High-temperature and/or high pressure gas enclosure
A gas enclosure can include a refractory metal liner; a ceramic matrix composite cladding; and a diffusion barrier layer. The refractory metal liner is adapted to surround and enclose a gas to be contained within the gas enclosure. The diffusion barrier layer is disposed between the refractory metal liner and the ceramic matrix composite cladding.
1. A gas enclosure, comprising:
a refractory metal liner adapted to surround and enclose a gas to be contained;
a ceramic matrix composite cladding; and
a diffusion barrier layer disposed between the refractory metal liner and the ceramic matrix composite cladding.
2. The gas enclosure of claim 1 , further comprising a corrosion protection layer disposed on the refractory metal liner and arranged on a surface of the refractory metal liner opposite the diffusion barrier layer.
3. The gas enclosure of claim 2 , wherein the corrosion protection layer comprises one or more of Al 2 O 3 , Y 2 O 3 , ZrO 2 , TiO 2 , SiO 2 , Cr 2 O 3 , ZrN, TiN, AlN, SiN, ZrC, TiC, SiC, NbC, TiAlC, ZrTiC, FeAl, FeAl 2 , Fe 2 Al 5 , ZrAl 3 , MoSi 2 , NbSi 2 , Si, (ZrO 2 .SiO 2 ), (ZrO 2 .xY 2 O 3 ).
4. The gas enclosure of claim 2 , wherein the gas to be enclosed is a reactive gas.
5. The gas enclosure of claim 2 , wherein the corrosion protection layer comprises alternating layers of a ceramic material and a metal material.
6. The gas enclosure of claim 1 , wherein the refractory metal liner comprises one or more of Ti, Nb, Mo, Ta, W, Re, and laminates, and alloys thereof.
7. The gas enclosure of claim 1 , wherein the refractory metal liner has a thickness of about 100 μm to about 500 μm.
8. The gas enclosure of claim 1 , wherein the diffusion barrier layer comprises one or more of Al 2 O 3 , Y 2 O 3 , ZrO 2 , TiO 2 , SiO 2 , Cr 2 O 3 , ZrN, TiN, AlN, SiN, ZrC, TiC, SiC, NbC, TiAlC, ZrTiC, FeAl, FeAl 2 , Fe 2 Al 5 , ZrAl 3 , MoSi 2 , NbSi 2 , Si, (ZrO 2 .SiO 2 ), (ZrO 2 .xY 2 O 3 ).
9. The gas enclosure of claim 1 , wherein the diffusion barrier layer is deposited by atomic layer deposition, physical vapor deposition, chemical vapor deposition, surface reaction coating, electroplating, and cold/hot spraying.
10. The gas enclosure of claim 9 , wherein the diffusion barrier layer is deposited by atomic layer deposition.
11. The gas enclosure of claim 1 , wherein the diffusion barrier layer comprises alternating layers of a ceramic material and a metal material.
12. The gas enclosure of claim 1 , wherein the diffusion barrier layer is substantially free of oxides.
13. The gas enclosure of claim 1 , wherein the ceramic matrix composite cladding comprises one or more of SiC, C, Al 2 O 3 , Al 2 O 3 SiO 2 , SiN 3 N 4 , SiC/SiC, C/SiC, C/C, SiC/C, Al 2 O/Al 2 O 3 , and laminates and multilayers thereof.
14. The gas enclosure of claim 1 , wherein the ceramic matrix composite cladding has a thickness of about 100 μm to about 2000 μm.
15. The gas enclosure of claim 1 , wherein the gas enclosure is operable at temperatures in excess of 700° C. without cracking or spalling.
16. The gas enclosure of claim 1 , wherein the gas enclosure is operable at temperatures up to 1400° C.
17. The gas enclosure of claim 1 , wherein the gas to be enclosed is one or more of He, Ne, Ar, Kr, Xe, CO 2 , H 2 , and O 2 .
18. The gas enclosure of claim 1 , further comprising a high-conductivity joining layer disposed on an exterior surface of the ceramic matrix composite cladding.
19. A micro-reactor, comprising the gas enclosure of claim 1 enclosing a cooling gas.
20. A coolant channel comprising the gas enclosure of claim 1 .