Enhanced sensor alignment

1. A device comprising processing circuitry coupled to storage, wherein the processing circuitry is configured to:

determine a first array of displacement sensors proximate to a first test structure;

determine a second array of displacement sensors proximate to a second test structure;

apply a test condition to the first array, the second array, the first test structure, and the second test structure;

collect a first output from applying the test condition to the first test structure;

collect a second output from applying the test condition to the second test structure;

generate a first deviation vector by comparing the first output to a reference vector, wherein the reference vector is obtained by applying the test condition to a reference structure and representing a movement of the reference structure as the reference vector, and wherein the test condition is applied to the reference structure separately from testing the first test structure and the second test structure;

generate a second deviation vector by comparing the second output to the reference vector;

determine a first design status of the first structure based on the first deviation vector; and

determine a second design status of the second structure based on the second deviation vector.

2. The device of claim 1 , wherein the first test structure is a first stereo camera and the second test structure is a second stereo camera.

3. The device of claim 1 , wherein the first array and the first test structure are disposed at a first distance from each other allowing no contact between the first array and the first test structure.

4. The device of claim 1 , wherein the first design status or the second design status is at least one of a failed alignment or a successful alignment between the first structure and the second structure.

5. The device of claim 1 , wherein the first design status indicates a failed alignment when a comparison between the first structure and the reference structure results in a difference that is below an alignment threshold.

6. The device of claim 1 , wherein the first design status indicates a successful alignment when a comparison between the first structure and the reference structure results in a difference that is below an alignment threshold.

7. The device of claim 1 , wherein the first output and the second output are rotational measurements.

8. The device of claim 1 , wherein the test condition is vibration or thermal shock.

9. The device of claim 1 , wherein the first array and the second array have minimal displacement when subjected to the test condition.

10. A method comprising:

determining, by a processor, a first array of displacement sensors proximate to a first test structure;

determining a second array of displacement sensors proximate to a second test structure;

applying a test condition to the first array, the second array, the first test structure, and the second test structure;

collecting a first output from applying the test condition to the first test structure;

collecting a second output from applying the test condition to the second test structure;

generating a first deviation vector by comparing the first output to a reference vector, wherein the reference vector is obtained by applying the test condition to a reference structure and representing a movement of the reference structure as the reference vector, and wherein the test condition is applied to the reference structure separately from testing the first test structure and the second test structure;

generating a second deviation vector by comparing the second output to the reference vector;

determining a first design status of the first structure based on the first deviation vector; and

determining a second design status of the second structure based on the second deviation vector.

11. The method of claim 10 , wherein the first array and the first test structure are disposed at a first distance from each other allowing no contact between the first array and the first test structure.

12. The method of claim 10 , wherein the first design status or the second design status is at least one of a failed alignment or a successful alignment between the first structure and the second structure.

13. The method of claim 10 , wherein the first design status indicates a failed alignment when a comparison between the first structure and the reference structure results in a difference that is below an alignment threshold.

14. The method of claim 10 , wherein the first design status indicates a successful alignment when a comparison between the first structure and the reference structure results in a difference that is below an alignment threshold.

15. A system, comprising:

at least one memory that stores computer-executable instructions; and

at least one processor configured to access the at least one memory and execute the computer-executable instructions to:

determine a first array of displacement sensors proximate to a first test structure;

determine a second array of displacement sensors proximate to a second test structure;

apply a test condition to the first array, the second array, the first test structure, and the second test structure;

collect a first output from applying the test condition to the first test structure;

collect a second output from applying the test condition to the second test structure;

generate a first deviation vector by comparing the first output to a reference vector, wherein the reference vector is obtained by applying the test condition to a reference structure and representing a movement of the reference structure as the reference vector, and wherein the test condition is applied to the reference structure separately from testing the first test structure and the second test structure;

generate a second deviation vector by comparing the second output to the reference vector;

determine a first design status of the first structure based on the first deviation vector; and

determine a second design status of the second structure based on the second deviation vector.

16. The device of claim 1 , wherein the first output comprises measurements in the form of pitch, yaw, and roll corresponding to the first test structure, and the second output comprises measurements in the form of pitch, yaw, and roll corresponding to the second test structure.

17. The device of claim 1 , wherein the first array of displacement sensors and the second array of displacement sensors are linear non-contact type sensors.

18. The method of claim 10 , wherein the first output comprises measurements in the form of pitch, yaw, and roll corresponding to the first test structure, and the second output comprises measurements in the form of pitch, yaw, and roll corresponding to the second test structure.

19. The method of claim 10 , wherein the first array of displacement sensors and the second array of displacement sensors are linear non-contact type sensors.

20. The system of claim 15 , wherein the first output comprises measurements in the form of pitch, yaw, and roll corresponding to the first test structure, and the second output comprises measurements in the form of pitch, yaw, and roll corresponding to the second test structure.