Shielded electronic package and method of fabrication

1. An electronic device package comprising:

a substrate;

a first die coupled to the substrate;

a second die coupled with the first die;

a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element; and

an electrically conductive shield overlying the stacked structure, the electrically conductive shield having a first end physically coupled to the spacer element and a second end physically coupled to the substrate; and

a molding compound encapsulating the substrate, the stacked structure, and the electrically conductive shield;

wherein the device package further comprises one or both of: an electrically nonconductive fastener coupling the first end of the electrically conductive shield to the spacer element; and an electrically conductive fastener coupling the second end of the electrically conductive shield to the substrate.

2. The electronic device package of claim 1 wherein:

the first die has a first active surface and a first bond pad formed on the first active surface;

the second die has a second bond pad has a second active surface and a second bond pad formed on the second active surface; and

the electronic device package further comprises a bond wire electrically interconnecting the first and second bond pads, wherein the electrically conductive shield additionally overlies the bond wire.

3. The electronic device package of claim 2 wherein:

the spacer element is characterized by a first height above the second active surface of the second die; and

the bond wire extends to a second height above the second active surface of the second die, the second height being less than the first height.

4. The electronic device package of claim 1 wherein the spacer element is electrically insulated from the first and second dies.

5. The electronic device package of claim 1 wherein the substrate comprises a lead frame, the first die is coupled to a die pad of the lead frame, and the second end of the electrically conductive shield is electrically coupled to the die pad.

6. The electronic device package of claim 5 further comprising a bond wire electrically interconnecting the first and second dies, wherein the electrically conductive shield overlies the bond wire and the die pad extends beneath the bond wire such that the bond wire is interposed between the electrically conductive shield and the die pad.

7. The electronic device package of claim 1 wherein the substrate includes a ground terminal, and the second end of the electrically conductive shield is electrically coupled to the ground terminal.

8. The electronic device package of claim 1 wherein the second end of the electrically conductive shield is adjacent to a first portion of an outer perimeter of the first die, and the electrically conductive shield is a cantilevered structure such that the electrically conductive shield is not adjacent to a remaining portion of the outer perimeter of the first die.

9. The electronic device package of claim 1 wherein the electrically conductive shield does not overlie a remainder of the substrate.

10. The electronic device package of claim 1 wherein:

the first die has a bond pad; and

the electronic device package further comprises a bond wire interconnected between the bond pad and a bond site on the substrate, wherein the bond site is displaced away from the stacked structure and the electrically conductive shield does not overlie the bond site.

11. A method of fabricating an electronic device package comprising:

coupling a first die to the substrate;

coupling a second die with the first die;

coupling a spacer element to the second die to form a stacked structure that includes the first die, the second die, and the spacer element;

physically coupling a first end of an electrically conductive shield to the spacer element;

physically coupling a second end of the electrically conductive shield to the substrate such that the electrically conductive shield overlies the stacked structure; and

encapsulating the substrate, the stacked structure, and the electrically conductive shield within a molding compound;

wherein the method further comprises one or both of:

using an electrically nonconductive material to couple the first end of the electrically conductive shield to the spacer element; and

using an electrically conductive material to couple the second end of the electrically conductive shield to the substrate.

12. The method of claim 11 wherein the first die has a first active surface and a first bond pad formed on the first active surface, the second die has a second bond pad has a second active surface and a second bond pad formed on the second active surface and the method further comprises electrically interconnecting the first and second bond pads via a bond wire such that the electrically conductive shield additionally overlies the bond wire.

13. The method of claim 12 wherein the spacer element is characterized by a first height above the second active surface of the second die, and the bond wire extends to a second height above the second active surface of the second die following the electrically interconnecting the first and second bond pads, the second height being less than the first height.

14. An electronic device package comprising:

a substrate;

a first die coupled to the substrate, the first die having a first active surface and a first bond pad formed on the first active surface;

a second die coupled with the first die, the second die having a second active surface and a second bond pad formed on the second active surface;

a spacer element coupled to the second active surface of the second die to form a stacked structure that includes the first die, the second die, and the spacer element, the spacer element being characterized by a first height above the second active surface;

a bond wire electrically interconnecting the first and second bond pads, the second bond wire extending to a second height above the second active surface of the second die, the second height being less than the first height;

an electrically conductive shield overlying the stacked structure and the bond wire, the electrically conductive shield having a first end physically coupled to the spacer element and a second end physically coupled to the substrate;

a molding compound encapsulating the substrate, the stacked structure, the bond wire, and the electrically conductive shield; and

one or both of: an electrically nonconductive fastener coupling the first end of the electrically conductive shield to the spacer element; and an electrically nonconductive fastener coupling the second end of the electrically conductive shield to the substrate.

15. An electronic device package comprising:

a substrate;

a first die coupled to the substrate;

a second die coupled with the first die;

a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element; and

an electrically conductive shield overlying the stacked structure, the electrically conductive shield having a first end physically coupled to the spacer element with an electrically non-conductive fastener and a second end physically coupled to the substrate.

16. A method of fabricating an electronic device package comprising:

coupling a first die to the substrate;

coupling a second die with the first die;

coupling a spacer element to the second die to form a stacked structure that includes the first die, the second die, and the spacer element;

physically coupling a first end of an electrically conductive shield to the spacer element utilizing an electrically nonconductive material; and

physically coupling a second end of the electrically conductive shield to the substrate such that the electrically conductive shield overlies the stacked structure.