Acoustoelectric amplification in resonant piezoelectric-semiconductor cavities
View Patent ↗Interaction of acoustic waves in a piezoelectric-semiconductor resonant cavity with the charge carriers in the semiconductor layer can be directed toward amplification of the acoustic waves; such amplification scheme can be applied in building unilateral amplifiers, zero loss filters, oscillators, high detection range circuit-less wireless sensors, isolators, duplexers, circulators and other acoustic devices. An apparatus for acoustoelectric amplification is described. The apparatus includes a semiconductor layer and a thin piezoelectric layer bonded (or deposited) onto the semiconductor layer forming an acoustic cavity. Two or more tethers forming a current conduction path through the semiconductor layer and two or more access pads to silicon are positioned on two ends of the acoustic cavity and configured to inject a DC current in the semiconductor layer.
1. An apparatus for acoustoelectric amplification, the apparatus comprising:
a semiconductor layer;
a thin piezoelectric layer bonded onto a top surface of the semiconductor layer and forming an acoustic cavity;
at least two radio frequency (RF) signal access ports (RF 1 and RF 2 ), electrically coupled to the thin piezoelectric layer, each of the at least two RF signal access ports including a plurality of interdigital transducers (IDTs) formed by a plurality of interdigital fingers, each of the plurality of interdigital fingers coupled to one of the at least two RF signals access ports (RF 1 and RF 2 ) and ground (GND), and configured to input and detect RF signals within the thin piezoelectric layer forming said acoustic cavity; and
at least two DC current coupling pads (DC 1 and DC 2 ), electrically coupled to the semiconductor layer and electrically isolated from the at least two RF signal access ports (RF 1 and RF 2 ), and configured for coupling to a source of DC current, the at least two DC current coupling pads (DC 1 and DC 2 ) configured for injecting a DC current form the source of a DC current into the semiconductor layer.
2. The apparatus of claim 1 , wherein the thin piezoelectric layer comprises at most 1.5 μm lithium niobate (LiNbO3) and the semiconductor layer comprises at most 3 μm of lightly doped n-type silicon (Si).
3. The apparatus of claim 1 , wherein the at least two DC current coupling pads are configured to inject the DC current mainly in parallel with a direction of acoustic wave propagation in the semiconductor layer.
4. An apparatus for acoustoelectric amplification, the apparatus comprising:
a semiconductor layer;
a thin piezo-electric layer deposited onto the semiconductor layer and forming an acoustic cavity;
at least two tethers forming a current conduction path through the semiconductor layer; and
at least two access pads electronically coupled to the semiconductor layer wherein at least one of the at least two access pads is electrically isolated from at least one radio frequency (RF) access port, thereby limiting the current conduction path through the semiconductor layer.
5. The apparatus of claim 4 , wherein the thin piezoelectric layer comprises at most 1.5 μm lithium niobate (LiNbO3) and the semiconductor layer comprises at most 3 μm of lightly doped n-type Si.
6. The apparatus of claim 4 , wherein the at least two access pads are configured to inject the DC current mainly in parallel with a direction of acoustic wave propagation in the semiconductor layer.
7. An apparatus for acoustoelectric amplification, the apparatus comprising:
a semiconductor layer having a current isolation trench, the current isolation trench configured for confining current in a suspended structure;
a thin piezoelectric layer, bonded onto the semiconductor layer and forming an acoustic cavity within the suspended structure;
a plurality of pairs of interdigital transducers (IDT), disposed on the thin piezoelectric layer forming the acoustic cavity, and configured to excite and detect radio frequency signals within the thin piezoelectric layer forming the acoustic cavity; and
at least two access pads, electrically coupled to the semiconductor layer and positioned on two ends of the cavity and configured for coupling to a DC current source, and configured to inject a DC current in the semiconductor layer within the suspended acoustic cavity.
8. The apparatus of claim 7 , wherein the plurality of pairs of IDTs are configured to result in unidirectional acoustic wave generation.
9. The apparatus of claim 7 , wherein a physical distance forming a physical separation between a first input and a second output interdigital transducer pair of the plurality of pairs of interdigital transducers define at least one acoustic delay line (ADL) within the suspended structure.
10. The apparatus of claim 9 , wherein the at least two access pads are configured to inject the DC current into the at least one ADL.
11. The apparatus of claim 7 , wherein the semiconductor layer is a lightly n-type doped (100) SOI wafer.
12. The apparatus of claim 7 , wherein the plurality of pairs of IDTs comprise one of a molybdenum (Mo), gold or aluminum layer.
13. The apparatus of claim 12 , wherein the molybdenum (Mo), gold or aluminum layer is approximately 50 to 200 nm thick.
14. The apparatus of claim 7 , wherein the plurality of pairs of IDTs have a finger pitch that is at least equal to the thickness of the suspended structure.
15. The apparatus of claim 7 , wherein the plurality of pairs of IDTs are separated by a physical distance defining a delay region, forming a traveling wave filter.
16. The apparatus of claim 15 , wherein the delay region comprises a length of at least 200 μm to at most 4 mm.
17. The apparatus of claim 7 , wherein the apparatus is configured to receive separate bias voltages to the plurality of pairs of IDTs in order to modify carrier concentration in the semiconductor layer, enabling adjusting of acoustoelectric amplification and nonreciprocity.