Method of forming a thin film using a surface protection material
Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.
1. A method of forming a thin film using a surface protection material, the method comprising:
supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate;
discharging unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber;
supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate;
discharging unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber; and
supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film,
wherein the surface protection material is represented by the following Chemical Formula 1:
wherein n is 1 or 2, and X is selected from the CH 2 , O, S, NH, and R is selected from an alkyl group having 1 to 5 carbon atoms.
2. The method of claim 1 , wherein the surface protection material is represented by the following Chemical Formula 3:
3. The method of claim 1 , wherein the reaction material is selected from water vapor (H 2 O), oxygen (O 2 ) and ozone (O 2 ).
4. The method of claim 1 , wherein the metal precursor is a compound including at least one of a trivalent metal containing Al, a tetravalent metal containing Zr or Hf, and a pentavalent metal containing Nb or Ta.
5. A method of forming a thin film using a surface protection material, the method comprising:
supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate;
discharging unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber;
supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate;
discharging unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber; and
supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film,
wherein the surface protection material is represented by the following Chemical Formula 2:
wherein n is 1 or 2, and X is selected from the CH 2 , O, S, NH, and R is selected from an alkyl group having 1 to 5 carbon atoms.
6. The method of claim 5 , wherein the surface protection material is represented by the following Chemical Formula 4:
7. The method of claim 5 , wherein the reaction material is selected from water vapor (H 2 O), oxygen (O 2 ) and ozone (O 3 ).
8. The method of claim 5 , wherein the metal precursor is a compound including at least one of a trivalent metal containing Al, a tetravalent metal containing Zr or Hf, and a pentavalent metal containing Nb or Ta.