Method of manufacturing light-emitting device, light-emitting device, element mounting wiring board

1. A method of manufacturing a light-emitting device, the method comprising:

providing a wiring board that comprises:

a substrate, and

a wiring pattern comprising:

a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and

a plating layer having a groove that surrounds the first region;

mounting the light-emitting element in the first region;

supplying a first resin that contains a first reflective material into the groove;

forming a first covering member, which comprises sedimenting the first reflective material contained in the first resin by applying a centrifugal force to the first resin, such that at least a portion of the first covering member is located in the groove and comprises:

a reflective material containing layer containing the first reflective material, and

a light-transmissive layer formed above the reflective material containing layer; and

forming a light-transmissive member on the first covering member and the light-emitting element.

2. The method of manufacturing the light-emitting device according to claim 1 , wherein:

the step of providing the wiring board comprises providing a package that has a recess defined by an upward-facing surface of the substrate and a lateral surface of a lateral wall that surrounds the upward-facing surface; and

the method comprises, before the step of supplying the first resin, forming a second covering member by continuously covering from the lateral surface defining the recess to a portion of an upper surface of the plating layer with a second resin.

3. The method of manufacturing the light-emitting device according to claim 2 , wherein the package is a ceramic package.

4. The method of manufacturing the light-emitting device according to claim 1 , wherein, in the step of providing the wiring board, the wiring board is provided such that a width of the gap portion is one time or more and less than twice a thickness of the plating layer.

5. The method of manufacturing the light-emitting device according to claim 1 , wherein, in the step of providing the wiring board, the wiring board is provided such that a thickness of the plating base layer is 5 μm or more and 20 μm or less.

6. The method of manufacturing the light-emitting device according to claim 1 , wherein, in the step of mounting the light-emitting element, the light-emitting elements is mounted such that the groove is formed directly below a lateral surface of the light-emitting element.

7. The method of manufacturing the light-emitting device according to claim 1 , wherein, in the step of forming the first covering member, the first resin is cured while the centrifugal force is applied to the first resin.

8. The method of manufacturing the light-emitting device according to claim 7 , wherein, in the step of forming the first covering member, the first resin is cured at a temperature of 40° C. or higher and 200° C. or lower.

9. The method of manufacturing the light-emitting device according to claim 1 , wherein a viscosity of the first resin is 0.3 Pa·s or more and 15 Pa·s or less.

10. The method of manufacturing the light-emitting device according to claim 1 , wherein the step of supplying the first resin comprises preparing the first resin by mixing a base component of a two-part curable resin material with the first reflective material, and, after two or more hours have passed, mixing a hardener with the base component.

11. The method of manufacturing the light-emitting device according to claim 1 , wherein the step of providing the wiring board comprises:

forming the plating base layer on the substrate, and

forming the groove of the plating layer at the gap portion by forming the plating layer on the plating base layer.