Semiconductor package and method of manufacturing the same
A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.
1. A semiconductor package, comprising:
a first substrate, having a first surface and a second surface opposite to the first surface;
a second substrate, having a first surface facing the second surface of the first substrate, wherein the first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate;
a barrier structure disposed adjacent to the first surface of the first substrate;
a first molding layer disposed between the first substrate and the second substrate, wherein the first molding layer extends from the first surface of the second substrate to the first surface of the first substrate and covers at least a portion of the first surface of the first substrate; and
a second molding layer disposed adjacent to the first surface of the first substrate,
wherein the first molding layer connects to the second molding layer at an interface, wherein the interface is within the range from the first surface of the first substrate to a top portion of the barrier structure.
2. The semiconductor package of claim 1 , wherein the barrier structure surrounds an electrical connection area of the first surface of the first substrate.
3. The semiconductor package of claim 1 , wherein the first molding layer extends from the first surface of the second substrate to a side surface of the first substrate.
4. The semiconductor package of claim 1 , wherein the first molding layer reaches the barrier structure.
5. The semiconductor package of claim 1 , wherein the first substrate has a projection area smaller than that of the second substrate.
6. The semiconductor package of claim 5 , wherein the interface is within the range from the second surface of the first substrate to the top portion of the barrier structure.
7. The semiconductor package of claim 1 , further comprising a recess disposed adjacent to the first surface of the first substrate and adjacent to the barrier structure.
8. The semiconductor package of claim 7 , wherein the barrier structure surrounds the recess.
9. The semiconductor package of claim 1 , wherein a side surface of the first substrate and a side surface of the second substrate are exposed from the first molding layer.
10. The semiconductor package of claim 1 , wherein the interface is substantially equal to or below the barrier structure.
11. The semiconductor package of claim 1 , further comprising a first electronic component disposed adjacent to the second surface of the first substrate and a second electronic component disposed adjacent to the first surface of the first substrate.
12. The semiconductor package of claim 1 , wherein the barrier structure is disposed adjacent to an edge of the first substrate.
13. The semiconductor package of claim 1 , wherein the barrier structure is disposed along an edge of the first substrate.
14. The semiconductor package of claim 1 , wherein the barrier structure comprises a plurality of walls toward the same direction.
15. The semiconductor package of claim 1 , wherein the barrier structure is a single wall.
16. The semiconductor package of claim 7 , wherein the recess is disposed between the barrier structure and an electrical connection area of the first surface of the first substrate.