurality of heat-generating electronic server devices by moving the first module on the rail system through a human-occupiable aisle of a workspace of the data center building defined between rows of columns of the data center building.

2. The method of claim 1 , further comprising circulating a cooling fluid through a supply conduit, to the air conditioning module, that is supported by a third module of the data center cooling system attached to the first module.

3. The method of claim 1 , further comprising circulating, with a fan of the air conditioning module, an airflow from a cooling coil of the air conditioning module through an opening in the panel and into the cold air plenum defined by the panel and the sides of the second module.

4. The method of claim 3 , further comprising:

circulating the airflow through the plurality of data center racks;

receiving, into the airflow, heat from the plurality of heat-generating electronic server devices; and

circulating the heated airflow through the workspace of the data center building and to the cooling coil.

5. The method of claim 1 , wherein the data center cooling system comprises a first data center cooling system, the method further comprising:

installing at least another row of a plurality of data center racks that support a plurality of heat-generating electronic server devices into the data center building;

based on the installation of the at least another row of the plurality of data center racks, installing a first module of a second data center cooling system on the rail assembly attached to the data center building, the first module of the second data center cooling system comprising a frame and an air conditioning module;

attaching a second module of the second data center cooling system to the first module of the second data center cooling system, the second module of the second data center cooling system comprising a panel attached to the frame of the first module of the second data center cooling system and sides that extend from the panel to suspend over the floor of the data center building; and

moving the first and second modules of the second data center cooling system adjacent to the another row of the plurality of data center racks by moving the first module of the second data center cooling system on the rail system through the human-occupiable aisle of the workspace of the data center building defined between rows of columns of the data center building.

6. The method claim 5 , further comprising fluidly connecting the air conditioning modules of the first modules of the first and second data center cooling systems to a source of cooling fluid.

7. The method of claim 1 , further comprising electrically coupling the plurality of heat-generating electronic server devices to a main power supply through electrical conduits supported on the second module.

8. The method of claim 1 , wherein the data center cooling system comprises a first data center cooling system, the method further comprising:

adjusting a power density of at least a portion of the plurality of heat-generating electronic server devices;

based on the adjustment of the power density:

installing a first module of a second data center cooling system on the rail assembly attached to the data center building, the first module of the second data center cooling system comprising a frame and an air conditioning module;

attaching a second module of the second data center cooling system to the first module of the second data center cooling system, the second module of the second data center cooling system comprising a panel attached to the frame of the first module of the second data center cooling system and sides that extend from the panel to suspend over the floor of the data center building; and

moving the first and second modules of the second data center cooling system adjacent to the row of the plurality of data center racks by moving the first module of the second data center cooling system on the rail system through the human-occupiable aisle of the workspace of the data center building defined between rows of columns of the data center building; and

operating the first and second data center cooling systems to cool the plurality of heat-generating electronic server devices.

9. The method of claim 6 , further comprising electrically coupling the plurality of heat-generating electronic server devices to a main power supply through electrical conduits supported on the second module.

10. The method of claim 1 , further comprising fluidly connecting the air conditioning module of the first module of the data center cooling systems to a source of cooling fluid.

11. The method of claim 10 , wherein the source of cooling fluid comprises at least one of a chiller plant, an evaporative cooling system, a body of water.

12. The method of claim 11 , wherein the cooling fluid comprises at least one of chilled water, chilled glycol, or condenser water.

13. The method of claim 1 , further comprising illuminating at least a portion of the data center building with a lighting system.

14. The method of claim 13 , further comprising supporting lighting equipment of the lighting system with an accessory module that is coupled to the first module.

15. The method of claim 14 , further comprising supporting a plurality of cooling fluid conduits on the accessory module.

16. The method of claim 14 , further comprising positioning the accessory module in the data center building above the first module.

17. The method of claim 8 , further comprising illuminating at least a portion of the data center building with a lighting system.

18. The method of claim 17 , further comprising supporting lighting equipment of the lighting system with an accessory module that is coupled to the first module of either of the first or second data center cooling systems.

19. The method of claim 18 , further comprising supporting a plurality of cooling fluid conduits on the accessory module.

20. The method of claim 18 , further comprising positioning the accessory module in the data center building above the first module of either of the first or second data center cooling systems.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: GIOIA, GERARD V.; BOWMAN, STEVEN K.
To: JACOBS ENGINEERING GROUP
Reel/Frame 053689/0055 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: KAM, PASCAL; WU, GRACE; PUROHIT, SAURIN; SHAUL, KENNETH DALE; SHELI, SIDDHARTH; KOWALSKI, THOMAS R.
To: GOOGLE INC.
Reel/Frame 053689/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: BAXTER, BRUCE; O'CONNOR, JIM; GRIES, BRANDON
To: CUPERTINO ELECTRIC, INC.
Reel/Frame 053689/0581 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: JACOBS ENGINEERING GROUP
To: GOOGLE INC.
Reel/Frame 053689/0688 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: CUPERTINO ELECTRIC, INC.
To: GOOGLE INC.
Reel/Frame 053689/0802 →
CHANGE OF NAME Recorded Sep 3, 2020
From: GOOGLE INC.
To: GOOGLE LLC
Reel/Frame 053702/0912 →
Continuity (3)
Continuation 15653973 · Jul 19, 2017
Provisional Application 62364161 · Jul 19, 2016
Related Publication 20200344917A1 · Oct 29, 2020