Electronic component and method for manufacturing an electronic component
The electronic component comprises at least a first electronic element arranged inside a first casing of magnetic material and at least a second electronic element arranged inside a second casing of magnetic material. At least a first outer surface of the first casing and at least a second outer surface of the second casing are connected to each other with a non-magnetic layer and with at least one connection support. The connection support is adapted to be tension-resistant and is adapted and arranged such that the connection support substantially completely prevents an increase in a distance between the first outer surface and the second outer surface upon heating the non-magnetic layer.
1. Electronic component comprising
at least a first electronic element arranged inside a first casing of magnetic material,
at least a second electronic element arranged inside a second casing of magnetic material, the second casing being separate from, and external to, the first casing, wherein
at least a first outer surface of the first casing and at least a second outer surface of the second casing are connected to each other with a non-magnetic layer and with at least one connection support,
wherein the connection support is adapted to be tension-resistant and is adapted and arranged such that the connection support substantially completely prevents an increase in a distance between the first outer surface and the second outer surface upon heating the non-magnetic layer.
2. Electronic component according to claim 1 , wherein
the connection support is adapted to be compression-resistant and is adapted and arranged such that at least the connection support substantially completely prevents a reduction in the distance between the first outer surface and the second outer surface upon cooling the non-magnetic layer.
3. Electronic component according to claim 1 , wherein
the connection support is adapted to be torsion-resistant and/or
the first outer surface and the second outer surface are connected together with at least two connection supports having a distance from each other.
4. Electronic component according to claim 1 , wherein
the connection support is formed as a material strip of sheet metal or plastic,
wherein the material strip has a length which is greater than its width and wherein the material strip is embedded with a first longitudinal end of the material strip in the first casing and is embedded with a second longitudinal end of the material strip in the second casing.
5. Electronic component according to claim 1 , wherein
the connection support is electrically conductive and
the connection support electrically connects the first electronic element to the second electronic element.
6. Electronic component according to claim 1 , wherein
the first casing and/or the second casing are prism-shaped or cylindrical, in particular with a triangular, square or circular cross-section.
7. Electronic component according to claim 1 , wherein
the first casing and/or the second casing comprise at least an electrical contact on at least one outer surface.
8. Electronic component according to claim 1 , wherein
the first casing and the second casing are arranged side by side.
9. Electronic component according to claim 1 , wherein
the first casing and the second casing are arranged one above the other.
10. Electronic component according to claim 1 , comprising
at least a third electronic element arranged inside a third casing of magnetic material,
wherein the first casing and the second casing are arranged side by side and the third casing is arranged above the first casing and/or above the second casing.
11. Electronic component according to claim 1 , wherein
the non-magnetic layer has a thickness of at least 0.1 mm.
12. Electronic component according to claim 1 , wherein
the non-magnetic layer comprises an epoxy.
13. Method for manufacturing an electronic component according to claim 1 , comprising the step:
embedding section by section of the connection support into the first casing, the second casing and/or the third casing.
14. Method according to claim 13 , wherein
the embedding takes place during the production of the first casing, the second casing and/or the third casing.
15. Method according to claim 13 , wherein the at least one connection support is part of a lead frame for providing electrical contacts of the electronic component and wherein the method comprises the step:
at least partially embedding of the lead frame in the first casing, the second casing and/or the third casing.
16. Method according to claim 15 , comprising the step:
separation of the connection support and/or the electrical contacts from the lead frame.
17. An electronic component, comprising
at least a first electronic element arranged inside a first casing of magnetic material,
at least a second electronic element arranged inside a second casing of magnetic material, the second casing being separate from, and external to, the first casing, wherein
at least a first outer surface of the first casing and at least a second outer surface of the second casing are connected to each other with a non-magnetic layer and with at least one connection support,
wherein the connection support is adapted to be tension-resistant and is adapted and arranged such that the connection support substantially completely prevents an increase in a distance between the first outer surface and the second outer surface upon heating the non-magnetic layer,
further wherein the connection support penetrates or pierces the non-magnetic layer.