Data storage system connectors with parallel array of dense memory cards and high airflow
Data storage system connectors are described for a parallel array of dense memory cards that allow high airflow. In one example, a connector has a horizontal plane board having a plurality of memory connectors aligned in a row and a plurality of external interfaces, a plurality of memory cards, each having an edge connector at one end of the memory card to connect to a respective memory connector of the board, each memory card extending horizontally parallel to each other memory card and extending vertically and orthogonally from the board, and a plurality of interface connectors each to connect an edge connector to a respective board connector, the interface connectors extending horizontally from the one end of the memory cards and vertically to the respective plane board connector.
1. An apparatus comprising:
a printed circuit board (PCB);
a plurality of connectors aligned in a row and mounted on the PCB, each of the plurality of connectors including a slot extending orthogonally from the PCB, the slot including electrical contacts; and
a plurality of solid state drive (SSD) cards, each of the plurality of SSD cards having a connector at one end of the SSD card to be received by the slot of one of the plurality of connectors mounted on the PCB;
wherein the slot of each of the plurality of connectors is to receive the connector of one of the plurality of the SSD cards in a direction parallel to the PCB, each of the plurality of SSD cards to extend parallel to one another and to extend vertically from the PCB.
2. The apparatus of claim 1 , further comprising:
a chassis, wherein the PCB is mounted in the chassis.
3. The apparatus of claim 2 , further comprising:
a plurality of fans in the chassis to pull air from a front of the chassis to a rear of the chassis.
4. The apparatus of claim 3 , wherein:
the plurality of fans are mounted between the plurality of SSD cards and a rear of the chassis.
5. The apparatus of claim 2 , wherein:
the chassis includes a bottom plate to hold the plurality of SSD cards parallel to one another.
6. The apparatus of claim 2 , wherein:
the chassis includes a 1 U height rack chassis.
7. The apparatus of claim 1 , wherein:
one or more of the plurality of SSD cards include a printed circuit board (PCB) and memory chips mounted on the PCB of the SSD card.
8. The apparatus of claim 7 , wherein:
the memory chips include one or more of: 3D NAND flash memory, PCM (Phase Change Memory), STTM (Spin Transfer Torque Memory), magnetic memory, and polymer memory.
9. The apparatus of claim 7 , further comprising:
a memory controller mounted on the PCB of the SSD card.
10. The apparatus of claim 1 , wherein:
each of the plurality of SSD cards includes a first edge, a second edge that is shorter than the first edge, and a thickness that is less than a length of the second edge, the first edge to extend parallel to the PCB and the second edge to extend orthogonally from the PCB.
11. The apparatus of claim 1 , wherein:
the plurality of SSD cards includes 32 SSD cards.
12. A system comprising:
a rack-mount chassis having a 1 U height;
a printed circuit board (PCB) in the rack-mount chassis;
a plurality of connectors aligned in a row and mounted on the PCB, each of the plurality of connectors including a slot extending orthogonally from the PCB, the slot including electrical contacts; and
a plurality of solid state drives (SSDs), each of the plurality of SSDs having a connector at one end of the SSD to be received by the slot of one of the plurality of connectors mounted on the PCB;
wherein the slot of each of the plurality of connectors is to receive the connector of one of the plurality of the SSDs in a direction parallel to the PCB, each of the plurality of SSDs to extend parallel to one another and to extend vertically from the PCB.
13. The system of claim 12 , further comprising:
one or more processors.
14. The system of claim 12 , wherein:
one or more of the plurality of SSDs include a printed circuit board (PCB) and memory chips mounted on the PCB of the SSD.
15. The system of claim 14 , wherein:
the memory chips include one or more of: 3D NAND flash memory, PCM (Phase Change Memory), STTM (Spin Transfer Torque Memory), magnetic memory, and polymer memory.
16. The system of claim 14 , further including:
a memory controller mounted on the PCB of the SSD.
17. The system of claim 12 , wherein:
each of the plurality of SSDs includes a first edge, a second edge that is shorter than the first edge, and a thickness that is less than a length of the second edge, the first edge to extend parallel to the PCB and the second edge to extend orthogonally from the PCB.
18. The system of claim 12 , further comprising:
a plurality of fans in the chassis to pull air from a front of the rack-mount chassis to a rear of the chassis.
19. The system of claim 18 , wherein:
the plurality of fans are mounted between the plurality of SSDs and a rear of the rack-mount chassis.
20. The system of claim 12 , wherein:
the rack-mount chassis includes a bottom plate to hold the plurality of SSDs parallel to one another.
21. The system of claim 12 , wherein:
the plurality of SSDs includes 32 SSDs.